This is a divisional of application Ser. No. 08/541,397 filed on Oct. 10, 1995 now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
H498 | Keller et al. | Jul 1988 | |
3852877 | Ahn et al. | Dec 1974 | |
4079927 | Rocton | Mar 1978 | |
4237606 | Niwa et al. | Dec 1980 | |
4417392 | Ibrahim et al. | Nov 1983 | |
4437141 | Prokop | Mar 1984 | |
4443278 | Zingher | Apr 1984 | |
4641425 | Dubuisson et al. | Feb 1987 | |
4677254 | Boss et al. | Jun 1987 | |
4736275 | Kendall et al. | Apr 1988 | |
4821945 | Chase et al. | Apr 1989 | |
4852788 | Patrikios | Aug 1989 | |
4949223 | Achiwa | Aug 1990 | |
5048178 | Bindra et al. | Sep 1991 | |
5151771 | Hiroi et al. | Sep 1992 | |
5191404 | Wu et al. | Mar 1993 |
Number | Date | Country |
---|---|---|
137884 | Dec 1983 | JPX |
60-35524 | Feb 1985 | JPX |
62-43160 | Feb 1987 | JPX |
1-207955 | Aug 1989 | JPX |
61-253839 | Nov 1989 | JPX |
2-65265 | Mar 1990 | JPX |
2-251146 | Oct 1990 | JPX |
4-56358 | Feb 1992 | JPX |
5-109977 | Apr 1993 | JPX |
2237691 | May 1991 | GBX |
Entry |
---|
IBM Technical Disclosure Bulletin, Terminal Clip For Printed Circuit Card by D.O. Johnson, Jr.; vol. 9 No. 10, Mar. 1967, p. 1306. |
IBM Disclosure Bulletin "Semiconductor Device Carrier for Modules" by McMahon, Jr. vol. 18 No. 5, Oct., 1975 pp. 1440 and 1441. |
IBM Technical Disclosure Bulletin "Surface Solder Package" vol. 30, No. 3 Aug. 1987 (pp.1240 and 1241. |
IBM Technical Disclosure Bulletin "Stud Structure of Carrier for Flip-Chip Attachment Packaging" vol. 37 No. 04B pp. 113 and 114, Apr. 1994. |
Number | Date | Country | |
---|---|---|---|
Parent | 541397 | Oct 1995 |
Number | Date | Country | |
---|---|---|---|
Parent | 265299 | Jun 1994 |