Claims
- 1. A method of polishing a surface of a semiconductor wafer comprising the steps of:
(a) providing a polishing pad having a polishing surface comprising a multiplicity of one type of abrasive particle in said polishing surface; (b) holding said wafer in a carrier such that said wafer surface is in contact with said polishing surface; (c) moving said carrier and/or said polishing surface to provide both pressure on said wafer surface and relative lateral motion between said wafer surface and said polishing surface; and (d) providing a reactive liquid solution essentially free from particulate matter at an interface between said wafer surface and said polishing surface, wherein a change in polishing conditions is effected by changing the ionic strength of said reactive liquid solution.
- 2. The method according to claim 1 wherein said abrasive particles are metal oxide.
- 3. The method according to claim 1 further comprising the step of recirculating said reactive liquid solution through said interface.
- 4. The method according to claim 1 wherein said polishing pad is a solid polymer sheet containing abrasive particles.
- 5. The method according to claim 1 wherein said polishing surface comprises a multiplicity of two or more types of abrasive particles.
- 6. The method according to claim 5 wherein said types of abrasive particles are from the group consisting of metal oxides such as alumina, chromia, zirconia, silica, iron oxide, ceria, magnesium oxide, and titania.
Parent Case Info
[0001] This Application, which claims the benefit of Provisional Application Ser. No. 60,196,672 filed Apr. 12, 2000, is a Continuation-in-Part of copending application Ser. No. 09/776,279 filed Feb. 2, 2001, which is a Continuation of application Ser. No. 09/634,788 filed Aug. 9, 2000, U.S. Pat. No. 6,210,525, which is a Continuation of application Ser. No. 09/498,267 filed Feb. 3, 2000, which is a Continuation-in-Part of application Ser. No. 09/363,540 filed Jul. 29, 1999, U.S. Pat. No. 6,030,899, which is a Continuation of application Ser. No. 08/912,144 filed Aug. 15, 1997, U.S. Pat. No. 5,932,486, which claims priority from U.S. Provisional Application No. 60/024,114 filed Aug. 16, 1996, said application Ser. No. 09/498,267 filed Feb. 3, 2000 is also a Continuation-in-Part of application Ser. No. 09/384,607, abandoned, which is a Continuation of U.S. application Ser. No. 09/049,864 filed Mar. 27, 1998, U.S. Pat. No. 6,099,394, which claims priority from U.S. Provisional Applications Ser. No. 60/042,115 filed Mar. 28, 1997, Ser. No. 60/041,844 filed Apr. 9, 1997, and Ser. No. 60/064,875 filed Nov. 6, 1997 and which is a Continuation-in-Part of U.S. application Ser. No. 09/021,437 filed Feb. 10, 1998, U.S. Pat. No. 6,022,264, which claims priority from U.S. Provisional Application Ser. No. 60/037,582.
Provisional Applications (6)
|
Number |
Date |
Country |
|
60196672 |
Apr 2000 |
US |
|
60024114 |
Aug 1996 |
US |
|
60042115 |
Mar 1997 |
US |
|
60041844 |
Apr 1997 |
US |
|
60064875 |
Nov 1997 |
US |
|
60037582 |
Feb 1997 |
US |
Continuations (5)
|
Number |
Date |
Country |
Parent |
09634788 |
Aug 2000 |
US |
Child |
09776279 |
Feb 2001 |
US |
Parent |
09498267 |
Feb 2000 |
US |
Child |
09634788 |
Aug 2000 |
US |
Parent |
08912144 |
Aug 1997 |
US |
Child |
09363540 |
Jul 1999 |
US |
Parent |
09049864 |
Mar 1998 |
US |
Child |
09384607 |
Aug 1999 |
US |
Parent |
09021437 |
Feb 1998 |
US |
Child |
09384607 |
Aug 1999 |
US |
Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
09776279 |
Feb 2001 |
US |
Child |
09833309 |
Apr 2001 |
US |
Parent |
09363540 |
Jul 1999 |
US |
Child |
09498267 |
Feb 2000 |
US |