Claims
- 1. A method for packaging a semiconductor device comprising:providing a tape having a conductive array of contact pads that have a first contact pattern and a plurality of bonding pads disposed thereon, said conductive array of contact pads electrically connected to said plurality of bonding pads; placing a semiconductor device over said tape; electrically connecting said semiconductor device to said bonding pads; forming an enclosure around said semiconductor device; and selectively attaching balls to ones of said contact pads so as to form a second contact pattern, said second contact pattern different from said first contact pattern as a result of configuration of said second contact pattern at a time subsequent from the time that said tape is formed such that the number of balls selectively attached to ones of said contact pads is less than the number of said contact pads.
- 2. The method for packaging a semiconductor device of claim 1 wherein said tape has a top side and a bottom side and includes a plurality of openings disposed therein, one of said openings disposed below each of said contact pads.
- 3. The method for packaging a semiconductor device of claim 2 wherein said step of selectively attaching balls includes the step of selectively attaching balls to the bottom side of said tape such that said balls are selectively attached to ones of said contact pads so as to form said second contact pattern.
- 4. The method for packaging a semiconductor device of claim 1 wherein said balls comprise solder.
- 5. A method for packaging a semiconductor device comprising:providing a tape having a conductive array of contact pads that have a first contact pattern and a plurality of bonding pads disposed thereon, said conductive array of contact pads electrically connected to said plurality of bonding pads, and wherein said tape has a top side and a bottom side and includes a plurality of openings disposed therein, one of said openings disposed below each of said contact pads; placing a semiconductor device over said tape; electrically connecting said semiconductor device to said bonding pads; forming an enclosure around said semiconductor device; and selectively attaching balls to ones of said contact pads so as to form a second contact pattern, said second contact pattern different from said first contact pattern as a result of configuration of said second contact pattern at a time subsequent from the time that said tape is formed such that the number of balls selectively attached to ones of said contact pads is less than the number of said contact pads, said balls selectively attached by sealing ones of said openings by depositing a layer of solder mask thereover and applying solder to said tape so as to selectively form balls over ones of said contact pads that do not have solder mask disposed thereover.
- 6. A method for packaging a semiconductor device comprising:providing a tape having a conductive array of contact pads that have a first contact pattern and a plurality of bonding pads disposed thereon, said conductive array of contact pads electrically connected to said plurality of bonding pads; placing a semiconductor device over said tape; electrically connecting said semiconductor device to said bonding pads; forming an enclosure around said semiconductor device; and selectively attaching balls to ones of said contact pads so as to form a second contact pattern, said second contact pattern different from said first contact pattern as a result of configuration of said second contact pattern at a time subsequent from the time that said tape is formed such that the number of balls selectively attached to ones of said contact pads is less than the number of said contact pads.
Parent Case Info
This is a divisional of copending application Ser. No. 09/015,420 filed on Jan. 29, 1998.
US Referenced Citations (13)