Number | Name | Date | Kind |
---|---|---|---|
4566177 | van de Ven et al. | Jan 1986 | |
4837183 | Polito et al. | Jun 1989 | |
4970176 | Tracy et al. | Nov 1990 | |
4988423 | Yamamoto et al. | Jan 1991 |
Entry |
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C. Y. Ting:TiN Formed by Evaporation as a Diffusion Barrier Between Al and Si; J. Vac. Science Technology, vol. 21, No. 1, May/Jun. 1982. |
Wolf et al.: Aluminum Thin Films and Physical Vapor Deposition in VLSI; Silicon Processing for the VLSI Era, Lattice Press, 1986, pp. 332-334 and 367-374. |