High frequency module

Abstract

A high frequency module incorporates a layered substrate. The layered substrate has a bottom surface and a top surface. Terminals are disposed on the bottom surface. SAW filters and inductors are mounted on the top surface. The layered substrate incorporates: a first conductor layer connecting the SAW filters to the inductors; a second conductor layer connected to the terminals and disposed at a location closer to the bottom surface than the first conductor layer; and a plurality of parallel signal paths each of which is formed using at least one through hole provided inside the layered substrate and each of which connects the first and second conductor layers to each other.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating the circuit configuration of a high frequency module of an embodiment of the invention.

FIG. 2 is a schematic diagram illustrating the circuit configuration of the high frequency module of the embodiment of the invention.

FIG. 3 is a top view of the high frequency module of the embodiment of the invention.

FIG. 4 is a perspective view of an appearance of the high frequency module of the embodiment of the invention.

FIG. 5 is a top view illustrating a top surface of a first dielectric layer of the layered substrate of FIG. 3.

FIG. 6 is a top view illustrating a top surface of a second dielectric layer of the layered substrate of FIG. 3.

FIG. 7 is a top view illustrating a top surface of a third dielectric layer of the layered substrate of FIG. 3.

FIG. 8 is a top view illustrating a top surface of a fourth dielectric layer of the layered substrate of FIG. 3.

FIG. 9 is a top view illustrating a top surface of a fifth dielectric layer of the layered substrate of FIG. 3.

FIG. 10 is a top view illustrating a top surface of a sixth dielectric layer of the layered substrate of FIG. 3.

FIG. 11 is a top view illustrating a top surface of a seventh dielectric layer of the layered substrate of FIG. 3.

FIG. 12 is a top view illustrating a top surface of an eighth dielectric layer of the layered substrate of FIG. 3.

FIG. 13 is a top view illustrating a top surface of a ninth dielectric layer of the layered substrate of FIG. 3.

FIG. 14 is a top view illustrating a top surface of a tenth dielectric layer of the layered substrate of FIG. 3.

FIG. 15 is a top view illustrating a top surface of an eleventh dielectric layer of the layered substrate of FIG. 3.

FIG. 16 is a top view illustrating a top surface of a twelfth dielectric layer of the layered substrate of FIG. 3.

FIG. 17 is a top view illustrating a top surface of a thirteenth dielectric layer of the layered substrate of FIG. 3.

FIG. 18 is a top view illustrating a top surface of a fourteenth dielectric layer of the layered substrate of FIG. 3.

FIG. 19 is a top view illustrating a top surface of a fifteenth dielectric layer of the layered substrate of FIG. 3.

FIG. 20 is a top view illustrating a top surface of a sixteenth dielectric layer of the layered substrate of FIG. 3.

FIG. 21 is a top view illustrating the sixteenth dielectric layer and a conductor layer therebelow of the layered substrate of FIG. 3.

FIG. 22 is a view for schematically illustrating a signal transmission line of the high frequency module of the embodiment of the invention, the transmission line connecting a dual SAW filter, an inductor and a reception signal terminal to one another.

FIG. 23 is a plot showing a result of a simulation for describing an effect of the high frequency module of the embodiment of the invention.

FIG. 24 is a plot showing a result of another simulation for describing an effect of the high frequency module of the embodiment of the invention.

Claims

1. A high frequency module comprising a layered substrate, the layered substrate including: a plurality of dielectric layers and a plurality of conductor layers that are alternately stacked; a first surface and a second surface located at both sides of the layered substrate, the sides being opposed to each other in a direction in which the layers are stacked; and a terminal disposed on the first surface, wherein: the plurality of conductor layers include: a first conductor layer for connecting a plurality of circuit components to each other; and a second conductor layer connected to the terminal and disposed at a location closer to the first surface than the first conductor layer; andthe layered substrate further includes a plurality of parallel signal paths each of which is formed using at least one through hole provided inside the layered substrate and each of which connects the first and second conductor layers to each other.

2. The high frequency module according to claim 1, further comprising a plurality of elements mounted on the second surface as the plurality of circuit components, wherein the first conductor layer connects the plurality of elements to each other.

3. The high frequency module according to claim 1, wherein the layered substrate further includes at least one through hole for connecting the second conductor layer to the terminal.

4. A high frequency module comprising: an antenna terminal connected to an antenna;a reception signal terminal outputting reception signals;a transmission signal terminal receiving transmission signals;a separation circuit disposed between the antenna terminal and the reception and transmission signal terminals, and separating the reception signals and the transmission signals from each other;a filter provided between the separation circuit and the reception signal terminal;a matching element for impedance matching between the filter and an external circuit connected to the reception signal terminal, the matching element being connected to the filter and the reception signal terminal; anda layered substrate integrating the foregoing components, wherein:the layered substrate includes a plurality of dielectric layers and a plurality of conductor layers that are alternately stacked; and a first surface and a second surface located at both sides of the layered substrate, the sides being opposed to each other in a direction in which the layers are stacked;the reception signal terminal is disposed on the first surface;the filter and the matching element are mounted on the second surface;the plurality of conductor layers include: a first conductor layer for connecting the filter and the matching element to each other; and a second conductor layer connected to the reception signal terminal and disposed at a location closer to the first surface than the first conductor layer; andthe layered substrate further includes a plurality of parallel signal paths each of which is formed using at least one through hole provided inside the layered substrate and each of which connects the first and second conductor layers to each other.

5. The high frequency module according to claim 4, wherein the filter is formed using an acoustic wave element.

6. The high frequency module according to claim 4, wherein the layered substrate further includes at least one through hole for connecting the second conductor layer to the reception signal terminal.