Technical Field
The disclosure relates to a micro-electromechanical (MEMS) apparatus, and more particularly, to an MEMS apparatus having a central anchor.
Background
In recent years, because electronic products, such as smart phones, tablet PCs, interactive game consoles, and etc., have started using micro-electromechanical (MEMS) inertial sensing elements (such as an accelerometer and gyroscope), a market demand for the MEMS inertial sensing elements has grown rapidly. On the condition that the process technology and related products for the accelerometer have become relatively matured, process yield during mass production has become an important competitive factor in the market of the MEMS inertial sensors.
In terms of MEMS apparatus manufacturing, one of the currently encountered problems is that: when using the wafer-to-wafer process to manufacture the MEMS apparatus or during the subsequent operation of the MEMS apparatus, a substrate will warp due to thermal stress. For instance, in a conventional MEMS apparatus 100 as shown in
The disclosure is directed to a micro-electromechanical (MEMS) apparatus which is able to reduce the effect caused by warpage of a substrate, increase process yield and product reliability, and improve measurement accuracy.
The disclosure is directed to an MEMS apparatus which is able to reduce the number of anchors used and minimize an area of the MEMS apparatus.
According to one of exemplary embodiments, an MEMS apparatus includes a substrate, two first anchors, a frame, and two elastic members. The two first anchors are disposed on the substrate, and a distance from each of the first anchors to a reference point of the substrate is equal. In addition, the frame surrounds the two first anchors, and each of the two first anchors is connected to the frame through one of the corresponding two elastic members. The distance from each of the first anchors to the reference point is less than a distance from each of the first anchors to the frame.
According to one of exemplary embodiments, another MEMS apparatus includes a substrate, two first anchors, a frame, at least one central mass, and two elastic members. The two first anchors are disposed on the substrate, and a distance from each of the first anchors to a reference point of the substrate is equal. The frame surrounds the two first anchors. The at least one central mass includes a central portion and at least one side portion. Each of the two first anchors is connected to the frame through one of the corresponding two elastic members, and the distance from each of the first anchors to the reference point is less than a distance from each of the first anchors to the frame.
According to one of exemplary embodiments, another MEMS apparatus adapted for measuring three-axis acceleration is provided. The MEMS apparatus includes a substrate, two first anchors, at least one second anchor, a frame, at least one central mass, and two elastic members. The two first anchors are disposed on the substrate, and a distance from each of the first anchors to a reference point of the substrate is equal. The at least one second anchor is disposed on the substrate. The at least one central mass includes a central portion and at least one side portion. The frame surrounds the two first anchors and the at least one central mass. Each of the two first anchors is connected to the frame through one of the corresponding two elastic members, wherein the distance from each of the first anchors to the reference point is less than a distance from each of the first anchors to the frame. In addition, a distance from the at least one second anchor to the reference point is less than a distance from the at least one second anchor to the frame.
Several exemplary embodiments accompanied with figures are described in detail below to further describe the disclosure in details.
The accompanying drawings are included to provide further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments and, together with the description, serve to explain the principles of the disclosure.
A micro-electromechanical (MEMS) apparatus of the disclosure is suitable for measuring physical quantities of inertia, i.e., measuring physical quantities (e.g., acceleration, angular velocity, a geomagnetic force, a resonance frequency, and so forth) based on inertia of mass. Although several possible implementations are illustrated in the following exemplary embodiments, the actual number, the shape, and the location of the mass or other components of the MEMS apparatus can be changed in response to the occasions of application and the demands and are not limited by the following exemplary embodiments. Modifications and variations based on these exemplary embodiments of the disclosure can be made by people having ordinary skill in the pertinent art according to the level of technology at the time of the application after they are exposed to the contents of the disclosure.
The two elastic members 240 respectively connect the corresponding first anchors 230 and the frame 220, so that the frame 220 can be suspended above the substrate 210. In addition, the distance L1 from each of the first anchors 230 to the reference point P is less than a distance L2 from each of the first anchors 230 to the frame 220. In other words, as compared to the frame 220, the first anchors 230 are closer to the reference point P.
In the present embodiment, the two elastic members 240 may be two torsional beams, so that the frame 220 can be rotated along the elastic members 240. As such, the frame 220 may, for example, be applied for sensing a Z-axis acceleration perpendicular to the plane of the substrate 210. In other exemplary embodiments of the disclosure, the elastic members 240 may also be elastic members such as connecting rods, springs (e.g., folding springs), or so forth.
In the present embodiment, the first anchors 230 are disposed near the central position of the MEMS apparatus 200 to reduce effects caused by the warpage of the substrate 210 during a wafer-to-wafer bonding process, which helps facilitate an increase in process yield. More specifically, when the distance L1 from each of the first anchors 230 to the reference point P is less than the distance L2 from each of the first anchors 230 to the frame 220, the two elastic members 240 (e.g., torsion beams) may not be affected significantly by the warpage of the substrate 210. Thus, the MEMS apparatus 200 provides high accuracy of Z-axis acceleration measurement. To further reduce the aforementioned effect, several locations of the first anchors 230 are disclosed in the present embodiment. As shown in
For example, the two elastic members 240 may be torsion beams as shown in
Furthermore, in the present embodiment, one or more masses may be selectively disposed in the frame 220 to measure the different physical quantities such as accelerations in the X-axial direction and the Y-axial direction. As shown in
In the present embodiment, the frame 320 is suspended above the substrate 310 via the two elastic members 340 that serve as the torsional beams which enable the frame 320 to measure a Z-axis acceleration. On the other hand, the central mass 350 is surrounded by the frame 320 and connected to the frame 320 via a plurality of springs 360 (e.g., folded springs). The central mass 350 is used to measure an X-axis acceleration and a Y-axis acceleration simultaneously.
In addition, the present embodiment further includes one or a plurality of second anchors 370 and one or a plurality of stationary electrodes 380 which are used for measuring the X-axis acceleration and the Y-axis acceleration. More specifically, as shown in
In the present embodiment, a distance L4 from each of the second anchors 370 to the reference point P is less than a distance from each of the second anchors 370 to the frame 320. More specifically, the distance from each of the second anchors 370 to the frame 320 is defined as the smaller one of two distances (a distance L51 and a distance L52), wherein the distance L51 is defined as the distance from each of the second anchors 370 to the inner side of the frame 320 along the X-axis and the distance L52 is defined as the distance from each of the second anchors 370 to the inner side of the frame 320 along the Y-axis. In other words, in the present embodiment, the second anchors 370 are disposed close to the central region of the MEMS apparatus 300 to reduce the effect caused by warpage of the substrate 310. In addition, the central mass 350 includes a plurality of first finger-shaped structures 359, and each of the stationary electrodes 380 includes a plurality of second finger-shaped structures 389. The capacitance between a plurality of first finger-shaped structures 359 and a plurality of second finger-shaped structures 389 is changed when the central mass 350 is moved. Moreover, the first finger-shaped structures 359 and the second finger-shaped structures 389 corresponding to one opening 354a and the first finger-shaped structures 359 and the second finger-shaped structures 389 corresponding to another opening 354b are disposed in different extending directions in order to measure the accelerations in the X-axial direction and the Y-axial direction.
More specifically, the present embodiment introduces the elastic members 440 with a width variation to prevent the frame 420 from rotating along the Z-axis which affects the accuracy of Z-axis acceleration measurement. Each of the elastic members 440 provided in the present embodiment includes a fixed end 442, a movable end 444, and a connecting portion 446. The fixed end 442 is connected to the corresponding first anchor 430. The movable end 444 is connected to the frame 420. The connecting portion 446 connects the fixed end 442 and the movable end 444. A width W1 of the fixed end 442 (i.e., the maximum width of the fixed end 442) is greater than a width W0 of the connecting portion 446. In the present embodiment, the width of the elastic members 440 is increased from the connecting portion 446 towards the first anchor 430 to prevent the frame 420 from rotating along the Z-axis and to prevent the fixed end 442 from cracking. Therefore, the elastic members 440 with the varied width not only can reduce the stress in the fixed ends 442, but also can maintain the sensitivity of the Z-axis acceleration measurement.
Each of the elastic members 540 provided in the present embodiment includes a fixed end 542, a movable end 544, and a connecting portion 546. The fixed end 542 is connected to the corresponding first anchor 530. The movable end 544 is connected to the frame 520. The connecting portion 546 connects the fixed end 542 and the movable end 544. In the present embodiment, the width of the fixed end 542 and the width of the movable end 544 are increased. A width W2 of the movable end 544 is defined as the maximum width of the movable end 544. The width W2 of the movable end 544 is greater than the width W0 of the connecting portion 546. For example, in the present embodiment, the width of the movable end 544 is gradually increased from the connecting portion 546 towards the frame 520 in order to prevent the movable end 544 and the frame 520 from cracking.
More specifically, the frame 620 in the present embodiment may be an unbalanced mass when a line connecting the two first anchor 630 does not pass through the center of gravity of the frame 620. For instance, as shown in
In summary, the first anchors and the second anchor provided in the disclosure are disposed close to the central region of the MEMS apparatus to reduce the effect of substrate warpage and to increase the process yield. Moreover, in the disclosure, the width of the elastic members can be designed to prevent the frame from rotating along the Z-axis. On the other hand, the MEMS apparatus provided in the disclosure may be applied in an MEMS sensor having a rotatable mass, such as a three-axis accelerometer, a magnetometer, or so forth. In addition, the central mass adapted for sensing the X-axis and Y-axis accelerations may be connected to the frame and is suspended above the substrate through a plurality of springs without using additional anchors. The area of the MEMS apparatus is reduced by reducing the number of the anchor.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure cover modifications and variations of this disclosure provided they fall within the scope of the following claims and their equivalents.
Number | Date | Country | Kind |
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104143997 | Dec 2015 | TW | national |
This application claims the priority benefits of U.S. provisional application Ser. No. 62/271,329, filed on Dec. 28, 2015 and Taiwan application serial no. 104143997, filed on Dec. 28, 2015. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.
Number | Date | Country | |
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62271329 | Dec 2015 | US |