Claims
- 1. A substrate polishing apparatus comprising:
- a first holding member which holds a polishing member to polish a surface of a film formed on a substrate;
- a second holding member which holds the substrate such that the film surface on said substrate, when being polished, contacts the polishing member;
- a rotary member, connected to at least one of said first holding member and said second holding member, which rotates said first holding member and said second holding member relatively with respect to each other; and
- a change-over system, connected to said rotary member, which changes the direction of relative rotation between said first holding member and said second holding member during polishing of said substrate.
- 2. A substrate polishing apparatus according to claim 1, wherein said change-over system changes the direction of rotation by a predetermined interval time.
- 3. A substrate polishing apparatus according to claim 1, wherein said change-over system changes the direction of rotation by a predetermined number of revolutions.
- 4. A substrate polishing apparatus having a polishing member which contacts a surface of a film formed on a substrate when polishing the substrate, said apparatus comprising:
- a first holding member which holds the polishing member;
- a second holding member which holds the substrate;
- a rotary member, connected to at least one of said first holding member and said second holding member, which rotates said first holding member and said second holding member relatively during polishing the substrate; and
- a controller, connected to said rotary member, which controls the rotation of said rotary member so that said polishing member carrying out polishing of the substrate by first direction of rotation and polishing of the substrate by second direction of rotation opposite to the first direction.
- 5. The apparatus according to claim 4, wherein
- said controller changes the direction of relative rotation between said first holding member and said second holding member during polishing said substrate.
Priority Claims (2)
Number |
Date |
Country |
Kind |
6-134006 |
Jun 1994 |
JPX |
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6-183002 |
Jul 1994 |
JPX |
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Parent Case Info
This application is a continuation of prior application Ser. No. 08/759,326 filed Dec. 2, 1996; which is a divisional of Ser. No. 08/457,232 filed Jun. 1, 1995, now U.S. Pat. No. 5,601,957.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5435772 |
Yu |
Jul 1995 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
457232 |
Jun 1995 |
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Continuations (1)
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Number |
Date |
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Parent |
759326 |
Dec 1996 |
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