1. Field of the Invention
The invention relates in general to a packaging method using flexible printed circuit boards, and more particularly to a packaging method having flexible printed circuit boards that can be processed by packaging equipments for a packaging method using printed circuit board.
2. Description of the Related Art
A large number of passive devices or small-sized circuit modules such as wireless communication modules have developed into an age of small outline package (SOP) and quad flat package (QFP). A thick printed circuit board (PCB) or a thin flexible printed circuit (FPC) board is often used as an IC (integrated circuit) frame. Chips are processed with the IC frame to produce electronic components products by semiconductor package.
Generally speaking, a thickness of the printed circuit board is approximately above 0.3 mm, and a thickness of the flexible printed circuit board or a thin flat is respectively below 0.2 mm or 0.12 mm. With reference to
With reference to
An objective of the present invention is to provide a packaging method for flexible printed circuit boards and a frame for the packaging method.
In order to achieve the above objective, a chip packaging process method for the flexible printed circuit boards of the present invention has steps as follows.
At least one flexible printed circuit board and a frame are provided. A thickness of the flexible printed circuit board is under 0.2 mm. A plurality of matrix arranged circuit units is formed on the flexible printed circuit board. Each of the circuit units includes a circuit and a chip pad.
Secondly, the frame is bonded onto a periphery of the corresponding flexible printed circuit board.
Thirdly, a chip is bonded to a chip pad on the flexible printed circuit board.
Fourthly, a wire bonding is processed on a solder connection point of the chip and the flexible printed circuit board to be electrically connected.
Fifthly, a die coating is process on the flexible printed circuit board and the chip.
Sixthly, the corresponding circuit units are cut to have a plurality of electronic components.
The above processes of the frame and the flexible printed circuit board include steps as follows.
A tape is bonded on a frame. A joint of the frame and the flexible printed circuit board has the thermosetting tape. The thermosetting tape is raised near the opening of the frame. The opening of the frame is of the same size as the flexible printed circuit board.
The frame is placed to a periphery of the corresponding flexible printed circuit board. At this moment, the opening is aimed at the flexible printed circuit and is bonded downward onto the flexible printed circuit board. In this way, the tape of the frame overlays the periphery of the corresponding flexible printed circuit board.
The frame is then heated to make the tape bonded firmly with the periphery of the flexible printed circuit board.
To sum up, the present invention is to provide a frame to make the frame bonded downward onto the periphery of the flexible printed circuit board before the flexible printed circuit board is processed by dispensing, bonding or wire bonding. In this way, the flexible printed circuit board can have better strength and weight than the conventional flexible printed circuit board by bonding the frame. Hence when the flexible printed circuit board is processed by the packaging equipments of high suction or pressure, the flexible printed circuit board can avoid position deviation or damaged. Therefore, the frame provided by the present invention can assist the flexible printed circuit boards to be processed by the printed circuit boards to produce a high yield up to more than 90%.
With reference to
At least one opening 111 is defined in the body 11. In this embodiment, there are two individual openings are defined in he body 11.
An external part 121 of the tape 12 is bonded to a periphery of the body 11, and an internal part 122 of the tape 12 is raised a periphery near each opening 111 of the body 11. Moreover, a size of each opening 111 of the body 11 fits to a size of the flexible printed circuit board 20. The flexible printed circuit boards 20 and the openings 111 are of rectangular. An internal part of the tape 12 is raised the periphery near each opening 111 of the body 11. The body 11 is made of copper or metal material. The frame 10 further has a plurality of positioning holes 13 defined on the body 11 for a packaging equipment. Moreover, the tape 12 can be of a thermosetting tape to make the flexible printed circuit boards 20 bonded to the body 11 by a heating step.
With reference to
A plurality of matrix arranged circuit units 21 is formed on the flexible printed circuit boards 20. Each of the circuit units 21 includes circuit lines 22 and a chip pad 23.
With reference to
In a first step (30), at least one flexible printed circuit board 20 and a frame 10 are prepared. A thickness of the flexible printed circuit board 20 is under 0.2 mm. A plurality of matrix arranged circuit units 21 is formed on the flexible printed circuit board 20. Each of the circuit units 21 includes circuit lines 22 and a chip pad 23.
In a second step (31), the frame 10 is bonded onto a periphery of the corresponding flexible printed circuit board 20.
In a third step (32), multiple chips are respectively bonded to a chip pad 23 on the corresponding flexible printed circuit board.
In a fourth step (33), each chip is wire bonded to the circuit lines of the corresponding circuit unit of the flexible printed circuit board.
In a fifth step (34), the chips and the flexible printed circuit boards are sealed in an encapsulation.
In a sixth step (35), the encapsulated flexible printed circuit boards and chips are cut to have electronic components, such as passive devices or small-sized circuit modules.
The second step (32) further has sub-steps as follows.
(a) A tape 12 is bonded on a body 11. A joint of the frame 10 and the flexible printed circuit board 20 has the thermosetting tape 12. The thermosetting tape 12 is raised near the opening 111 of the body 11. The opening 111 of the frame 10 is of the same size as the flexible printed circuit board 20.
(b) The frame 10 is placed to a periphery of the corresponding flexible printed circuit board 20. At this moment, each opening 111 is aligned to the corresponding flexible printed circuit 20 and is bonded downward onto the flexible printed circuit board 20. In this way, the tape 12 of the frame 20 overlays the periphery of the corresponding flexible printed circuit board 20.
The frame 10 is then heated to make the tape 12 bonded firmly with the periphery of the flexible printed circuit board 20.
To sum up, the present invention is to provide a frame to make the frame bonded downward onto the periphery of the flexible printed circuit board before the flexible printed circuit board is processed by dispensing, bonding or wire bonding. In this way, the flexible printed circuit board can have better strength and weight than the conventional flexible printed circuit board by bonding the frame. Hence when the flexible printed circuit board is processed by the packaging equipments of high suction or pressure, the flexible printed circuit board can avoid position deviation or damaged. Therefore, the frame provided by the present invention can assist the flexible printed circuit boards to be processed by the printed circuit boards to produce a high yield up to more than 90%.
While the invention has been described by way of example and in terms of a preferred embodiment, it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.