1. Field of the Disclosure
The present disclosure generally relates to heat dissipation and, more particularly, to a heat dissipation device mounted on an electronic component, such as an integrated circuit package, using a clip.
2. Description of Related Art
It is well known that electronic packages such as central processing units (CPUs) generate large amounts of heat during normal operations. The generated heat must be adequately dissipated from the electronic packages to maintain an acceptable temperature range. Cooling of a CPU is generally achieved by thermally attaching a heat sink to the CPU whereby heat generated by the CPU is dissipated. Often, the heat sink is held in thermal contact with the CPU by a clip.
A related clip comprises a main body soldered to a bottom of the heat sink and two ends defining mounting holes. A plurality of fasteners extend through the mounting holes of the clip to engage a retainer to fasten the heat dissipation device onto the CPU of a printed circuit board. However, in assembly or manufacture of the heat dissipation device, errors frequently occur during soldering of the fasteners to the bottom of the heat sink. In addition, both the solder used and the process thereof increase manufacturing costs of the heat dissipation device and are environmentally unfriendly.
Therefore, a clip engaging a heat dissipation device which can overcome the limitations described is desired.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
The base 40 is a metal plate having high heat conductivity, and has a rectangular configuration. The base 40 comprises a bottom surface (not labeled) contacting the CPU 92 and a top surface 42 opposite to the bottom surface thereof. The base 40 defines two parallel straight grooves 426 in a top portion thereof, receiving the heat pipes 20 therein. The grooves 426 are located at a center of the base 40.
The heat pipes 20 are U-shaped. Each heat pipe 20 comprises a horizontal evaporating portion 22 and a condensing portion 24 parallel thereto. The evaporating portions 22 of the heat pipes 20 are received in the grooves 426 of the base 40.
The fin set 30 comprises a plurality of fins 32. Each fin 32 is a metal sheet in a reclining L-shaped configuration. The fins 32 are oriented perpendicular to the base 40 and parallel. The fin set 30 comprises a first portion 325 and a second portion 326 extending from one short side thereof, with the second portion 326 higher than the first portion 325. The first portion 325 and the second portion 326 respectively form clasps 39 at the top and bottom thereof. The fins 32 connect with each other via the clasps 39 on the top and bottom thereof. The second portion 326 of the fin set 30 is separated from the base 40. The second portion 326 of the fin set 30 defines a pair of spaced first through holes 34 transversely extending across all of the fins 32. The first portion 325 defines two adjoining slots 36 at a bottom thereof. The slots 36 cooperate with the grooves 426 to define channels (not labeled) receiving the evaporating portions 22 of the heat pipes 20 therein, when the fins 32 are arranged together and mounted onto the base 40. Each fin 32 forms two flanges 33 perpendicularly extending from a top edge and a bottom edge thereof. The flanges 33 separate the fins 32 by uniform intervals. Each of the fins 32 of the first portion 325 defines a pair of rectangular second through holes 38. Each pair of second through holes 38 is adjacent and parallel to the bottom and at two opposite ends of the first portion 325 of the fin set 30. Each of the second through holes 38 is a small distance from a bottom surface or the flange 33 of each fin 32. The second through holes 38 of the fins 32 cooperatively define two channels receiving locking beams 52 of the locking members 50.
Each of the locking members 50 comprises the locking beam 52 extending through the fins 32 and two fasteners 56 engaging the locking beam 52. Each of the locking beams 52 includes a position end 54 and a free end 53 opposite thereto. Each locking member 50 defines two mounting holes 522 at the position end 54 and the free end 53 respectively. The fasteners 56 extend through the mounting holes 522 of the locking beams 52 to engage a retainer (not shown) below the printed circuit board 90 for mounting the heat sink assembly 10 onto the CPU 92. A protrusion 528 extends downwardly from the position end 54 of each locking beam 52.
Referring also to
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.
Number | Date | Country | Kind |
---|---|---|---|
2008 1 0068323 | Jul 2008 | CN | national |
Number | Name | Date | Kind |
---|---|---|---|
1896501 | Whitaker | Feb 1933 | A |
4777560 | Herrell et al. | Oct 1988 | A |
5020586 | Mansingh | Jun 1991 | A |
5947192 | Kuo | Sep 1999 | A |
6076594 | Kuo | Jun 2000 | A |
6199627 | Wang | Mar 2001 | B1 |
6289975 | Kuo | Sep 2001 | B2 |
6491091 | Lin et al. | Dec 2002 | B1 |
6684476 | Yu | Feb 2004 | B1 |
6883592 | Lee | Apr 2005 | B2 |
7128131 | Kubo | Oct 2006 | B2 |
7350561 | Deng et al. | Apr 2008 | B2 |
7447035 | Liu et al. | Nov 2008 | B2 |
7613004 | Sasaki | Nov 2009 | B2 |
7905274 | Kuo | Mar 2011 | B2 |
7916469 | Zhou et al. | Mar 2011 | B2 |
20010010264 | Kuo | Aug 2001 | A1 |
20020043360 | Lee | Apr 2002 | A1 |
20040182552 | Kubo | Sep 2004 | A1 |
20070181287 | Peng et al. | Aug 2007 | A1 |
20070215320 | Deng et al. | Sep 2007 | A1 |
20070284084 | Lin | Dec 2007 | A1 |
20080128118 | Chen et al. | Jun 2008 | A1 |
20080130239 | Liu et al. | Jun 2008 | A1 |
20080156460 | Hwang et al. | Jul 2008 | A1 |
20090050293 | Kuo | Feb 2009 | A1 |
20100236755 | Li et al. | Sep 2010 | A1 |
Number | Date | Country |
---|---|---|
101115366 | Jan 2008 | CN |
Number | Date | Country | |
---|---|---|---|
20100000716 A1 | Jan 2010 | US |