This application relates to micro-electro-mechanical system (MEMS) devices and processes, and in particular to a MEMS device and process relating to a transducer, for example a capacitive microphone.
MEMS devices are becoming increasingly popular. MEMS transducers, and especially MEMS capacitive microphones, are increasingly being used in portable electronic devices such as mobile telephone and portable computing devices.
Microphone devices formed using MEMS fabrication processes typically comprise one or more moveable membranes and a static backplate, with a respective electrode deposited on the membrane(s) and backplate, wherein one electrode is used for read-out/drive and the other is used for biasing. A substrate supports at least the membrane(s) and typically the backplate also. In the case of MEMS pressure sensors and microphones the read out is usually accomplished by measuring the capacitance between the membrane and backplate electrodes. In the case of transducers, the device is driven, i.e. biased, by a potential difference provided across the membrane and backplate electrodes.
The capacitive microphone is formed on a substrate 105, for example a silicon wafer which may have upper and lower oxide layers 106, 107 formed thereon. A cavity 108 in the substrate and in any overlying layers (hereinafter referred to as a substrate cavity) is provided below the membrane, and may be formed using a “back-etch” through the substrate 105. The substrate cavity 108 connects to a first cavity 109 located directly below the membrane. These cavities 108 and 109 may collectively provide an acoustic volume thus allowing movement of the membrane in response to an acoustic stimulus. Interposed between the first and second electrodes 102 and 103 is a second cavity 110. A plurality of holes, hereinafter referred to as bleed holes 111, connect the first cavity 109 and the second cavity 110. The bleed holes act to equalise the pressure between the first cavity 109 and the second cavity 110, and may also be referred to as pressure equalisation holes.
A plurality of acoustic holes 112 are arranged in the back-plate 104 so as to allow free movement of air molecules through the back plate, such that the second cavity 110 forms part of an acoustic volume with a space on the other side of the back-plate. The membrane 101 is thus supported between two volumes, one volume comprising cavities 109 and substrate cavity 108 and another volume comprising cavity 110 and any space above the back-plate. These volumes are sized such that the membrane can move in response to the sound waves entering via one of these volumes. Typically the volume through which incident sound waves reach the membrane is termed the “front volume” with the other volume being referred to as a “back volume”. Typically, for MEMS microphones and the like, the first and second volumes are connected by one or more flow paths, such as small holes in the membrane, that are configured so as present a relatively high acoustic impedance at the desired acoustic frequencies but which allow for low-frequency pressure equalisation between the two volumes to account for pressure differentials due to temperature changes or the like.
In some applications the backplate may be arranged in the front volume, so that incident sound reaches the membrane via the acoustic holes 112 in the backplate 104. In such a case the substrate cavity 108 may be sized to provide at least a significant part of a suitable back-volume. In other applications, the microphone may be arranged so that sound may be received via the substrate cavity 108 in use, i.e. the substrate cavity forms part of an acoustic channel to the membrane and part of the front volume. In such applications the backplate 4 forms part of the back-volume which is typically enclosed by some other structure, such as a suitable package.
It should also be noted that whilst
In use, in response to a sound wave corresponding to a pressure wave incident on the microphone, the membrane is deformed slightly from its equilibrium or quiescent position. The distance between the membrane electrode 102 and the backplate electrode 103 is correspondingly altered, giving rise to a change in capacitance between the two electrodes that is subsequently detected by electronic circuitry (not shown).
The membrane layer and thus the flexible membrane of a MEMS transducer generally comprises a thin layer of a dielectric material—such as a layer of crystalline or polycrystalline material. The membrane layer may, in practice, be formed by several layers of material which are deposited in successive steps. Thus, the flexible membrane 101 may, for example, be formed from silicon nitride Si3N4 or polysilicon. Crystalline and polycrystalline materials have high strength and low plastic deformation, both of which are highly desirable in the construction of a membrane.
The membrane electrode 102 of a MEMS transducer is typically a thin layer of metal, e.g. aluminium, which is typically located in the centre of the flexible membrane 101. The centre of the membrane is the part of the membrane which typically displaces the most due to incident pressure waves. It will be appreciated by those skilled in the art that the membrane electrode may be formed by depositing a metal alloy such as aluminium-silicon for example. The membrane electrode may typically cover, for example, around 40% of area of the membrane, usually in the central region of the membrane. The membrane electrode is typically of the same outline shape as the flexible membrane upon which the membrane electrode is located; for example, a circular flexible membrane would typically have a circular membrane electrode, as shown in
In order to allow the displacement of the flexible membrane to be monitored, capacitive microphones comprise systems for monitoring the variation in capacitance between the electrode on the flexible membrane and the electrode on the backplate, as discussed above. The sensitivity of the capacitive microphone is proportional to the change in capacitance (caused by changes in the separation between the electrodes due to movement of the flexible membrane) divided by the total capacitance. Although increasing the amount of electrode material, typically a thin layer of metal, on the flexible membrane can increase the absolute change in capacitance for a given flexible membrane movement, increasing the amount of electrode material can also increase the total capacitance and reduce the flexibility of the membrane, thereby negatively impacting upon the capacitive microphone performance.
The present disclosure relates to MEMS transducers comprising flexible membranes, the flexible membranes comprising membrane electrodes, wherein the membrane electrodes are configured to optimise the electrodes to maximise the variation in capacitance with flexible membrane movement (for a given total capacitance), and thereby provide the best possible capacitive sensitivity for a given electrode area.
According to an embodiment of an aspect there is provided a MEMS transducer comprising a flexible membrane and a backplate, a membrane electrode being located on a polygon shaped first surface of the flexible membrane, and a backplate electrode being located on a first surface of the backplate facing the membrane electrode, wherein at least one of the membrane electrode and the backplate electrode has an outline shape configured to correspond to a contour of a contour map, the contour map representing relative amounts of displacement of portions of the flexible membrane from an equilibrium position in response to pressure differences generated by incident sound waves. Matching the outline shape of the electrode to a contour of the contour map allows the capacitive sensing capabilities of a capacitor formed using the membrane electrode and backplate electrode to be optimised. This is particularly the case where the outline shape corresponds to a contour representing points of the flexible membrane of equal displacement from the equilibrium position.
The MEMS transducer may further comprise a substrate and a membrane layer, the membrane layer comprising the flexible membrane. Further, the perimeter of the flexible membrane may be defined by a fixed edge of the flexible membrane connected to the substrate, or the membrane layer may comprise one or more slits which border unfixed edges of the flexible membrane, such that the perimeter of the flexible membrane is defined by one or more fixed edges of the flexible membrane connected to the substrate and one or more unfixed edges of the flexible membrane. Use of only fixed edges, or a combination of fixed and unfixed edges, allows the MEMS transducer to be adapted to be suitable to a broad range of applications.
The first surface of the flexible membrane may be rectangular (including square), or may be octagonal. When the first surface of the flexible membrane is an octagon, this octagon may have edges of a first length and edges of a second length, the edges of the first length and the edges of the second length alternating around the perimeter of the first surface of the flexible membrane. Rectangular (including square) flexible membranes can maximise the flexible membrane area relative to the area on the chip available for the flexible membrane, while octagonal flexible membranes can be particularly resilient.
Where the membrane electrode has an outline shape configured to correspond to the contour of the contour map, the outline shape of the membrane electrode may be selected such that the volume displaced by the membrane electrode, when the maximum membrane displacement distance from an equilibrium position is 10% of the mean diameter of the first surface of the flexible membrane, is at least 80% of the volume displaced by an identical electrode displaced pistonically by the maximum membrane displacement distance. This allows an optimal balance of membrane area and electrode shape to allow good sensing behaviour.
The contour map may represent the relative amounts of displacement of portions of the flexible membrane from the equilibrium position in response to pressure differences generated by sound waves having a frequency which is lower than the fundamental resonant frequency of the flexible membrane, or the displacement in response to pressure differences generated by sound waves having a frequency which is equal to or higher than the fundamental resonant frequency of the flexible membrane. In this way, the membrane can be optimised for intended use.
According to further embodiments of aspects there are provided:
According to a further embodiment of an aspect there is provided a method of forming a MEMS transducer comprising a flexible membrane and a backplate, a membrane electrode being located on a polygon shaped first surface of the flexible membrane, and a backplate electrode being located on a first surface of the backplate facing the membrane electrode, the method comprising:
Features of any given aspect may be combined with the features of any other aspect and the various features described herein may be implemented in any combination in a given embodiment.
Associated methods of fabricating a MEMS transducer are provided for each of the above aspects and examples described herein.
The invention is described, by way of example only, with reference to the following Figures, in which:
FIG. 5C1 is an optimised electrode outline shape based on the contour map of
FIG. 5C2 is a further optimised electrode outline shape based on the contour map of
A flexible membrane is typically key to a MEMS device configured as a sensing apparatus, for example a microphone. The flexible membrane may be formed as part of a larger membrane layer, and the shape of the flexible membrane may be determined by the shape of the connection between the flexible membrane and the rest of the membrane layer, that is, where the membrane layer is connected to a substrate of the MEMS transducer. The flexible membrane can be formed such that the first surface of the flexible membrane has any shape, determined by the particular requirements of a given MEMS transducer in a MEMS device configured to operate as a microphone. For example, a flexible membrane having a square shape (such that the surface facing a backplate electrode is square) may be used, in order to maximise the sensing surface area relative to the total area occupied by the MEMS device.
When pressure waves (such as sound waves) cause the deflection (displacement) of the flexible membrane from an equilibrium (or quiescent) position, the amount of displacement is not uniform across the flexible membrane. This is because the edge of the flexible membrane is held in a fixed position around at least a part of the flexible membrane perimeter, and in some examples around the entirety of the flexible membrane perimeter, and therefore the membrane displacement in response to an incident pressure wave is restricted. Accordingly, the amount of displacement of a given point on the flexible membrane from an equilibrium position is partially determined by the separation of the given point from fixed edges of the flexible membrane.
Typically, membrane electrodes are formed with the same outline shape as the flexible membrane (so a square flexible membrane would include a square membrane electrode). Using a membrane electrode of the same outline shape as the flexible membrane allows the area of the flexible membrane surface occupied by the membrane electrode to be maximised (which can help increase the variation in capacitance with displacement of the capacitive monitoring system and can also assist in providing a predictable membrane response to incident pressure waves). However, the most efficient form of membrane electrode displacement for capacitive variation sensing (and hence microphone sensitivity) is pistonic displacement. Pistonic displacement refers to an idealised situation where the entirety of the electrode is deflected by an equal amount relative to an equilibrium position (such that the electrode remains flat when deflected). For a flexible membrane having edge(s) held in a fixed position (as discussed above), it is not possible for the entire flexible membrane to displace pistonically; the fixed edge or edges mean that the amount of displacement will always vary across the membrane surface. Accordingly, pistonic displacement is an idealised version of a real world situation.
In
In
Both
It is possible to define how closely the displacement of a real membrane electrode corresponds to that of an idealised pistonic displacement by considering the “flatness” of the electrode when displaced. A flatness value F for a given membrane electrode on a given flexible membrane can be obtained by dividing the volume displaced by the electrode VR by the volume displaced by an identical electrode moving pistonically VP; F=VR/VP. For example, if the curvature of a flexible membrane of given dimensions under displacement means that the value of VR is 60% of the value of VP, then the flatness value F for the given membrane electrode on the given flexible membrane would be 0.6. Preferably a flatness value of at least 0.8 is provided by an optimised flexible membrane outline shape when the maximum membrane displacement distance from an equilibrium position is 10% of the mean diameter of the first surface of the flexible membrane. This equates to a VR value that is at least 80% of the value of VP.
From
In order to maximises the flatness of the electrode, for a given electrode area and given flexible membrane shape, the membrane electrode may be formed so as to follow the contours of displacement of the membrane. In order to do this, it is first necessary to model the displacement of the electrode. This modelling may be performed using finite element analysis software packages, such as Comsol Multiphysics, Ansys or Coventorware, as known to those skilled in the art. Deflection shapes of suitably constrained solid models in response to static or dynamic loading (simulating incident pressure waves causing flexible membrane deflection) may be used to help determine to optimal membrane shape
The displacement contours of the flexible membrane are dependent upon the shape of the membrane, the locations at which the edges of the flexible membrane are fixed or free (unfixed), and so on. Where the outline shape of the electrode is configured to correspond to a contour of a contour map of the relative displacement of the flexible membrane, the selection of which contour the outline shape of the electrode should be configured to match is determined by the desired membrane electrode area. This is illustrated by
A plan view of the simulated displacement of
The examples shown in
The edges of the flexible membrane may be fixed relative to the remainder of a flexible membrane layer (and also a substrate), as discussed above. Alternatively, some of the edges of the flexible membrane may be unfixed, and the edges may therefore be able to displace relative to a quiescent position when pressure waves are incident upon the flexible membrane. An example of a membrane having fixed and unfixed (free) edges is shown in
The use of unfixed edges significantly alters the displacement of a flexible membrane in response to an incident pressure wave. This is best illustrated by considering the contour maps shown in
FIGS. 5C1 and 5C2 show two different optimised electrode designs, for the same flexible membrane 300. The optimised electrode 400 shown in FIG. 5C1 has a smaller total electrode area than that shown in FIG. 5C2. These Figures illustrate how the selection of a contour from the contour map (using the desired total electrode area) can influence the final shape of the optimised electrode. Total electrode area is a factor that is taken into consideration when designing the optimised electrode. The fixed edges F and unfixed edges U are also shown in FIGS. 5C1 and 5C2.
As the displacement of the membrane electrode approaches pistonic displacement (such that the membrane electrode approaches flatness while displaced), the sensitivity of the capacitive sensing which may be performed using the electrode improves. This is because, where the membrane electrode approaches flatness while displaced, the separation between the displaced membrane electrode and the backplate electrode approaches uniformity across the pair of electrodes. Therefore, the variation in sensed capacitance with variation in incident pressure wave magnitude becomes more linear and predictable with increasing flatness. This is illustrated in
As can be seen in
A configuration wherein only the backplate electrode (and not the membrane electrode) is shaped to match a displacement contour of the flexible membrane may be used, for example, if the entire flexible membrane surface is covered in the membrane electrode, or wherein the flexible membrane itself is conductive and acts as the membrane electrode. To still further improve the sensitivity of the system, both the membrane electrode and the backplate electrode may be configured to have outline shapes that follow a contour of the membrane displacement; ideally the same contour but different contours may also be used.
The electrode (either the membrane electrode, backplate electrode or both) is configured such that the electrode outline shape corresponds to a contour of a contour map, the contour map representing relative amounts of displacement of portions of the flexible membrane from an equilibrium position in response to pressure differences generated by incident sound waves. In order to generate the contour map, at least a portion of the MEMS transducer is first simulated. In particular, the flexible membrane is simulated. The flexible membrane may form part of a larger membrane layer, wherein the membrane layer additionally includes portions which are fixed in position (and are used to anchor the membrane layer to the remainder of a MEMS substrate forming part of the MEMS transducer). Other components of the MEMS transducer may also be simulated, such as the backplate.
Once the flexible membrane has been simulated, modelling of the displacement of the simulated flexible membrane in response to incident sound waves is then performed. MEMS transducers are typically formed with a specific purpose in mind (for example, use in a microphone for detecting human speech). As such, a range within which the amplitude and frequency of the incident sound waves to be detected are likely to fall will be know. This information can be used to ensure that the contour map accurately reflects the expected displacement of a flexible membrane generated in accordance with the simulation.
As a result of the dimensions and rigidity of MEMS transducers, typically the frequency with which the flexible membrane may be caused to oscillate by incident sound waves will be below the fundamental resonant frequency of the flexible membrane. This is generally the case where the flexible membrane is intended for use in a microphone for detecting human speech, as mentioned above. However, for some configurations wherein the membrane is larger or less rigid than usual, or the flexible membrane is intended for use in a microphone for detecting very high frequency sounds (such as ultrasound), the frequency with which the flexible membrane may be caused to oscillate by incident pressure waves may be higher than the fundamental resonant frequency of the flexible membrane. Where the expected oscillations of the flexible membrane are above the fundamental resonant frequency of the flexible membrane, this can significantly alter the relative displacements across the flexible membrane (that is, alter the shape of the contour map), and therefore this is taken into consideration when modelling the displacement of the flexible membrane and producing a contour map.
Based on the displacement across the flexible membrane, a contour map is produced as discussed above. This contour map can then be used to design an outline shape for the membrane electrode, the backplate electrode, or both the membrane electrode and backplate electrode. The decision of which contour of the contour map the outline of the electrode or electrodes should be configured to match is made based upon the desired area of the electrodes (and hence capacitive sensing ability of the system).
When the shape of the electrode or electrodes has been finalised, MEMS transducers are produced in accordance with the design. Any suitable method may be used for forming the MEMS transducers, as will be well known to those skilled in the art.
To provide protection the MEMS transducer will typically be contained within a package, forming a MEMS device (also referred to as a packaged MEMS transducer). The package effectively encloses the MEMS transducer and can provide environmental protection and may also provide shielding for electromagnetic interference (EMI) or the like. The package also provides at least one external connection for outputting the electrical signal to downstream circuitry. For microphones and the like the package will typically have a sound port to allow transmission of sound waves to/from the transducer within the package. Various package designs are known, including “lid” type packages and “laminate” type packages.
In a lid type package, a MEMS transducer is mounted to an upper surface of a package substrate. The package substrate may be PCB (printed circuit board) or any other suitable material. A cover or “lid” is located over the transducer and is attached to the upper surface of the package substrate. The cover may be a metallic lid, a plastic lid, and so on. The package typically encloses the MEMS transducer, however when the MEMS device is configured to act as a microphone, an aperture may be included in the package to provide a sound port and allows acoustic signals to enter the package.
An alternative package type, known as a “laminate” type package, comprises operatively constructed and connected printed circuit boards, such as FR-4 boards, that are mechanically and electrically connected together, using techniques that are well known to those skilled in the art. An example laminate type package may include first, second and third members. The first member may comprise a FR-4 board core having metalized tracks, pads, bonds and a solder mask stop layer for example operatively applied to the upper and lower surfaces thereof. The second member may be disposed in a plane overlying the first member and comprise an FR-4 board coated on an inner/lower surface thereof with metalized tracks, pads and a solder stop layer. The third member (or “interposer member”) may be interposed between the first and second members. In this arrangement, the third member forms at least a part of the side walls of the package. The third member can be considered to comprise a cavity or void such that, when the three members are bonded together e.g. by means of solder pads, bonds and through vias, a space is formed between the lower surface of the second member and an upper surface of the first member, wherein the side walls of the space are partially provided by the cavity edges of the third member. A MEMS transducer and an integrated circuit may be provided within the space, i.e. the cavity or void. In this way, the laminate type package encloses the MEMS transducer. As in the case of the lid type package discussed above, the laminate type package may also include an acoustic port where the MEMS device is configured for use as a microphone.
As those skilled in the art will be aware, MEMS transducer die, are typically produced in large wafers, with each wafer often being used to form several thousand MEMS die. With lid type packaging, it is generally necessary after one, or possibly more, MEMS die has been attached to the package substrate (usually FR4), to attach a lid individually over each MEMS transducer die to form each packaged MEMS transducer, i.e. MEMS device. By contrast, the triple layer structure of the laminate packaging allows all of the MEMS devices to be constructed using combined processes (for example, sealing the interposed layer between the first layer and second layer), before the panel is divided into individual MEMS devices. Using a larger number of combined processes to form the MEMS devices in this way significantly reduces the time and expense relative to the use of lid type packaging; this is commonly referred to as parallel processing.
The flexible membrane may comprise a crystalline or polycrystalline material, such as one or more layers of silicon-nitride Si3N4.
MEMS transducers according to the present examples will typically be associated with circuitry for processing an electrical signal generated as a result of detected movement of the flexible membrane, either by a capacitive sensing technique or by an optical sensing technique. Thus, in order to process an electrical output signal from the microphone, the transducer die/device may have circuit regions that are integrally fabricated using standard CMOS processes on the transducer substrate.
The circuit regions may be fabricated in the CMOS silicon substrate using standard processing techniques such as ion implantation, photomasking, metal deposition and etching. The circuit regions may comprise any circuit operable to interface with a MEMS transducer and process associated signals. For example, one circuit region may be a pre-amplifier connected so as to amplify an output signal from the transducer. In addition another circuit region may be a charge-pump that is used to generate a bias, for example 12 volts, across the two electrodes. This has the effect that changes in the electrode separation (i.e. the capacitive plates of the microphone) change the MEMS microphone capacitance; assuming constant charge, the voltage across the electrodes is correspondingly changed. A pre-amplifier, preferably having high impedance, is used to detect such a change in voltage.
The circuit regions may optionally comprise an analogue-to-digital converter (ADC) to convert the output signal of the microphone or an output signal of the pre-amplifier into a corresponding digital signal, and optionally a digital signal processor to process or part-process such a digital signal. Furthermore, the circuit regions may also comprise a digital-to-analogue converter (DAC) and/or a transmitter/receiver suitable for wireless communication. However, it will be appreciated by one skilled in the art that many other circuit arrangements operable to interface with a MEMS transducer signal and/or associated signals, may be envisaged.
It will also be appreciated that, alternatively, the microphone device may be a hybrid device (for example whereby the electronic circuitry is totally located on a separate integrated circuit, or whereby the electronic circuitry is partly located on the same device as the microphone and partly located on a separate integrated circuit) or a monolithic device (for example whereby the electronic circuitry is fully integrated within the same integrated circuit as the microphone).
Examples described herein may be usefully implemented in a range of different material systems, however the examples described herein are particularly advantageous for MEMS transducers having membrane layers comprising silicon nitride.
It is noted that the example embodiments described above may be used in a range of devices, including, but not limited to: analogue microphones, digital microphones, pressure sensor or ultrasonic transducers. The example embodiments may also be used in a number of applications, including, but not limited to, consumer applications, medical applications, industrial applications and automotive applications. For example, typical consumer applications include portable audio players, laptops, mobile phones, PDAs and personal computers. Example embodiments may also be used in voice activated or voice controlled devices. Typical medical applications include hearing aids. Typical industrial applications include active noise cancellation. Typical automotive applications include hands-free sets, acoustic crash sensors and active noise cancellation.
Features of any given aspect or example embodiment may be combined with the features of any other aspect or example embodiment and the various features described herein may be implemented in any combination in a given embodiment.
Associated methods of fabricating a MEMS transducer are provided for each of the example embodiments.
It should be understood that the various relative terms above, below, upper, lower, top, bottom, underside, overlying, underlying, beneath, etc. that are used in the present description should not be in any way construed as limiting to any particular orientation of the transducer during any fabrication step and/or it orientation in any package, or indeed the orientation of the package in any apparatus. Thus the relative terms shall be construed accordingly.
In the examples described above it is noted that references to a transducer may comprise various forms of transducer element. For example, a transducer may be typically mounted on a die and may comprise a single membrane and back-plate combination. In another example a transducer die comprises a plurality of individual transducers, for example multiple membrane/back-plate combinations. The individual transducers of a transducer element may be similar, or configured differently such that they respond to acoustic signals differently, e.g. the elements may have different sensitivities. A transducer element may also comprise different individual transducers positioned to receive acoustic signals from different acoustic channels.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims. The word “comprising” does not exclude the presence of elements or steps other than those listed in a claim, “a” or “an” does not exclude a plurality, and a single feature or other unit may fulfil the functions of several units recited in the claims. Any reference signs in the claims shall not be construed so as to limit their scope.
Number | Date | Country | Kind |
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1717385.7 | Oct 2017 | GB | national |
Number | Date | Country | |
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62565151 | Sep 2017 | US |