Claims
- 1. A method of forming a bit line plug to an active region, comprising the following steps:
- forming a word line over a semiconductor wafer;
- forming a first active region and a second active region associated with the word line;
- forming a layer of electrically insulating material over the word line and active regions;
- forming a bit line contact opening through the insulating material layer to the second active region;
- forming an electrically conductive layer over the insulating material layer and within the bit line contact opening, the electrically conductive layer within the bit line contact opening ultimately forming a bit line plug; and
- using a single photomasking step, removing portions of the electrically conductive layer and the insulating material to form a capacitor opening to the first active region.
- 2. A method of forming an array of bit line plugs, comprising the following steps:
- forming an array of word lines over a semiconductor wafer;
- forming first and second active regions associated with each of the word lines;
- forming a layer of electrically insulating material over the word lines and active regions;
- forming bit line contact openings through the insulating material layer to the second active regions;
- forming an electrically conductive layer over the insulating material layer and within the bit line contact openings, the electrically conductive layer within the bit line contact openings ultimately forming bit line plugs; and
- using a single photomasking step, removing portions of the electrically conductive layer and the insulating material to form capacitor openings to the first active regions.
- 3. A method of forming a bit line p lug to an active region, comprising the following steps:
- forming a word line over a semiconductor wafer;
- forming a first active region and a second active region associated with the word line;
- forming a layer of electrically insulating material over the word line and active regions, the layer of electrically insulating material comprising an upper surface at a first level, the layer of electrically insulating material comprising borophosphosilicate glass;
- forming a bit line contact opening through the insulating material layer to the second active region;
- forming an electrically conductive layer over the insulating material layer and within the bit line contact opening, the electrically conductive layer within the bit line contact opening ultimately forming a bit line plug;
- forming a capacitor opening through the electrically conductive layer and through the insulating material to the first active region; and
- after forming the capacitor opening, chemical-mechanical polishing the electrically conductive layer to below the first level of the upper surface of the layer of the insulating material.
RELATED PATENT DATA
This patent resulted from a continuation of U.S. Pat. application Ser. No. 08/712,616, now U.S. Pat. No. 5,702,990, filed on Sep. 13, 1996, entitled "Method of Forming a Bit Line Over Capacitor Array of Memory Cells and an Array of Bit Line Over Capacitor Array of Memory Cells", listing Mark Jost and Charles H. Dennison as inventors, which is a continuation of U.S. Pat. application Ser. No. 08/394,546, now U.S. Pat. No. 5,605,857, filed on Feb. 22, 1995, entitled "Method of Forming a Bit Line Over Capacitor Array of Memory Cells and an Array of Bit Line Over Capacitor Array of Memory Cells", listing Mark Jost and Charles H. Dennison as inventors; which is a continuation-in-part patent application of U.S. Pat. application Ser. No. 08/277,916, filed on Jul. 20, 1994, entitled "Method Of Forming A Bit Line Over Capacitor Array Of Memory Cells", listing Charles H. Dennison as an inventor, and which is now U.S. Pat. No. 5,401,681; which is a continuation-in-part of Ser. No. 47,668, Apr. 14, 1993, Pat. No. 5,338,700; and a continuation-in-part of Ser. No. 17,067, Feb. 12, 1993, Pat. No. 5,340,763.
US Referenced Citations (22)
Foreign Referenced Citations (11)
Number |
Date |
Country |
263-941 |
Aug 1987 |
EPX |
0-439-965-A3 |
Dec 1990 |
EPX |
0-439-965-A2 |
Dec 1990 |
EPX |
63-281457 |
Nov 1988 |
JPX |
64-41262 |
May 1989 |
JPX |
02260454 |
Jan 1991 |
JPX |
3-38061 |
Apr 1991 |
JPX |
3-82155 |
Apr 1991 |
JPX |
3-76159 |
Apr 1991 |
JPX |
4-045571 |
Feb 1992 |
JPX |
4-99375 |
Mar 1992 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Ahn, J.H., et al., "Micro Villus Patterning (MVP) Technology for 256Mb Dram Stack Cell", 1992 Symposium on VLSI Technology Digest of Technical Papers, pp. 12-13. |
Continuations (2)
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712616 |
Sep 1996 |
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Parent |
394546 |
Feb 1995 |
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Continuation in Parts (2)
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277916 |
Jul 1994 |
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047668 |
Apr 1993 |
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