"Spectroscopic Diagnostics of Temperature-Controlled Trench Etching of Silicon"; Krogh et. al.; Plasma Chem. Plasma Process. (1990'); 10(2); pp. 231-246. |
"Reactive Ion Etching of Copper Films In SiCl.sub.4 and N.sub.2 Mixtures"; Ohno et. al.; Jun. 1989'; Japanese Journal of Applied Physics, vol. 28.; No. 6; pp. L1070-L1072. |
Ohno et al., Reactive Ion Etching of Cooper Films in SiCl.sub.4 and N.sub.2 Mixture, Japanese Journal of Applied Physics, vol. 28, No. 6, Jun. 1978, pp. 11070-1072. |
Krogh et al., Spectroscopic Dianostics of Temperature-Controlled Trench Etching of Silicon, Plasma Chemistry Plasma Processes, 10(2), 1990, pp. 231-233, 239. |
PCT Notification of Transmittal of the International Search Report or the Declaration for PCT/US98/23297, Int'l Filing Date Nov. 3, 1998, mailed Feb. 18, 1999. |