Electrode, electronic component and substrate

Abstract

The present invention is an electrode 10 so provided as to be soldered to an electronic component 12 and, when the electronic component 12 is mounted on a substrate 13, soldered to the substrate 13. The electrode 10 includes a column-like electrode body 11 soldered to the electronic component 12 and to the substrate 13. The electrode has grooves as an air discharging device discharging the air 15a in air voids 15 generated within the solder 14 between joint surfaces 11a, 11b of the electrode body 11 and the electronic component 12 or the substrate 13 when the electrode body 11 is soldered to the electronic component 12 or the substrate 13.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a view showing an electrode, an electronic component and a substrate in a first embodiment according to the present invention.

FIG. 1B is a sectional view taken along the line A-A in FIG. 1A.

FIG. 2 is a sectional view showing a groove serving as an air discharging device in the first embodiment according to the present invention.

FIG. 3 is a sectional view showing an operation of the air discharging device in the first embodiment according to the present invention.

FIG. 4 is a sectional view showing a roundness serving as another air discharging device in the first embodiment according to the present invention.

FIG. 5 is an explanatory sectional view showing an operation of an anchor effect in the first embodiment according to the present invention.

FIG. 6 is a view showing a rugged portion serving as another anchor effect generating device in the first embodiment according to the present invention.

FIG. 7A is a view showing the electrode, the electronic component and the substrate in a second embodiment according to the present invention.

FIG. 7B is a sectional view taken along the line B-B in FIG. 7A.

FIG. 8A is a view showing an electrode in the prior art.

FIG. 8B is a sectional view taken along the line X-X in FIG. 8A.

FIG. 9A is a view showing the electrode in another prior art.

FIG. 9B is a sectional view taken along the line Y-Y in FIG. 9A.

Claims

1. An electrode so provided as to be soldered to an electronic component and, when the electronic component is mounted on a substrate, soldered to the substrate, comprising a column-like electrode body soldered to the electronic component and to the substrate; andan air discharging device discharging the air in air voids generated within the solder between a joint surface of the electrode body and the electronic component or the substrate when the electrode body is soldered to the electronic component or the substrate.

2. An electrode according to claim 1, wherein the air discharging device is a groove extending from the vicinity of the center on the joint surface, facing the electronic component or the substrate, of the electrode body up to an outer peripheral surface of the electrode body.

3. An electrode according to claim 1, wherein the air discharging device is a roundness provided at each of outer peripheral edges of the joint surface, facing the electronic component or the substrate, of the electrode body.

4. An electrode according to claim 1, wherein the air discharging device is a recessed portion provided substantially at the center on the joint surface of the electrode body and opened in an outer peripheral surface of the electrode body.

5. An electrode according to claim 1, wherein the electrode body is provided with an anchor effect generating device that generates an anchor effect of the solder.

6. An electrode according to claim 5, wherein the anchor effect generating device is a groove.

7. An electrode according to claim 5, wherein the anchor effect generating device is a rugged portion.

8. An electronic component so mounted as to be soldered to a substrate, comprising an electrode soldered to the electronic component. wherein the electrode includes a column-like electrode body soldered to the electronic component and to the substrate,wherein the column-like electrode body includes an air discharging device discharging the air in air voids generated within the solder between a joint surface of the electrode body and the electronic component or the substrate when the electrode body is soldered to the electronic component or the substrate.

9. A substrate mounted with an electronic component including a soldered electrode, the electronic component being mounted by soldering the electrode,the electrode comprising a column-like electrode body; andan air discharging device discharging the air in air voids generated within the solder between a joint surface of the electrode body and the electronic component or the substrate when the electrode body is soldered to the electronic component or the substrate.