Claims
- 1. A method of fabricating a functional component, the method comprising the steps of:
a. providing a thin film of a curable material in liquid form; b. patterning the curable material by embossing the material at low pressure with an elastomeric stamp having a raised pattern thereon; c. curing the patterned material; and d. repeating steps (a) to (c) a plurality of times with materials which, when cured, have varying functional characteristics, the cured layers interacting so as to produce a functional component.
- 2. The method of claim 1 wherein the stamp comprises an elastomeric polymeric matrix with a rigidity-conferring material entrained therein.
- 3. The method of claim 1 further comprising the step of forming the elastomeric stamp by:
a. creating a negative impression of the pattern in a substrate; b. enclosing the pattern; c. pouring a liquid elastomeric precursor into the enclosure, the precursor flowing into the negative impression of the pattern d. curing the elastomeric precursor into an elastomer; and e. removing the elastomer from the substrate.
- 4. The method of claim 1 further comprising the step of forming the elastomeric stamp by:
a. providing a photosensitive elastomer; b. exposing the elastomer to actinic radiation so as to render the pattern; and c. photochemically developing the exposed elastomer to produce the pattern.
- 5. The method of claim 1 further comprising the step of cleaning the stamp by applying a liquid polyimide thereto, curing the polyimide, and removing the cured polyimide from the stamp.
- 6. The method of claim 1 wherein the curable material is applied as a liquid.
- 7. The method of claim 6 wherein the liquid is applied onto a smooth, flat support as a bead and drawn into a uniform film.
- 8. The method of claim 1 wherein the curable material is applied as a non-liquid and subsequently liquefied.
- 9. The method of claim 8 wherein the material is applied to a support and liquefied by heating the support.
- 10. The method of claim 8 wherein the material is liquefied by heating the stamp.
- 11. The method of claim 1 wherein the raised pattern comprises convex surfaces.
- 12. The method of claim 1 wherein the stamp is applied to the patterned material and removed therefrom with a rocking motion.
- 13. The method of claim 1 wherein the material is present on a support and is at least partially cured with the stamp held against the support.
- 14. The method of claim 1 wherein the stamp is removed from the material prior to curing the material, the material retaining the pattern despite removal of the stamp.
- 15. The method of claim 1 wherein the material is present on an uneven surface, the stamp patterning the material without substantial lateral deflection.
- 16. The method of claim 1 wherein the material is present on an uneven surface, the stamp having unraised portions which, with the raised features in contact with the surface, planarize the material in contact with the unraised portions.
- 17. The method of claim 1 wherein a plurality of contiguous layers is patterned with elastomeric stamps at least some of which have different patterns, at least some of the stamps having raised features in common locations to create vias between non-adjacent layers.
- 18. The method of claim 17 wherein at least some of the vias extend through a plurality of layers.
- 19. The method of claim 17 wherein the vias are filled by deposited material forming one of the layers, said material being planarized as said layer is patterned.
- 20. The method of claim 1 wherein the material of at least one of the layers is a suspension of nanoparticles in a carrier liquid.
- 21. The method of claim 20 wherein the material is cured by evaporating the carrier liquid, the nanoparticles coalescing into a substantially continuous patterned film.
- 22. The method of claim 21 wherein the nanoparticles are metal, the film being conductive.
- 23. The method of claim 21 wherein the nanoparticles are semiconductive, the film being semiconductive.
- 24. The method of claim 1 wherein at least one of the layers is soluble in a solvent, and further comprising the step of removing the at least one layer by exposure of the component to the solvent.
- 25. The method of claim 1 wherein, for each layer, the stamp is applied at a plurality of locations to produce a two-dimensional repetitive pattern.
- 26. The method of claim 1 wherein steps (a) to (d) are repeated a plurality of times so that the cured layers are formed repetitively.
- 27. The method of claim 1 wherein application of the stamp to the thin film results in adherence of material to the raised stamp pattern, the embossing step comprising transferring the adhered material to a substrate for curing.
- 28. The method of claim 27 wherein transfer is accomplished by application of low pressure to the stamp.
- 29. The method of claim 1 wherein the thin film is formed by deposition of the curable material in droplet form followed by application of the stamp thereto so as to form a thin film having a pattern complementary to the stamp pattern.
- 30. The method of claim 1 wherein the functional component is a micromechanical structure.
- 31. The method of claim 1 wherein the functional component is an integrated circuit, the cured layers comprising conducting, dielectric, and semiconducting layers.
- 32. The method of claim 1 wherein the functional component is a biochip.
- 33. The method of claim 1 wherein the functional component is a field-emission display.
- 34. The method of claim 33 wherein the curable material is a suspension of metal nanoparticles and carbon nanotubes and the pattern comprises first and second sets of interdigitated lines having nanotubes protruding therefrom, the repeating step comprising applying a suspension of metal nanoparticles so as to cover the first set of interdigitated lines and curing the metal-nanoparticle suspension thereover.
- 35. The method of claim 1 wherein the functional component is an optical waveguide.
- 36. An integrated circuit fabricated in accordance with claim 31.
- 37. A biochip fabricated in accordance with claim 32.
- 38. A field-emission display fabricated in accordance with claim 38.
- 39. An optical waveguide fabricated in accordance with claim 35.
- 40. A method of fabricating a functional component, the method comprising the steps of:
a. providing a thin film of a liquid on a support; b. patterning the liquid by embossing it at low pressure with an elastomeric stamp having a first raised pattern thereon, the raised pattern displacing the liquid when brought into contact with the support; and c. bringing into contact with the support a substrate having thereon a second raised pattern, the liquid, where present on the support, adhering to the second raised pattern.
- 41. The method of claim 40 wherein the liquid comprises a biological material.
- 42. The method of claim 40 wherein the liquid comprises a biological resist, and further comprising the step of exposing the substrate to a biological material, the biological material not adhering to raised portions of the substrate that have received the resist.
- 43. A method of fabricating a functional component, the method comprising the steps of:
a. providing a thin film of a liquid on a support; b. patterning the liquid by embossing it at low pressure with an elastomeric stamp having a raised pattern thereon, the raised pattern having at least some features with submicron dimensions and displacing the liquid when brought into contact with the support; and c. curing the patterned material.
- 44. Apparatus for fabricating a functional component, the apparatus comprising:
a. means for applying a thin film of a curable material in liquid form; b. an elastomeric stamp having a raised pattern thereon, the raised pattern having at least some features with submicron dimensions; c. means for applying the elastomeric stamp to the curable material so that the raised pattern displaces the material; and d. means for curing the patterned material.
PRIOR APPLICATION
[0001] This application stems from U.S. Provisional Application Serial No. 60/153,776, filed on Sep. 14, 1999, and No. 60/167,847, filed on Nov. 29, 1999.
Provisional Applications (2)
|
Number |
Date |
Country |
|
60153776 |
Sep 1999 |
US |
|
60167847 |
Nov 1999 |
US |
Divisions (1)
|
Number |
Date |
Country |
Parent |
09525734 |
Mar 2000 |
US |
Child |
10320869 |
Dec 2002 |
US |