Claims
- 1. A method for fabricating a hollow package, comprising the steps of:forming a package body having a recess by three-dimensional injection molding of an epoxy resin having a lower thermal coefficient of linear expansion than that of a transparent sealing plate; roughening the entire surface of said package body; forming a wiring layer substantially onto the entire surface of said package body by electroless plating; forming leads by patterning said wiring layer by means of selective etching; receiving a solid state image device into said recess and connecting electrodes of said solid state image device to said leads; and bonding said transparent sealing plate onto an upper surface of said package body with an ultraviolet-curable resin.
- 2. A method for fabricating a hollow package according to claim 1, wherein said low thermal coefficient of linear expansion is 13 ppm or less.
Priority Claims (1)
Number |
Date |
Country |
Kind |
09-185061 |
Jul 1997 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
This applications a divisional of application Ser. No. 09/112,229, field Jul. 9,1998, now U.S. Pat. No. 6,313,525.
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