"Liquid Crystal Display Products", Product Brochure, Standish LCD, Division of Standish Industries, Inc., pp. 5-6. |
"Process-Stabilized Extrude Bonding Wire and Ribbon", Product Brochure, Hydrostatics Inc., Bethlehem PA, (Jun. 1991). |
Kondoh, You et al., "A Subminiature CCD Module Using a New Assembly Technique", IEICE Transactions, vol.E 74, No. 8 Aug. 1991. |
Cohen, I.M. et al. "Ball Formation Processes in Aluminum Bonding Wire", Solid State Technology, pp. 89-92, Dec. 1985. |
Levy, F. et al. "Phosphors for Full Color Microtips Fluorescent Displays", pp. 20-23, IEEE, 1991. |
Kang, Sa-Yoon et al. "Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process", Journal of Electronic Packaging, pp. 63-70, Mar. 1993. |
Charles, Jr., H.K. "Electronic Materials Handbook--vol. 1 Packaging", Product Brochure, ASM International. |
IBM Technical Disclosure, "Direct Chip Bonding For Liquid Crystal Display", vol. 34, No. 5, Oct. 1991 pp. 183-184. |