Claims
- 1. A fixing member for fixing a heat sink having first and second opposing faces to an integrated circuit package having an outer periphery, the integrated circuit having an outer periphery at least partially surrounded by a guide member, the fixing member comprising:a first portion adapted to contact the first face of the heat sink such that the second face of the heat sink is in contact with the integrated circuit package when the heat sink is mounted on the integrated circuit package, the first portion having a curved face for contacting the first face of the heat sink and biasing the heat sink toward the integrated circuit package; and a second portion extending away from the first portion, the second portion being adapted to be removably fixed to the guide member, the second portion having a resiliently deformable pawl that fits within an arresting portion of the guide member; wherein the fixing member is formed of a resilient material and contacts only a peripheral portion of the first face of the heat sink.
Priority Claims (3)
Number |
Date |
Country |
Kind |
5-60004 |
Mar 1993 |
JP |
|
5-225650 |
Sep 1993 |
JP |
|
6-28413 |
Feb 1994 |
JP |
|
Parent Case Info
This application is a continuation of application Ser. No. 09/276,742, filed Mar. 26, 1999, now allowed, U.S. Pat. No. 6,222,731 which is a divisional of application Ser. No. 08/951,481, filed Oct. 16, 1997, now U.S. Pat. No. 5,953,208, which is a continuation of application Ser. No. 08/670,018, filed Jun. 25, 1996, now abandoned, which is a divisional of application Ser No. 08/568,396, filed Dec. 15, 1995, now U.S. Pat. No. 5,559,674, which is a continuation of application Ser. No. 08/214,702, filed Mar. 18, 1994, now abandoned.
US Referenced Citations (20)
Foreign Referenced Citations (12)
Number |
Date |
Country |
33 35 377 |
Apr 1985 |
DE |
A-33 35 377 |
Apr 1985 |
DE |
87 16 007 |
Jan 1989 |
DE |
U-87 16 007 |
Feb 1989 |
DE |
0 253 126 |
Jan 1988 |
EP |
A-0 449 150 |
Oct 1991 |
EP |
A-0 572 326 |
Dec 1993 |
EP |
A-2 316 737 |
Jan 1977 |
FR |
A-2 267 601 |
Dec 1993 |
GB |
A-03 124 007 |
May 1991 |
JP |
WO-A-89 00751 |
Jan 1989 |
WO |
WO 94 00727 |
Jan 1994 |
WO |
Non-Patent Literature Citations (3)
Entry |
Research Disclosure, No. 318, Oct. 1990, Havant GB, p. 851 ‘Spring-Loaded Heat Sinks for VLSI Packages’. |
Patent Abstract of Japan, vol. 015, No. 330, Aug. 22, 1991 & JP 03 124007A (Furukawa Electric Co. Ltd.: THE; Others: 01), May 27, 1991. |
Hawley's “Condensed Chemical Dict.”, 12th Ed., R.J. Lewis, Sr., Copyright 1993. |
Continuations (3)
|
Number |
Date |
Country |
Parent |
09/276742 |
Mar 1999 |
US |
Child |
09/825053 |
|
US |
Parent |
08/670018 |
Jun 1996 |
US |
Child |
08/951481 |
|
US |
Parent |
08/214702 |
Mar 1994 |
US |
Child |
08/568396 |
|
US |