Package for solid image pickup element and solid image pickup device

Abstract

In a package including a base fixed with a solid image pickup element, a side wall rising up along the periphery of the base, and internal terminals arranged on a step of the side wall, a plurality of recesses are formed at certain intervals in a lower part of the step to prevent bleeding of an adhesive fixing the solid image pickup element from creeping up over the internal terminals. When the adhesive and bleeding thereof spread around the solid image pickup element during die bonding, they flow into the recesses, making even fast-flowing bleeding hardly creep up an inner surface of the side wall including the step, and enabling prevention of the adhesive from adhering to the internal terminal. Strength, questioned by the presence of the recesses upon wire bonding, can be secured by residual parts between the recesses, and defective wire bonding is less likely to occur.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a solid image pickup device using a package for a solid image pickup element according to Embodiment 1 of the present invention;

FIG. 2 is a cross-sectional view taken along a line A-A′ of the solid image pickup device in FIG. 1;

FIG. 3 is a partially enlarged perspective view of the package for a solid image pickup element in FIG. 1;

FIG. 4 is a cross-sectional view of a solid image pickup device using a package for a solid image pickup element according to Embodiment 2 of the present invention;

FIG. 5 is a partially enlarged perspective view of the package for a solid image pickup element in FIG. 4;

FIG. 6 is a cross-sectional view of a solid image pickup device using a package for a solid image pickup element according to Embodiment 3 of the present invention;

FIG. 7 is a partially enlarged cross-sectional view along a line B-B′ of the package for a solid image pickup element in FIG. 6;

FIG. 8 is a cross-sectional view of a solid image pickup device using a package for a solid image pickup element according to Embodiment 4 of the present invention;

FIG. 9 is a partially enlarged cross-sectional view along a line C-C′ of the package for a solid image pickup element in FIG. 8;

FIG. 10 is a cross-sectional view of a conventional solid image pickup device; and

FIG. 11 is a cross-sectional view of another conventional solid image pickup device.

Claims

1. A package for a solid image pickup element, comprising: a base fixed with a solid image pickup element;a side wall rising up along a periphery of the base to form a recessed space for housing the solid image pickup element; andinternal terminals arranged on a step in an inner periphery of the side wall to lead out the terminals of the solid image pickup element,wherein a plurality of recesses are formed at certain intervals in a lower part of the step to prevent bleeding of an adhesive fixing the solid image pickup element from creeping up over the internal terminals.

2. The package for a solid image pickup element according to claim 1, wherein recesses connecting to the recesses of the step are formed in the base.

3. The package for a solid image pickup element according to claim 1, wherein surface roughness of a bottom face of the recess is greater than surface roughness of other surfaces.

4. The package for a solid image pickup element according to claim 1, wherein the base and the side wall are formed by laminating ceramic boards.

5. The package for a solid image pickup element according to claim 1, wherein the base and the side wall are made of resin.

6. A solid image pickup device including the package for a solid image pickup element according to claim 1, wherein a solid image pickup element is fixed and wire-bonded to the package.