Accelerometers

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B81B2201/0235

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2201/00Specific applications of micro-electromechanical systems

Current Industry

B81B2201/0235Accelerometers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Robust inertial sensor self-test
- Patent number 12,227,409
- Issue date Feb 18, 2025
- Invensense, Inc.
- Aurelio Pellegrini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor MEMS structure
- Patent number 12,221,337
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro electro mechanical system (MEMs) device having metal sealing...
- Patent number 12,202,724
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for suppressing vibration coupled signals in a microphone fo...
- Patent number 12,185,065
- Issue date Dec 31, 2024
- L3HARRIS AVIATION PRODUCTS, INC.
- Michael E. Weed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor with compensation of residual voltage
- Patent number 12,174,215
- Issue date Dec 24, 2024
- Invensense, Inc.
- Giacomo Gafforelli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3-axis angular accelerometer
- Patent number 12,153,065
- Issue date Nov 26, 2024
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective self-assembled monolayer patterning with sacrificial laye...
- Patent number 12,139,397
- Issue date Nov 12, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical sensor device with improved stability to stress
- Patent number 12,139,396
- Issue date Nov 12, 2024
- STMicroelectronics S.r.l.
- Francesco Rizzini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mems device, electronic apparatus, and vehicle
- Patent number 12,130,303
- Issue date Oct 29, 2024
- Seiko Epson Corporation
- Fumiya Ito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertia measurement device, vehicle, and electronic device
- Patent number 12,130,305
- Issue date Oct 29, 2024
- Seiko Epson Corporation
- Yusuke Kinoshita
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interlocking proof mass for mems inertial sensing device
- Patent number 12,129,167
- Issue date Oct 29, 2024
- National Technology & Engineering Solutions of Sandia, LLC
- Paul J. Resnick
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical system device using a metallic movable part...
- Patent number 12,122,665
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tao-Cheng Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device and corresponding production method
- Patent number 12,077,429
- Issue date Sep 3, 2024
- Robert Bosch GmbH
- Lars Tebje
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Analysis method of a device, performed through a MEMS sensor, and s...
- Patent number 12,054,386
- Issue date Aug 6, 2024
- STMicroelectronics S.r.l.
- Enrico Rosario Alessi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and MEMS accelerometer on a single substrate
- Patent number 12,054,383
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Safety mechanism for sensors
- Patent number 12,044,697
- Issue date Jul 23, 2024
- Murata Manufacturing Co., Ltd.
- Lasse Aaltonen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor system with a microelectromechanical sensor element and meth...
- Patent number 12,043,539
- Issue date Jul 23, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk Meinhold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS inertial sensor with high resilience to the phenomenon of stic...
- Patent number 12,038,454
- Issue date Jul 16, 2024
- STMicroelectronics S.r.l.
- Francesco Rizzini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and electronic device
- Patent number 12,019,092
- Issue date Jun 25, 2024
- Kabushiki Kaisha Toshiba
- Kei Masunishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical acceleration sensor system
- Patent number 12,013,413
- Issue date Jun 18, 2024
- Robert Bosch GmbH
- Amin Jemili
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS inclinometer having a reduced vibration rectification error
- Patent number 11,993,509
- Issue date May 28, 2024
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Early-impact motion limiter for MEMS device
- Patent number 11,987,492
- Issue date May 21, 2024
- Murata Manufacturing Co., Ltd.
- Mikko Partanen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mechanical shock resistant MEMS accelerometer arrangement, associat...
- Patent number 11,971,428
- Issue date Apr 30, 2024
- Merlin Technology, Inc.
- Albert W. Chau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric body and MEMS device using same
- Patent number 11,968,902
- Issue date Apr 23, 2024
- National Institute of Advanced Industrial Science and Technology
- Masato Uehara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Combined corrugated piezoelectric microphone and corrugated piezoel...
- Patent number 11,962,973
- Issue date Apr 16, 2024
- Infineon Technologies AG
- Christian Bretthauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing a micro-electro-mechanical device, and ME...
- Patent number 11,945,712
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH RECOVERY FROM STICTION CONDITIONS
- Publication number 20250042718
- Publication date Feb 6, 2025
- STMicroelectronics International N.V.
- Manuel RIANI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANCHOR STRUCTURE
- Publication number 20250033951
- Publication date Jan 30, 2025
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL INERTIAL SENSOR, AND METHOD FOR OPERATING A MICROME...
- Publication number 20250033952
- Publication date Jan 30, 2025
- ROBERT BOSCH GmbH
- Daniel Baumgaertner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR PRODUCING MEMS DEVICE
- Publication number 20250019226
- Publication date Jan 16, 2025
- Rohm Co., Ltd.
- Toma FUJITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20250019225
- Publication date Jan 16, 2025
- Rohm Co., Ltd.
- Daisuke Nishinohara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device, Electronic Apparatus, And Vehicle
- Publication number 20250012829
- Publication date Jan 9, 2025
- SEIKO EPSON CORPORATION
- Fumiya ITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR
- Publication number 20250011159
- Publication date Jan 9, 2025
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SENSOR DEVICE WITH WAFER-LEVEL INTEGRATION O...
- Publication number 20250002332
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FORMING A PASSIVATION COATING FOR MEMS DEVICES
- Publication number 20250002334
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT
- Publication number 20240425367
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL MEMS DEVICE INTEGRATING A WAKE-UP ELEMENT, INERTIAL MEMS S...
- Publication number 20240425352
- Publication date Dec 26, 2024
- STMicroelectronics International N.V.
- Luca SEGHIZZI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEFORMATION MAPPING FOR OUT-OF-PLANE ACCELEROMETER OFFSET/SENSITIVI...
- Publication number 20240425354
- Publication date Dec 26, 2024
- InvenSense, Inc.
- Roberto Martini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE WITH A MECHANICAL STOP
- Publication number 20240425356
- Publication date Dec 26, 2024
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Inertial Sensor
- Publication number 20240425357
- Publication date Dec 26, 2024
- SensorTek technology Corp.
- Shih-Yuan LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE SEISMIC MASS Z-AXIS ACCELEROMETER AND MANUFACTURING METHOD TH...
- Publication number 20240418743
- Publication date Dec 19, 2024
- MiraMEMS Sensing Technology Co., Ltd
- Li-Tien TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Inertia Measurement Device, Vehicle, And Electronic Device
- Publication number 20240418744
- Publication date Dec 19, 2024
- SEIKO EPSON CORPORATION
- Yusuke KINOSHITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20240418510
- Publication date Dec 19, 2024
- AAC TECHNOLOGIES PTE. LTD
- Houming Chong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELEROMETER WITH THERMAL EXPANSION STRAIN PROTECTION
- Publication number 20240409394
- Publication date Dec 12, 2024
- Honeywell International Inc.
- Paul W. Dwyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20240409395
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Device and Method for Adapting Measuring Range and Sensitivity of M...
- Publication number 20240400379
- Publication date Dec 5, 2024
- RUHR-UNIVERSITÄT BOCHUM
- Philip SCHMITT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE
- Publication number 20240400374
- Publication date Dec 5, 2024
- Rohm Co., Ltd.
- Toma FUJITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS COMPONENT WITH UPSIDE-DOWN CHIP
- Publication number 20240391759
- Publication date Nov 28, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL ACCELEROMETER WITH FORCE FEEDBACK LOOP
- Publication number 20240391757
- Publication date Nov 28, 2024
- STMicroelectronics International N.V.
- Marco GARBARINO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20240383742
- Publication date Nov 21, 2024
- Zhunmao (Hangzhou) Technology Co.
- Haitao Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20240383745
- Publication date Nov 21, 2024
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FORCE SENSOR WITH AN INCREASED OPERATING RANGE
- Publication number 20240377431
- Publication date Nov 14, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Theo MIANI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Fabrication Process with Reduced Z-Axis Stiction
- Publication number 20240375937
- Publication date Nov 14, 2024
- NXP USA, Inc.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM DEVICE USING A METALLIC MOVABLE PART...
- Publication number 20240359969
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tao-Cheng LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LEVEL MEMS PROCESS
- Publication number 20240351864
- Publication date Oct 24, 2024
- InvenSense, Inc.
- Roberto Martini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR SYSTEM WITH A MICROELECTROMECHANICAL SENSOR ELEMENT AND METH...
- Publication number 20240343555
- Publication date Oct 17, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk MEINHOLD
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Accelerometers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Robust inertial sensor self-test

Semiconductor MEMS structure

Micro electro mechanical system (MEMs) device having metal sealing...

Method for suppressing vibration coupled signals in a microphone fo...

Method and system for fabricating a MEMS device

MEMS sensor with compensation of residual voltage

Anti-stiction process for MEMS device

3-axis angular accelerometer

Selective self-assembled monolayer patterning with sacrificial laye...

Microelectromechanical sensor device with improved stability to stress

Mems device, electronic apparatus, and vehicle

Inertia measurement device, vehicle, and electronic device

Interlocking proof mass for mems inertial sensing device

Micro-electromechanical system device using a metallic movable part...

Micromechanical sensor device and corresponding production method

Analysis method of a device, performed through a MEMS sensor, and s...

MEMS microphone and MEMS accelerometer on a single substrate

Safety mechanism for sensors

Sensor system with a microelectromechanical sensor element and meth...

MEMS inertial sensor with high resilience to the phenomenon of stic...

Semiconductor integrated device with electrical contacts between st...

Sensor and electronic device

Microelectromechanical acceleration sensor system

MEMS inclinometer having a reduced vibration rectification error

Early-impact motion limiter for MEMS device

Mechanical shock resistant MEMS accelerometer arrangement, associat...

Piezoelectric body and MEMS device using same

Combined corrugated piezoelectric microphone and corrugated piezoel...

Process for manufacturing a micro-electro-mechanical device, and ME...

Systems and methods for providing getters in microelectromechanical...

Patents Applicationslast 30 patents

MICROELECTROMECHANICAL DEVICE WITH RECOVERY FROM STICTION CONDITIONS

ANCHOR STRUCTURE

MICROMECHANICAL INERTIAL SENSOR, AND METHOD FOR OPERATING A MICROME...

MEMS DEVICE AND METHOD FOR PRODUCING MEMS DEVICE

MEMS DEVICE

MEMS Device, Electronic Apparatus, And Vehicle

ACCELERATION SENSOR

MICROELECTROMECHANICAL SENSOR DEVICE WITH WAFER-LEVEL INTEGRATION O...

FORMING A PASSIVATION COATING FOR MEMS DEVICES

DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT

INERTIAL MEMS DEVICE INTEGRATING A WAKE-UP ELEMENT, INERTIAL MEMS S...

DEFORMATION MAPPING FOR OUT-OF-PLANE ACCELEROMETER OFFSET/SENSITIVI...

MICROMECHANICAL DEVICE WITH A MECHANICAL STOP

Inertial Sensor

THREE SEISMIC MASS Z-AXIS ACCELEROMETER AND MANUFACTURING METHOD TH...

Inertia Measurement Device, Vehicle, And Electronic Device

INERTIAL SENSOR AND METHOD FOR FORMING THE SAME

ACCELEROMETER WITH THERMAL EXPANSION STRAIN PROTECTION

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

Device and Method for Adapting Measuring Range and Sensitivity of M...

MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE

MEMS COMPONENT WITH UPSIDE-DOWN CHIP

MICROELECTROMECHANICAL ACCELEROMETER WITH FORCE FEEDBACK LOOP

MEMS DEVICE

MICROMECHANICAL COMPONENT

FORCE SENSOR WITH AN INCREASED OPERATING RANGE

MEMS Device and Fabrication Process with Reduced Z-Axis Stiction

MICRO-ELECTROMECHANICAL SYSTEM DEVICE USING A METALLIC MOVABLE PART...

MULTI-LEVEL MEMS PROCESS

SENSOR SYSTEM WITH A MICROELECTROMECHANICAL SENSOR ELEMENT AND METH...