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6335867 | Ishibashi et al. | Jan 2002 | B1 |
Entry |
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Larry W. Burgess, Introducing Via-in-Pad Blind Via Technology to Any PCB Multilayer Fabricator, The Institute for Interconnecting and Packaging Electronic Circuits, Mar. 9-13, 1997 pp S15-2-1 to S15-2-4. |