This application claims priority under 35 U.S.C. § 119 to an application entitled “Method for Fabricating Electronic Circuit Module and Integrated Circuit Device and Electronic Circuit Module Using the Method” filed in the Korean Intellectual Property Office on Aug. 9, 2005 and assigned Serial No. 2005-72752, the contents of which are incorporated herein by reference.
1. Field of the Invention
The present invention generally relates to an electronic circuit module in which a plurality of devices are stacked and a method for fabricating the same. More particularly, the present invention relates to a miniaturized electronic circuit module and a method for fabricating the same.
2. Description of the Related Art
With a distribution of portable digital devices and various digital media, multi-functional miniaturized components, electronic circuit modules, and optical integrated circuits are necessary in the modern multi media applications. To this end, a number of devices integrated in a board must be increased. In recent digital devices, Radio Frequency (RF) components for communication are embedded so that capacitance increases inversely proportional to the size of a circuit module.
An embedded Printed Circuit Board (PCB) has been suggested as a means for minimizing the volume of a digital device with a large-capacitance capacitor. In the embedded PCB, a resistor can accommodate most resistances, but the surface mounting of an additional capacitor must be performed to secure the capacitance at a desired level.
It is, therefore, an object of the present invention to provide a circuit module that can satisfy a demand for a large-capacitance capacitor and can be applied to a miniaturized product, and a method for fabricating the circuit module.
According to one aspect of the present invention, there is provided an electronic circuit module including a first board and a second board having printed circuit patterns formed on their facing surfaces, and an electronic device disposed between the first board and the second board and having electrodes connected to the first board and the second board through soldering.
The above features and advantages of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which:
Embodiments of the present invention will now be described in detail with reference to the annexed drawings. For the purposes of clarity and simplicity, a detailed description of known functions and configurations incorporated herein has been omitted for conciseness.
In the embodiment, for easiness in integration and fabrication of an electronic circuit module, soldering is used.
Briefly,
Hereinafter, a process of fabricating the electronic circuit module will be described in details with reference to
The electronic device 230 to be arranged using the tombstone phenomenon through screen printing, chip mounting, and reflow can be placed on the first board 210 and the second board 220. A Surface Mounting Device (SMD) or Bonder may be used as resin.
In the present invention, a fine gap adjustment is allowed through the foregoing steps. For example, when the electronic device 230 is 0402, the gap between the first board 210 and the second board 220 may be adjusted to 400 μm with a tolerance range of ±20 μm. When the electronic device 230 is 0603, the gap between the first board 210 and the second board 220 may be adjusted to 600 μm with a tolerance range of +30 μm. When the electronic device 230 is 1005, the gap between the first board 210 and the second board 220 may be adjusted to 1000 μm with a tolerance range of ±100 μm.
Briefly, the process of fabricating the integrated circuit device 400 in which the electronic circuit module 300 according to the second embodiment includes a first step of forming the electronic circuit module 300, a second step of forming an integrated circuit pattern on a main board 410, a third step of electrically connecting one end of the electronic circuit module 300 to a corresponding portion of the integrated circuit pattern, and a fourth step of integrating a plurality of passive devices 401, 402, and 403 on the main board 410.
In the first step, the electronic circuit module 300 is formed through a tombstone arrangement with at least one electronic devices 331, 332, and 333 between a first board 310 and a second board 320. Circuit patterns 311 and 321 are formed on facing surfaces of the first board 310 and the second board 320. The first step includes first through third sub-steps.
In the first sub-step, the circuit board 311 is formed on the first board 310. In the second sub-step, one of at least two electrodes of each of the electronic devices 331 through 333 is electrically connected to the circuit pattern 311 through a tombstone arrangement.
In the third sub-step, the other electrode of each of the electronic devices 331 through 333 is electrically connected to the second board 320, thus completing the electronic circuit module 300.
In the second step, the integrated circuit pattern is formed on the main board 410. In the third step, one end of the electronic circuit module 300 is electrically connected to a corresponding portion of the integrated circuit pattern. In the fourth step, the plurality of passive devices 401 through 403 is integrated on the main board 410.
As described above, an electronic circuit module according to the present invention can be applied to a device that requires a high-integration mounting, and also a large-capacitance capacitor can be easily integrated in the electronic circuit module. Further, a low-cost process can be implemented by using general-purpose components, and a gap between devices can be finely adjusted.
While the present invention has been shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Number | Date | Country | Kind |
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2005-72752 | Aug 2005 | KR | national |