Claims
- 1. A method of making liquid crystalline polymer-copper laminates comprising laminating liquid crystalline polymer film to a copper foil, wherein the copper foil has a surface concentration of zinc of about 0.01 to about 2 atomic %, based on surface atomic concentration.
- 2. The method of claim 1, wherein concentration of zinc is about 0.01 to about 1 atomic %.
- 3. The method of claim 1, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 4. The method of claim 1, wherein the copper foil has a thickness of about 1 to about 72 micrometers.
- 5. The method of claim 4, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 6. The method of claim 1, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
- 7. A method of making liquid crystalline polymer-copper laminates comprising laminating liquid crystalline polymer film to a copper foil, wherein the copper foil has a surface concentration of zinc of less than or equal to about 2 atomic %, based on surface atomic concentration.
- 8. The method of claim 7, wherein the concentration of zinc is up to about 1 atomic %.
- 9. The method of claim 7, wherein the concentration of zinc is zero.
- 10. The method of claim 7, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 11. The method of claim 7, wherein the copper foil has a thickness of about 1 to about 72 micrometers.
- 12. The method of claim 11, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 13. The method of claim 7, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
- 14. A laminate comprising:
a copper foil and a liquid polymer film laminated thereto, wherein the copper foil has a surface concentration of zinc of about 0.01 to about 2 atomic %, based on surface atomic concentration;.
- 15. The laminate of claim 14, wherein the concentration of zinc is about 0.01 to about 1 atomic %.
- 16. The laminate of claim 14, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 17. The laminate of claim 14, wherein the copper foil has a thickness of about 1 to about 72 micrometers.
- 18. The laminate of claim 17, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 19. The laminate of claim 14, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
- 20. The laminate of claim 14, wherein the percent loss of peel strength is less than or equal to 35% after being aged at 105° C. and 5 pounds (2.3 kilograms) of pressure for 48 hours.
- 21. The laminate of claim 14, wherein the percent loss of peel strength is less than or equal to 30% after being aged at 105° C. and 5 pounds (2.3 kilograms) of pressure for 48 hours.
- 22. A laminate comprising:
a copper foil and a liquid polymer film laminated thereto, wherein the copper foil has a surface concentration of zinc of less than or equal to about 2 atomic %, based on surface atomic concentration.
- 23. The laminate of claim 22, wherein concentration of zinc is up to about 1 atomic %.
- 24. The laminate of claim 22, wherein the concentration of zinc is zero.
- 25. The laminate of claim 22, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 26. The laminate of claim 22, wherein the copper foil has a thickness of about 1 to about 50 micrometers.
- 27. The laminate of claim 26, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 28. The laminate of claim 22, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
- 29. A circuit board material comprising a copper foil and a liquid polymer film laminated thereto, wherein the copper foil has a surface concentration of zinc of about 0.01 to about 2 atomic %, based on surface atomic concentration;.
- 30. The circuit board material of claim 29, wherein the concentration of zinc is about 0.01 to about 1 atomic %.
- 31. The circuit board material of claim 29, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 32. The circuit board material of claim 29, wherein the copper foil has a thickness of about 1 to about 50 micrometers.
- 33. The circuit board material of claim 32, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 34. The circuit board material of claim 29, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
- 35. A circuit board material comprising:
a copper foil and a liquid polymer film laminated thereto, wherein the copper foil has a surface concentration of zinc of less than or equal to about 2 atomic %, based on surface atomic concentration.
- 36. The circuit board material of claim 35, wherein the concentration of zinc is up to about 1 atomic %.
- 37. The circuit board material of claim 35, wherein the concentration of zinc is zero.
- 38. The circuit board material of claim 35, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 39. The circuit board material of claim 35, wherein the copper foil has a thickness of about 1 to about 50 micrometers.
- 40. The circuit board material of claim 39, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 41. The circuit board material of claim 35, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
- 42. A method of making liquid crystalline polymer-copper laminates comprising laminating liquid crystalline polymer film to a copper foil, wherein the copper foil has a surface concentration of zinc of about 0.01 to about 2 atomic %, and a surface concentration of chromium of about 0.01 to about 4 atomic %, based on surface atomic concentration.
- 43. The method of claim 42, wherein concentration of zinc is about 0.01 to about 1 atomic %.
- 44. The method of claim 42, wherein the concentration of chromium is about 0.01 to about 3 atomic %.
- 45. The method of claim 42, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 46. The method of claim 42, wherein the copper foil has a thickness of about 1 to about 72 micrometers.
- 47. The method of claim 46, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 48. The method of claim 42, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
- 49. A method of making liquid crystalline polymer-copper laminates comprising laminating liquid crystalline polymer film to a copper foil, wherein the copper foil has a surface concentration of zinc of less than or equal to about 2 atomic % and a surface concentration of chromium of less than or equal to about 4 atomic % based on surface atomic concentration.
- 50. The method of claim 49, wherein the concentration of zinc is up to about 1 atomic %.
- 51. The method claim 49, wherein the concentration of chromium is up to about 3 atomic %.
- 52. The method of claim 49, wherein the concentration of zinc, the concentration of chromium, or both is zero.
- 53. The method of claim 49, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 54. The method of claim 49, wherein the copper foil has a thickness of about 1 to about 72 micrometers.
- 55. The method of claim 54, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 56. The method of claim 49, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
- 57. A laminate comprising:
a copper foil and a liquid polymer film laminated thereto, wherein the copper foil has a surface concentration of zinc of about 0.01 to about 2 atomic %, and a surface concentration of chromium of about 0.01 to about 4 atomic %, based on surface atomic concentration;.
- 58. The laminate of claim 57, wherein the concentration of zinc is about 0.01 to about 1 atomic %.
- 59. The laminate of claim 57, wherein the concentration of chromium is about 0.01 to about 3 atomic %.
- 60. The laminate of claim 57, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 61. The laminate of claim 57, wherein the copper foil has a thickness of about 1 to about 72 micrometers.
- 62. The laminate of claim 61, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 63. The laminate of claim 57, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
- 64. The laminate of claim 57, wherein the percent loss of peel strength is less than or equal to 35% after being aged at 105° C. and 5 pounds (2.3 kilograms) of pressure for 48 hours.
- 65. The laminate of claim 57, wherein the percent loss of peel strength is less than or equal to 30% after being aged at 105° C. and 5 pounds (2.3 kilograms) of pressure for 48 hours.
- 66. A laminate comprising:
a copper foil and a liquid polymer film laminated thereto, wherein the copper foil has a surface concentration of zinc of less than or equal to about 2 atomic % and a surface concentration of chromium of less than or equal to about 4 atomic %, based on surface atomic concentration;.
- 67. The laminate of claim 66, wherein the concentration of zinc is up to about 1 atomic %.
- 68. The laminate of claim 66, wherein the concentration of chromium is up to about 3 atomic %.
- 69. The laminate of claim 66, wherein the concentration of zinc, the concentration of chromium, or both is zero.
- 70. The laminate of claim 66, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 71. The laminate of claim 66, wherein the copper foil has a thickness of about 1 to about 50 micrometers.
- 72. The laminate of claim 71, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 73. The laminate of claim 66, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
- 74. A circuit board material comprising:
a copper foil and a liquid polymer film laminated thereto, wherein the copper foil has a surface concentration of zinc of about 0.01 to about 2 atomic %, and a surface concentration of chromium of about 0.01 to about 4 atomic %, based on surface atomic concentration;.
- 75. The circuit board material of claim 74, wherein the concentration of zinc is about 0.01 to about 1 atomic %.
- 76. The circuit board material of claim 74, wherein the cocentration of chromium is about 0.01 to about 3 atomic %.
- 77. The circuit board material of claim 74, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 78. The circuit board material of claim 74, wherein the copper foil has a thickness of about 1 to about 50 micrometers.
- 79. The circuit board material of claim 78, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 80. The circuit board material of claim 74, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
- 81. A circuit board material comprising:
a copper foil and a liquid polymer film laminated thereto, wherein the copper foil has a surface concentration of zinc of less than or equal to about 2 atomic % and a surface concentration of chromium of less than or equal to about 4 atomic %, based on surface atomic concentration.
- 82. The circuit board material of claim 81, wherein the concentration of zinc is up to about 1 atomic %.
- 83. The circuit board material of claim 81, wherein the concentration of chromium is up to about 3 atomic %.
- 84. The circuit board material of claim 81, wherein the concentration of zinc, the concentration of chromium, or both is zero.
- 85. The circuit board material of claim 81, wherein the liquid crystalline polymer film comprises a hydroxy benzoate/hydroxynapthoate copolymer having a thickness of about 25 micrometers to about 500 micrometers.
- 86. The circuit board material of claim 81, wherein the copper foil has a thickness of about 1 to about 50 micrometers.
- 87. The circuit board material of claim 86, wherein the copper foil has a thickness of about 5 to about 40 micrometers.
- 88. The circuit board material of claim 81, wherein the copper foil further comprises a dendritic layer, a hydrophobic layer or both.
CROSS REFERENCE TO RELATED APPLLICATION
[0001] This application is based on, and claims benefit of U.S. Provisional Patent Application Ser. No. 60/210,311, filed Jun. 8, 2000, the disclosures of which are herein incorporated by reference in their entirety.
Provisional Applications (1)
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Number |
Date |
Country |
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60210311 |
Jun 2000 |
US |