Claims
- 1. A heat exchanger for transferring heat from an array of electric circuit chips to a fluid coolant comprising:
- a flexible sheet of thermally conductive material sufficiently large to cover the array of chips and sufficiently flexible to conform to individual orientations of the chips to make thermal contact therewith; and
- a set of thermally conductive fin assemblies extending normally from said sheet, said fin assemblies having fins directed for contacting a coolant for extraction of heat therefrom; and
- wherein said fin assemblies are thermally connected to said chips; and said sheet contacts said fin assemblies on fin surfaces of each said fin assembly opposite a connection of said sheet with said circuit chip, said sheet having undulations for flexible compliance with the surface of the fins for interaction with the coolant for extraction of heat from said fin assemblies.
- 2. A heat exchanger according to claim 1 wherein said sheet contacts said fin assemblies on a surface of each of said fin assemblies opposite fins of each of said fin assemblies, said sheet passing between each chip and its corresponding fin assembly and making thermal contact with each chip and fin assembly to allow heat generated within a chip to pass to the corresponding fin assembly.
- 3. A heat exchanger for transferring heat from an array of electric circuit chips to a fluid coolant comprising:
- a flexible sheet of electrically insulating material sufficiently large to cover the array of chips and sufficiently flexible to conform to individual orientations of the chips to make thermal contact therewith; and
- a set of thermally conductive fin assemblies extending normally from said sheet, said fin assemblies having fins directed for contacting a coolant for extraction of heat from the sheet; and wherein
- each of said fin assemblies comprises a base and a set of fins upstanding from said base, the base being disposed on one surface of said sheet, and the fins extending through an aperture in said sheet beyond a second surface of said sheet opposite said one surface.
Priority Claims (2)
Number |
Date |
Country |
Kind |
62-9218 |
Jan 1987 |
JPX |
|
871048096 |
Apr 1987 |
EPX |
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RELATED APPLICATION
This application is a continuation-in-part of original application Ser. No. 858,318 filed Apr. 30, 1986 now U.S. Pat. No. 4,730,666.
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4381032 |
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Apr 1983 |
|
4686606 |
Yamada et al. |
Aug 1987 |
|
4730666 |
Flint et al. |
Mar 1988 |
|
4765397 |
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Aug 1988 |
|
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Date |
Country |
2393425 |
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FRX |
53-45976 |
Apr 1978 |
JPX |
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JPX |
59-215755 |
Dec 1984 |
JPX |
61-35526 |
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JPX |
Non-Patent Literature Citations (2)
Entry |
IBM Technical Disclosure Bulletin, vol. 21, No. 5, Oct. 1978, p. 1857, New York, U.S.A., R. G. Dessauer et al. |
Computer Design, vol. 23, No. 14, Dec. 1984, pp. 254, 255, Littleton, Mass., U.S.A. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
858318 |
Apr 1986 |
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