This invention relates generally to semiconductor devices, and particularly to structures and formation methods of Fin field-effect transistors (FinFET).
With the increasing down scaling of integrated circuits and increasingly higher requirements for integrated circuits, transistors need to have higher drive currents with increasingly smaller dimensions. Fin field-effect transistors (FinFET) were thus developed.
The structure shown in
The structure shown in
What are needed in the art, therefore, are formation methods and structures thereof that incorporate FinFETs to take advantage of the benefits associated with the increased drive currents while at the same time overcoming the deficiencies of the prior art.
In accordance with one aspect of the present invention, a semiconductor structure includes a semiconductor substrate; a planar transistor on a first portion of the semiconductor substrate, wherein the first portion of the semiconductor substrate has a first top surface; and a multiple-gate transistor on a second portion of the semiconductor substrate. The second portion of the semiconductor substrate is recessed from the first top surface to form a fin of the multiple-gate transistor. The fin is electrically isolated from the semiconductor substrate by an insulator.
In accordance with another aspect of the present invention, a semiconductor structure includes a semiconductor substrate comprising a bulk portion; and a semiconductor fin over the bulk portion of the semiconductor substrate. The semiconductor fin has a first width, and is formed of a same material as the semiconductor substrate. The semiconductor structure further includes an insulator separating the semiconductor fin into a top portion and a bottom portion electrically isolated from each other, wherein the bottom portion is physically connected to the semiconductor substrate.
In accordance with yet another aspect of the present invention, a semiconductor structure includes a semiconductor substrate; and an isolation region over the semiconductor substrate and having a bottom surface, wherein the isolation region includes a first portion having a first top surface and a second portion having a second top surface lower than the first top surface. The semiconductor structure further includes a first active region adjacent the first portion of the isolation region, wherein a top surface of the first active region is substantially leveled with the first top surface; a second active region adjacent the second portion of the isolation region, wherein the second active region has a top surface higher than the second top surface; an insulator separating the second active region into a top portion and a bottom portion electrically disconnected from each other; a planar transistor on the first active region; and a multiple-gate transistor having the top portion of the second active region as source/drain and channel regions.
In accordance with yet another aspect of the present invention, a method of forming a semiconductor structure includes providing a semiconductor substrate; forming an isolation region in the semiconductor substrate, wherein the isolation region encircles an active region; and recessing a top portion of the isolation region to expose sidewalls of the active region. The method further includes, at a level between a top surface of the active region and a bottom surface of the isolation region, oxidizing an intermediate portion of the active region to form an insulator layer separating the active region into a top portion and a bottom portion.
In accordance with yet another aspect of the present invention, a method of forming a semiconductor structure includes providing a semiconductor substrate; forming a plurality of isolation regions having a first height, wherein the plurality of isolation regions defines an active region; recessing the plurality of isolation regions to expose sidewalls of the active region; forming a hard mask to cap the active region, wherein portions of the plurality of isolation regions are exposed through the hard mask; recessing the exposing portions of the plurality of isolation regions to expose sidewalls of the active region; and oxidizing the exposed sidewalls of the active region to form an insulator layer fully isolating an upper portion of the active region from the semiconductor substrate.
In accordance with yet another aspect of the present invention, a method of forming a semiconductor structure includes providing a semiconductor substrate including a planar device region and a FinFET region; forming a plurality of isolation regions, wherein the plurality of isolation regions defines a first active region in the planar device region and a second active region in the FinFET region; performing a first recessing on the plurality of isolation regions to expose sidewalls of the second active region, wherein sidewalls of the first active region remain unexposed; forming a hard mask to mask exposed portions of the sidewalls of the second active region; performing a second recessing on the exposing portions of the plurality of isolation regions to expose portions of the sidewalls of the second active region below the hard mask; and oxidizing the exposed sidewalls of the second active region to form an insulator layer. The insulator layer isolates a top portion of the second active region from the semiconductor substrate.
The advantageous features of the present invention include reduced punch-through currents in FinFETs, improved carrier mobility in the channels of the FinFETs, and a low production cost.
For a more complete understanding of the present invention, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
The making and using of the presently preferred embodiments are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use the invention, and do not limit the scope of the invention.
An integrated circuit formation process including the formation of a planar transistor and a fin field-effect transistor (FinFET, also referred to as a multi-gate transistor or a tri-gate transistor) are provided. The intermediate stages of manufacturing a preferred embodiment of the present invention are illustrated. The variations of the preferred embodiments are then discussed. Throughout the various views and illustrative embodiments of the present invention, like reference numbers are used to designate like elements.
Referring to
Pad layer 32 and mask layer 34 are formed on semiconductor substrate 30. Pad layer 32 is preferably a thin film formed through a thermal process, and thus including silicon oxide. It is used to buffer semiconductor substrate 30 and mask layer 34 so that less stress is generated. Pad layer 32 may also act as an etch stop layer for etching the subsequently formed mask layer 34. In the preferred embodiment, mask layer 34 is formed of silicon nitride using low-pressure chemical vapor deposition (LPCVD). In other embodiments, mask layer 34 is formed by thermal nitridation of silicon, plasma enhanced chemical vapor deposition (PECVD), or plasma anodic nitridation using nitrogen-hydrogen. Mask layer 34 may have a thickness of about 60 nm to about 120 nm. It is noted, however, that the dimensions recited throughout the description are merely examples, and may change if the integrated circuits are formed using different technologies.
Referring to
In the preferred embodiment, as shown in
Referring to
In
Next, as shown in
In
Referring to
In
Next, gate stacks for the planar transistor and the FinFET may be formed, as is shown in
In the gate-first approach, after the structure as shown in
In a gate-last approach, after the structure as shown in
Next, as shown in
Referring to
It is realized that the embodiments discussed in the preceding paragraphs are related to the processing of STI regions 40. As is known in the art, the densities of STI regions 40 affect the efficiency of the recessing steps, for example, the step discussed in
The embodiments of the present have several advantageous features. The FinFETs formed using the embodiments of the present invention have reduced, and possibly substantially eliminated, punch-through currents due to the formation of punch-through stoppers, which fully isolate source and drain regions from the possible punch-through current paths. The reduction in the punch-through currents does not require highly priced SOI substrates. In addition, the channel regions do not require high impurity (well) concentrations, and the fin heights do not vary with the variation in the position of the top surface of STI regions. These results in smaller variation in the FinFET performance. The formation of the FinFETs is fully compatible with the formation of planar transistors.
In some aspects, embodiments described herein may provide for a semiconductor device including a semiconductor substrate having a topmost surface in which is formed a planar transistor, and FinFET transistor formed in the substrate. The FinFET transistor includes a semiconductor fin that has a topmost surface that is substantially planar with the topmost surface of the substrate, and a first isolation structure extending between the fin and the substrate.
In other aspects, embodiments described herein may provide for a semiconductor device including a semiconductor substrate having a topmost surface in which is formed a planar transistor. The device also includes a first multiple gate transistor fin having a topmost surface substantially level with the topmost surface of the semiconductor substrate. The first multiple gate fin includes a first isolation structure layer extending from a first sidewall of the first multiple gate transistor fin to a second sidewall of the first multiple gate transistor fin, the first isolation structure being a first distance below the topmost surface of the first multiple gate transistor fin. The device further includes a second multiple gate transistor fin having a topmost multiple gate transistor substantially level with the topmost surface of the semiconductor substrate, the second multiple gate transistor fin including a second isolation structure layer extending from a first sidewall of the second multiple gate transistor fin to a second sidewall of the second multiple gate transistor fin, the second isolation structure being a second distance below the topmost surface of the second multiple gate transistor fin, the second distance being greater than the first distance.
In yet other aspects, embodiments described herein may provide for a semiconductor device comprising a semiconductor substrate and a planar transistor having a source/drain region formed in a topmost surface of the substrate. The device also includes a fin having a topmost surface substantially level with the topmost surface of the substrate and extending below the topmost surface of the substrate. The fin includes an upper portion and a lower portion and a first isolation structure interjacent the upper portion and the lower portion.
In other aspects, embodiments described herein may provide for a device including a planar transistor in a first region of a semiconductor substrate and a finFET in a second region of the semiconductor substrate. The planar transistor comprising a first gate structure disposed at a topmost surface of the semiconductor substrate. The finFET comprising: a first fin disposed between a first isolation region and a second isolation region; a first isolation structure extending from the first isolation region to the second isolation region, the first isolation structure extending between a first upper region of the first fin and a first lower region of the first fin; and a second gate structure disposed over and along sidewalls of the first fin.
Although the present invention and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, and composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure of the present invention, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present invention. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.
This application is a divisional of U.S. patent application Ser. No. 14/988,427, filed Jan. 5, 2016, and entitled “FinFETs Having Dielectric Punch-Through Stoppers,” which application claims benefit to and is a continuation of U.S. patent application Ser. No. 13/314,942, filed Dec. 8, 2011, and entitled “FinFETs Having Dielectric Punch-Through Stoppers,” which application claims benefit to and is a divisional of U.S. patent application Ser. No. 12/116,074, filed May 6, 2008, now U.S. Pat. No. 8,106,459 issued on Jan. 31, 2012 and entitled “FinFETs Having Dielectric Punch-Through Stoppers,” all of which applications are hereby incorporated herein by reference.
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Parent | 14988427 | Jan 2016 | US |
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Parent | 12116074 | May 2008 | US |
Child | 13314942 | US |
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Parent | 13314942 | Dec 2011 | US |
Child | 14988427 | US |