Plasma apparatus and methods for processing feed material utilizing a powder ingress preventor (PIP)

Information

  • Patent Grant
  • 12094688
  • Patent Number
    12,094,688
  • Date Filed
    Thursday, August 17, 2023
    a year ago
  • Date Issued
    Tuesday, September 17, 2024
    a month ago
Abstract
Disclosed herein are systems, methods, and devices processing feed material utilizing a microwave plasma apparatus comprising a powder ingress preventor (PIP). In some embodiments, the microwave plasma apparatus comprises a core plasma tube and a liner; and a ring structure comprising: a bearing surface, the bearing surface contacting an interior diameter of the core plasma tube; and an opening, the opening contacting an outer diameter of the liner.
Description
BACKGROUND
Field

The present invention relates to apparatuses and methods for plasma material processing and, more particularly, to apparatuses and methods for microwave plasma material processing.


Description

Plasma torches generate and provide hot temperature directed flows of plasma for a variety of purposes. The two main types of plasma torches are induction plasma torches and microwave plasma torches. Generally, inductive plasmas suffer from plasma non-uniformity. This non-uniformity leads to limitations on the ability of inductive plasmas to process certain materials. Furthermore, significant differences exist between the microwave plasma apparatuses and other plasma generation torches, such as induction plasma. For example, microwave plasma is hotter on the interior of the plasma plume, while induction is hotter on the outside of the plumes. In particular, the outer region of an induction plasma can reach about 10,000 K while the inside processing region may only reach about 1,000 K. This large temperature difference leads to material processing and feeding problems. Furthermore, induction plasma apparatuses are unable to process feedstocks at low enough temperatures to avoid melting of certain feed materials without extinguishing the plasma.


A conventional microwave plasma apparatus for processing a material includes a plasma chamber, an applicator, a microwave radiation source, and a waveguide guiding microwave radiation from the microwave radiation source to the plasma chamber. A process gas flows through the plasma chamber and the microwave radiation couples to the process gas to produce a plasma jet. A process material is introduced to the plasma chamber, becomes entrained in the plasma jet, and is thereby transformed to a stream of product material droplets or particles.


In conventional microwave plasma apparatuses, normal pressure fluctuations in the plasma chamber can cause the process material to travel backwards into the applicator causing microwave arcing and plasma stability issues. Thus, novel plasma apparatuses and methods for processing materials are needed.


SUMMARY

For purposes of this summary, certain aspects, advantages, and novel features of the invention are described herein. It is to be understood that not all such advantages necessarily may be achieved in accordance with any particular embodiment of the invention. Thus, for example, those skilled in the art will recognize that the invention may be embodied or conducted in a manner that achieves one advantage or group of advantages as taught herein without necessarily achieving other advantages as may be taught or suggested herein.


Some embodiments herein are directed to a microwave plasma apparatus for processing a material, comprising: a core plasma tube; a liner located within and concentric with the core plasma tube; a plasma applicator; and a ring structure located between the core plasma tube and the liner, the ring structure concentric with the core plasma tube and the liner, and the ring structure comprising: a bearing surface, the bearing surface contacting a bottom surface of the plasma applicator; and an opening, the opening surrounding the liner and having a diameter greater than an outer diameter of the liner.


In some embodiments, the ring structure is formed of glass or quartz. In some embodiments, the ring structure comprises a single piece of material. In some embodiments, the ring structure comprises an assembly comprising two or more pieces. In some embodiments, the assembly comprises a first piece comprising a flange and a second piece comprising a tube.


In some embodiments, the ring structure comprises a washer. In some embodiments, the washer comprises a plurality of holes. In some embodiments, the plurality of holes form one or more concentric circles on a surface of the washer. In some embodiments, the ring structure comprises a stack of washers. In some embodiments, the ring structure comprises a stack of two washers, three washers, or four washers.


In some embodiments, the opening comprises one or more indentations or serrations.


In some embodiments, the ring structure comprises an inverted cone. In some embodiments, the inverted cone comprises a rim, the rim comprising one or more holes formed through the rim. In some embodiments, the inverted cone comprises a serrated bottom opening.


Some embodiments herein are directed to a ring structure for preventing powder ingress within a microwave plasma apparatus, the ring structure comprising: a bearing surface, the bearing surface contacting a lower surface of a plasma applicator of the microwave plasma apparatus; and an opening, the opening the opening surrounding a liner of the microwave plasma apparatus and having a diameter greater than an outer diameter of the liner.


In some embodiments, the ring structure is formed of glass or quartz. In some embodiments, the ring structure comprises a single piece of material. In some embodiments, the ring structure comprises an assembly comprising two or more pieces. In some embodiments, the assembly comprises a first piece comprising a flange and a second piece comprising a tube.


In some embodiments, the ring structure comprises a washer. In some embodiments, the washer comprises a plurality of holes. In some embodiments, the plurality of holes form one or more concentric circles on a surface of the washer. In some embodiments, the ring structure comprises a stack of washers. In some embodiments, the ring structure comprises a stack of two washers, three washers, or four washers.


In some embodiments, the opening comprises one or more indentations or serrations.


In some embodiments, the ring structure comprises an inverted cone. In some embodiments, the inverted cone comprises a rim, the rim comprising one or more holes formed through the rim. In some embodiments, the inverted cone comprises a serrated bottom opening.





BRIEF DESCRIPTION OF THE DRAWINGS

The drawings are provided to illustrate example embodiments and are not intended to limit the scope of the disclosure. A better understanding of the systems and methods described herein will be appreciated upon reference to the following description in conjunction with the accompanying drawings, wherein:



FIG. 1 illustrates an example microwave plasma torch 100 that can be used in the processing of feed material materials.



FIGS. 2A-B illustrates an exemplary microwave plasma torch that includes a side feeding hopper, thus allowing for downstream feeding.



FIG. 3 illustrates an isometric view of an example powder ingress preventor according to some embodiments herein.



FIG. 4 illustrates a side view of the example powder ingress preventor of FIG. 3.



FIG. 5 illustrates a bottom view of the example powder ingress preventor of FIG. 3.



FIG. 6 illustrates an isometric view of another example powder ingress preventor according to some embodiments herein.



FIG. 7 illustrates a side view of the example powder ingress preventor of FIG. 6.



FIG. 8 illustrates a bottom view of the example powder ingress preventor of FIG. 6.



FIG. 9 illustrates an angled side view of the example powder ingress preventor of FIG. 6.



FIG. 10 illustrates another example powder ingress preventor according to some embodiments herein.



FIG. 11 illustrates another example powder ingress preventor according to some embodiments herein.



FIG. 12 illustrates another example powder ingress preventor according to some embodiments herein.



FIG. 13 illustrates another example powder ingress preventor according to some embodiments herein.



FIG. 14 illustrates another example powder ingress preventor according to some embodiments herein.



FIG. 15 illustrates a side view of the example powder ingress preventor of FIG. 14.



FIG. 16A-16C illustrate an example microwave plasma apparatus comprising a powder ingress preventor according to some embodiments herein.



FIG. 17 illustrates an example microwave plasma apparatus comprising a waveguide and plasma applicator with a powder ingress preventor according to some embodiments herein.



FIG. 18 illustrates an example microwave plasma apparatus comprising a waveguide and plasma applicator with a powder ingress preventor according to some embodiments herein.





DETAILED DESCRIPTION

Although certain preferred embodiments and examples are disclosed below, inventive subject matter extends beyond the specifically disclosed embodiments to other alternative embodiments and/or uses and to modifications and equivalents thereof. Thus, the scope of the claims appended hereto or as presented in the future is not limited by any of the particular embodiments described below. For example, in any method or process disclosed herein, the acts or operations of the method or process may be performed in any suitable sequence and are not necessarily limited to any particular disclosed sequence. Various operations may be described as multiple discrete operations in turn, in a manner that may be helpful in understanding certain embodiments; however, the order of description should not be construed to imply that these operations are order dependent. Additionally, the structures, systems, and/or devices described herein may be embodied as integrated components or as separate components. For purposes of comparing various embodiments, certain aspects and advantages of these embodiments are described. Not necessarily all such aspects or advantages are achieved by any particular embodiment. Thus, for example, various embodiments may be conducted in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other aspects or advantages as may also be taught or suggested herein.


Certain exemplary embodiments will now be described to provide an overall understanding of the principles of the structure, function, manufacture, and use of the devices and methods disclosed herein. One or more examples of these embodiments are illustrated in the accompanying drawings. Those skilled in the art will understand that the devices and methods specifically described herein and illustrated in the accompanying drawings are non-limiting exemplary embodiments and that the scope of the present invention is defined solely by the claims. The features illustrated or described in connection with one exemplary embodiment may be combined with the features of other embodiments. Such modifications and variations are intended to be included within the scope of the present technology.


Some embodiments herein are directed to microwave plasma apparatus and methods for processing materials using a microwave plasma apparatus comprising a powder ingress preventor (PIP). In some embodiments, the PIP creates a barrier between the reaction/plasma chamber and the applicator, blocking or collecting powder before it can reach the applicator. In conventional microwave plasma apparatuses, normal pressure fluctuations in the plasma chamber can cause the process material to travel backwards into the applicator causing microwave arcing and plasma stability issues. In some embodiments, the PIP may comprise a barrier between the reaction chamber and the applicator, preventing process material from reaching the applicator. In some embodiments, the PIP completely or at least partially prevents processing material that has reached the reaction chamber from entering the applicator. In some embodiments, the PIP not only deters powder from reaching the applicator, but also collects powder along its entire inner surface. In some embodiments, the PIP may comprise one or more of a filter, shield, collector, tube, washer, cover, and/or other protection device or widget. In some embodiments, the PIP may comprise a quartz sleeve piece laying in the applicator around the liner.


In a conventional apparatus, the applicator, a pressure window, or liner may be dirtied or damaged by material build-up returning from the reaction chamber. Waveguide pressure windows are a type of seal used to prevent contaminants (e.g., moisture, dirt, processing material and dust) from entering the waveguide that transmits microwaves from the microwave generator to the applicator. The pressure window may also isolate pressurized sections of the apparatus from non-pressurized sections of the apparatus. For example, the pressure window can be used to seal waveguides when pressurization or gas filling is required. Waveguide pressure windows enable the signal to pass through but block atmospheric gases or contaminants from getting through. If the pressure window is dirtied or damaged, microwave power transmission may be compromised and pressure imbalance in the apparatus may occur. The liner may comprise an interior surface material or coating in the reaction chamber or core plasma tube that protects the interior wall of the apparatus from heat and processing materials. Damage to the liner may compromise the structural integrity of the microwave plasma apparatus.


To prevent dirtying or damaging the applicator, the pressure window, and/or the liner, the microwave plasma apparatus may be manually cleaned after every use. However, in some embodiments, the utilization of a PIP within a microwave plasma apparatus may prevent material build-up on the interior of or on an exterior surface of the plasma applicator, on a pressure window, or on a liner of the microwave plasma apparatus. Thus, in some embodiments, cleaning of the microwave plasma apparatus may be avoided after each run, increasing uptime of the apparatus, such that throughput is increased.


In a conventional apparatus, the buildup of processing materials may be characterized as either “wet” or “dry.” The buildup may be wet when a waveguide gas is not utilized. When waveguide gas is used, such as waveguide gas at a flow rate of about 3 scfm, there may be a dry buildup of processing materials. Waveguide gas is purging gas (typically Ar or N2) that enters the system from the pressure-window assembly and flows directly into the applicator. The gas is injected from the top of the pressure-window assembly, vertically, and/or tangent to the pressure-window. The gas exits the applicator through the lower neck and into the reactor, around the outer diameter of the torch liner. There are two main reasons for using waveguide gas, including keeping buildup off of the pressure window and out of the applicator, and providing a small amount of cooling to the torch liner. In some embodiments, the use of a PIP may prevent wet buildup or dry buildup in a microwave plasma apparatus.


In some embodiments, various design considerations must be accounted for in designing and utilizing a PIP for use in a microwave plasma apparatus. For example, pressure fluctuations from a bag house of the apparatus, extreme heat from the plasma, and microwave interference may all inhibit proper functioning of the PIP. In some embodiments, the PIP utilized according to some embodiments herein may be designed and utilized to withstand pressure fluctuations, extreme heat, and microwave interference. In some embodiments, the PIP is designed with an elongated shape (e.g., instead of being a simple washer). In some embodiments, this design adds weight to the PIP to make it heavier, such that the PIP does not move and/or break during large positive pressure fluctuations. In some embodiments, even if the PIP does move, a long bearing surface may be provided so the PIP does not settle unevenly in the apparatus. In some embodiments, the PIP is made from a single piece of quartz glass. Due to the material properties of quartz glass, the PIP is transparent to microwave radiation (does not absorb or have any significant effect on field characteristics) and can withstand elevated temperature environments.


In conventional microwave plasma apparatuses, powder ingress can introduce various problems in plasma applications. For example, powder ingress can cause issues connected to the pressure window and cause other plasma torch instabilities. In some embodiments, utilizing a PIP may maximize reduction of incidence to a microwave plasma and plasma applicator by powder ingress.


In some embodiments, the PIP may comprise a tube structure and a bearing structure. In some embodiments, a bearing surface, or area of contact between the bearing structure and an interior surface of the microwave plasma torch may be maximized. In some embodiments, maximizing the bearing surface may prevent or mitigate the risk of displacement or disturbance of the PIP due to a pressure spike in the microwave plasma apparatus. In some embodiments, the bag house of the microwave plasma apparatus may occasionally deliver a pressure spike to the system. If a PIP in the form of, for example, a quartz washer was placed around the liner in the plasma applicator, it would have an area exposed to this pressure wave. If the PIP is displaced by the pressure wave, the PIP could fall non-concentrically and cause the liner to be damaged or crack. Thus, in some embodiments, the PIP must be designed in such a way to avoid displacement by pressure spikes or other environmental forces in the system. In some embodiments, the pressure around the plasma application may be about 650 Torr but may rise to at least 700 Torr for about 0.1 s during a pressure spike. In some embodiments, the bearing surface, or the incident area may comprise a solid annulus between the interior diameter of the lower neck/applicator of the core plasma tube of the microwave plasma apparatus, and the outer diameter of the liner covering the core plasma tube.


In some embodiments, the interior diameter of the lower neck/applicator of the core plasma tube may be about 101.6 mm. In some embodiments, the interior diameter of the lower neck/applicator of the core plasma tube may be about mm, about 30 mm, about 55 mm, about 80 mm, about 105 mm, about 130 mm, about 155 mm, about 180 mm, about 205 mm, about 230 mm, about 255 mm, about 280 mm, about 305 mm, about 330 mm, about 355 mm, about 380 mm, about 405 mm, about 430 mm, about 455 mm, about 480 mm, about 500 mm, or any value between the aforementioned values.


In some embodiments, the outer diameter of the liner covering the core plasma tube may be about 77 mm. In some embodiments, the outer diameter of the liner covering the core plasma tube may be about 5 mm, about 30 mm, about 55 mm, about 80 mm, about 105 mm, about 130 mm, about 155 mm, about 180 mm, about 205 mm, about 230 mm, about 255 mm, about 280 mm, about 305 mm, about 330 mm, about 355 mm, about 380 mm, about 405 mm, about 430 mm, about 455 mm, about 480 mm, about 500 mm, or any value between the aforementioned values.


In some embodiments, the area of the exposed annulus may be about 3116.1 mm. In some embodiments, the area of the exposed annulus may comprise the area subjected to the pressure wave/spike/impulse. In some embodiments, the area of the exposed annulus may be about 1000 mm, about 1100 mm, about 1200 mm, about 1300 mm, about 1400 mm, about 1500 mm, about 1600 mm, about 1700 mm, about 1800 mm, about 1900 mm, about 2000 mm, about 2100 mm, about 2200 mm, about 2300 mm, about 2400 mm, about 2500 mm, about 2600 mm, about 2700 mm, about 2800 mm, about 2900 mm, about 3000 mm, about 3100 mm, about 3200 mm, about 3300 mm, about 3400 mm, about 3500 mm, about 3600 mm, about 3700 mm, about 3800 mm, about 3900 mm, about 4000 mm, about 4100 mm, about 4200 mm, about 4300 mm, about 4400 mm, about 4500 mm, about 4600 mm, about 4700 mm, about 4800 mm, about 4900 mm, about 5000 mm, or any value between the aforementioned values.


In some embodiments, the resultant force of a pressure spike may be about 4.8 lbs. In some embodiments, the resultant force of a pressure spike may be about 0.5 lbs., about 1 lbs., about 1.5 lbs., about 2 lbs., about 2.5 lbs., about 3 lbs., about 3.5 lbs., about 4 lbs., about 4.5 lbs., about 5 lbs., about 5.5 lbs., about 6 lbs., about 6.5 lbs., about 7 lbs., about 7.5 lbs., about 8 lbs., about 8.5 lbs., about 9 lbs., about 9.5 lbs., about 10 lbs., about 10.5 lbs., about 11 lbs., about 11.5 lbs., about 12 lbs., about 12.5 lbs., about 13 lbs., about 13.5 lbs., about 14 lbs., about 14.5 lbs., about 15 lbs., about 15.5 lbs., about 16 lbs., about 16.5 lbs., about 17 lbs., about 17.5 lbs., about 18 lbs., about 18.5 lbs., about 19 lbs., about 19.5 lbs., about 20 lbs., about 20.5 lbs., about 21 lbs., about 21.5 lbs., about 22 lbs., about 22.5 lbs., about 23 lbs., about 23.5 lbs., about 24 lbs., about 24.5 lbs., about 25 lbs., or any value between the aforementioned values.


In some embodiments, the time length of a pressure spike may be about 0.1 s. In some embodiments, the time length of a pressure spike may be about 0.01 s, about 0.02 s, about 0.03 s, about 0.04 s, about 0.05 s, about 0.06 s, about 0.07 s, about 0.08 s, about 0.09 s, about 0.1 s, about 0.11 s, about 0.12 s, about 0.13 s, about 0.14 s, about 0.15 s, about 0.16 s, about 0.17 s, about 0.18 s, about 0.19 s, about 0.2 s, about 0.21 s, about 0.22 s, about 0.23 s, about 0.24 s, about 0.25 s, or any value between the aforementioned values.



FIG. 1 illustrates an example microwave plasma torch 100 that can be used in the production of materials. In some embodiments, a feedstock can be introduced, via one or more feedstock inlets 102, into a microwave plasma 104. In some embodiments, an entrainment gas flow and/or a sheath flow may be injected into the microwave plasma applicator 105 to create flow conditions within the plasma applicator prior to ignition of the plasma 104 via microwave radiation source 106. In some embodiments, the entrainment flow and sheath flow are both axis-symmetric and laminar, while in other embodiments the gas flows are swirling. In some embodiments, the feedstock may be introduced into the microwave plasma torch 100, where the feedstock may be entrained by a gas flow that directs the materials toward the plasma 104.


In some embodiments, within the microwave plasma 104, the feedstock may undergo a physical and/or chemical transformation. Inlets 102 can be used to introduce process gases to entrain and accelerate the feedstock towards plasma 104. In some embodiments, a second swirling gas flow can be created to provide sheathing for the inside wall of a plasma applicator 104 and a reaction chamber 110 to protect those structures from melting due to heat radiation from plasma 104.


Various parameters of microwave plasma 104, as created by the plasma applicator 105, may be adjusted manually or automatically in order to achieve a desired material. These parameters may include, for example, power, plasma gas flow rates, type of plasma gas, presence of an extension tube, extension tube material, level of insulation of the reactor chamber or the extension tube, level of coating of the extension tube, geometry of the extension tube (e.g. tapered/stepped), feed material size, feed material insertion rate, feed material inlet location, feed material inlet orientation, number of feed material inlets, plasma temperature, residence time and cooling rates. The resulting material may exit the plasma into sealed chamber 112 where the material is quenched then collected.


In some embodiments, the feedstock is injected after the microwave plasma applicator for processing in the “plume” or “exhaust” of the microwave plasma torch. Thus, the plasma of the microwave plasma torch is engaged at the exit end of the plasma torch core tube 108, or further downstream. In some embodiments, adjustable downstream feeding allows engaging the feedstock with the plasma plume downstream at a temperature suitable for optimal melting of feedstock through precise targeting of temperature level and residence time. Adjusting the inlet location and plasma characteristics may allow for further customization of material characteristics. Furthermore, in some embodiments, by adjusting power, gas flow rates, pressure, and equipment configuration (e.g., introducing an extension tube), the length of the plasma plume may be adjusted.


In some embodiments, feeding configurations may include one or more individual feeding nozzles surrounding the plasma plume. The feedstock may enter the plasma from any direction and can be fed in 360° around the plasma depending on the placement and orientation of the inlets 102. Furthermore, the feedstock may enter the plasma at a specific position along the length of the plasma 104 by adjusting placement of the inlets 102, where a specific temperature has been measured and a residence time estimated for providing the desirable characteristics of the resulting material.


In some embodiments, the angle of the inlets 102 relative to the plasma 104 may be adjusted, such that the feedstock can be injected at any angle relative to the plasma 104. In some embodiments, implementation of the downstream injection method may use a downstream swirl or quenching. A downstream swirl refers to an additional swirl component that can be introduced downstream from the plasma applicator to keep the powder from the walls of the applicator 105, the reactor chamber 110, and/or an extension tube 114.



FIGS. 2A-B illustrates an exemplary microwave plasma torch that includes a side feeding hopper, thus allowing for downstream feeding. Thus, in this implementation the feedstock is injected after the microwave plasma torch applicator for processing in the “plume” or “exhaust” of the microwave plasma torch. Thus, the plasma of the microwave plasma torch is engaged at the exit end of the plasma torch to allow downstream feeding of the feedstock, as opposed to the top-feeding (or upstream feeding). This downstream feeding can advantageously extend the lifetime of the torch as the hot zone is preserved indefinitely from any material deposits on the walls of the hot zone liner. Furthermore, it allows engaging the plasma plume downstream at temperature suitable for optimal melting of powders through precise targeting of temperature level and residence time. For example, there is the ability to dial the length of the plume using microwave powder, gas flows, and pressure in the quenching vessel that contains the plasma plume.


Generally, the downstream feeding can utilize two main hardware configurations to establish a stable plasma plume which are: annular torch, such as described in U.S. Pat. Pub. No. 2018/0297122, the entirety of which is hereby incorporated by reference, or swirl torches described in U.S. Pat. No. 8,748,785 B2 and U.S. Pat. No. 9,932,673 B2, the entireties of which are hereby incorporated by reference. A feed system close-coupled with the plasma plume at the exit of the plasma torch is used to feed powder axisymmetrically to preserve process homogeneity.


Other feeding configurations may include one or several individual feeding nozzles surrounding the plasma plume. The feedstock powder can enter the plasma at a point from any direction and can be fed in from any direction, 360° around the plasma, into the point within the plasma. The feedstock powder can enter the plasma at a specific position along the length of the plasma plume where a specific temperature has been measured and a residence time estimated for sufficient melting of the particles. The melted particles exit the plasma into a sealed chamber where they are quenched then collected.


The feed materials 214 can be introduced into a microwave plasma applicator 202. Hopper 206 can be used to store the feed material 214 before feeding the feed material 214 into the microwave plasma applicator 202, plume and/or exhaust 218. The feed material 214 can be injected at any angle to the longitudinal direction of the plasma applicator 302. 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, or 55 degrees. In some embodiments, the feedstock can be injected at an angle of greater than 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, or 55 degrees. In some embodiments, the feedstock can be injected at an angle of less than 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, or 55 degrees. In alternative embodiments, the feedstock can be injected along the longitudinal axis of the plasma torch.


The microwave radiation can be brought into the plasma applicator 202 through a waveguide 204. The feed material 214 is fed into a plasma chamber 210 and is placed into contact with the plasma generated by the plasma applicator 202. When in contact with the plasma, plasma plume, or plasma exhaust 218, the feed material melts. While still in the plasma chamber 210, the feed material 214 cools and solidifies before being collected into a container 212. Alternatively, the feed material 214 can exit the plasma chamber 210 through the outlet 212 while still in a melted phase and cool and solidify outside the plasma chamber. In some embodiments, a quenching chamber may be used, which may or may not use positive pressure. While described separately from FIG. 1, the embodiments of FIGS. 2A and 2B are understood to use similar features and conditions to the embodiment of FIG. 1.



FIG. 3 illustrates an isometric view of an example powder ingress preventor according to some embodiments herein. FIG. 4 illustrates a side view of the example powder ingress preventor of FIG. 3. FIG. 5 illustrates a bottom view of the example powder ingress preventor of FIG. 3.


In some embodiments, the PIP may comprise an assembly comprising a flange (or washer) and a tube. Applicators of different types and manufacturers have different radii on the liner feedthrough. The PIP of FIGS. 3-5 is configured to fit in applicators of all types. For example, the PIP may be dimensioned such that it will fit and self-center in any applicator.



FIG. 6 illustrates an isometric view of another example powder ingress preventor according to some embodiments herein. FIG. 7 illustrates a side view of the example powder ingress preventor of FIG. 6. FIG. 8 illustrates a bottom view of the example powder ingress preventor of FIG. 6. FIG. 9 illustrates an angled side view of the example powder ingress preventor of FIG. 6.


In some embodiments, a PIP may comprise a quartz glass tube. In some embodiments, the PIP may comprise a single, monolithic piece of tube, which may be flared by a glassmaker. In some embodiments, the PIP may comprise a tube portion and a washer portion, wherein the washer portion comprises a bearing surface that contacts the core tube and/or liner of the microwave plasma apparatus. In some embodiments, the PIP may comprise an increased bearing surface, to prevent displacement of the PIP into to the liner. In some embodiments, the geometry of the PIP may add weight while minimizing incidence to the microwave.


In some embodiments, the PIP may comprise a glass-blown part comprising a quartz tube. In some embodiments, the PIP displacement from a worst-case pressure fluctuation may be about 0.426 inches. In some embodiments, the PIP may comprise an increased bearing surface and flared ends to prevent catching on the plasma core tube liner during displacement. In some embodiments, a one-piece, monolithic PIP may be advantageous as there is less risk of the pieces coming apart during pressure fluctuations.



FIG. 10 illustrates another example powder ingress preventor according to some embodiments herein. In some embodiments, the PIP may comprise a washer. In some embodiments, the washer may be formed from quartz. In some embodiments, the PIP may comprise a stack of two or more washers. In some embodiments, the PIP may comprise a stack of 2, a stack of 3 washers, or a stack of 4 washers. In some embodiments, the PIP may comprise a larger stack of washers, such as a stack of 5 washers, 10 washers, 15 washers, 20 washers, 25 washers, or any value between the aforementioned values.


In some embodiments, the PIP may comprise an outer diameter and an opening comprising an inner diameter. In some embodiments, the outer diameter may be about 6 inches. In some embodiments, the outer diameter may be about 0.5 inches, about 1 inches, about 1.5 inches, about 2 inches, about 2.5 inches, about 3 inches, about 3.5 inches, about 4 inches, about 4.5 inches, about 5 inches, about 5.5 inches, about 6 inches, about 6.5 inches, about 7 inches, about 7.5 inches, about 8 inches, about 8.5 inches, about 9 inches, about 9.5 inches, about 10 inches, about 10.5 inches, about 11 inches, about 11.5 inches, about 12 inches, about 12.5 inches, or any value between the aforementioned values.


In some embodiments, the PIP may comprise an inner diameter of about 3.138 inches. In some embodiments, the inner diameter may be about 0.25 inches, about 0.75 inches, about 1.25 inches, about 1.75 inches, about 2.25 inches, about 2.75 inches, about 3.25 inches, about 3.75 inches, about 4.25 inches, about 4.75 inches, about 5.25 inches, about 5.75 inches, about 6.25 inches, about 6.75 inches, about 7.25 inches, about 7.75 inches, about 8.25 inches, about 8.75 inches, about 9.25 inches, about 9.75 inches, about 10.25 inches, about 10.75 inches, about 11.25 inches, about 11.75 inches, about 12.25 inches, or any value between the aforementioned values.


In some embodiments, the PIP may comprise a thickness of about 0.25 inches. In some embodiments, the PIP may comprise a thickness of about 0.05 inches, about 0.1 inches, about 0.15 inches, about 0.2 inches, about 0.25 inches, about 0.3 inches, about 0.35 inches, about 0.4 inches, about 0.45 inches, about 0.5 inches, about 0.55 inches, about 0.6 inches, about 0.65 inches, about 0.7 inches, about 0.75 inches, about 0.8 inches, about 0.85 inches, about 0.9 inches, about 0.95 inches, about 1 inches, about 1.05 inches, about 1.1 inches, about 1.15 inches, about 1.2 inches, about 1.25 inches, about 1.3 inches, about 1.35 inches, about 1.4 inches, about 1.45 inches, about 1.5 inches, about 1.55 inches, about 1.6 inches, about 1.65 inches, about 1.7 inches, about 1.75 inches, about 1.8 inches, about 1.85 inches, about 1.9 inches, about 1.95 inches, about 2 inches, about 2.05 inches, about 2.1 inches, about 2.15 inches, about 2.2 inches, about 2.25 inches, about 2.3 inches, about 2.35 inches, about 2.4 inches, about 2.45 inches, about 2.5 inches, or any value between the aforementioned values.


In some embodiments, a worst-case displacement caused by pressure fluctuation may be about 0.236 inches for a stack of 2 washers, about 0.137 inches for a stack of 3 washers, and about 0.087 inches for stack of 4 washers. In some embodiments, a washer PIP design may be immediately sourced, have low deflection for larger stacks of washers, and advantageously create a minimal gap around the liner.



FIG. 11 illustrates another example powder ingress preventor according to some embodiments herein. In some embodiments, the PIP may comprise a machined washer comprising quartz. In some embodiments, the washer may be thicker to prevent deflection during pressure fluctuations. In some embodiments, the PIP may comprise one or more centering features along the inner diameter of the washer to assist with centering the washer in the core plasma tube. In some embodiments, the centering features may comprise structures or indentations on the interior diameter. In some embodiments, the centering features may also prevent or mitigate overheating of the washer. In some embodiments, machined PIPs may be manufactured to create a small or nonexistent gap between the PIP and interior wall of the core tube.


In some embodiments, the PIP may comprise a stack of two or more washers. In some embodiments, the PIP may comprise a stack of 2, a stack of 3 washers, or a stack of 4 washers. In some embodiments, the PIP may comprise a larger stack of washers, such as a stack of 5 washers, 10 washers, 15 washers, 20 washers, 25 washers, or any value between the aforementioned values.


In some embodiments, the PIP may comprise an outer diameter and an opening comprising an inner diameter. In some embodiments, the outer diameter may be about 6 inches. In some embodiments, the outer diameter may be about 0.5 inches, about 1 inches, about 1.5 inches, about 2 inches, about 2.5 inches, about 3 inches, about 3.5 inches, about 4 inches, about 4.5 inches, about 5 inches, about 5.5 inches, about 6 inches, about 6.5 inches, about 7 inches, about 7.5 inches, about 8 inches, about 8.5 inches, about 9 inches, about 9.5 inches, about 10 inches, about 10.5 inches, about 11 inches, about 11.5 inches, about 12 inches, about 12.5 inches, or any value between the aforementioned values.


In some embodiments, the PIP may comprise an inner diameter of about 3.138 inches. In some embodiments, the inner diameter may be about 0.25 inches, about 0.75 inches, about 1.25 inches, about 1.75 inches, about 2.25 inches, about 2.75 inches, about 3.25 inches, about 3.75 inches, about 4.25 inches, about 4.75 inches, about 5.25 inches, about 5.75 inches, about 6.25 inches, about 6.75 inches, about 7.25 inches, about 7.75 inches, about 8.25 inches, about 8.75 inches, about 9.25 inches, about 9.75 inches, about 10.25 inches, about 10.75 inches, about 11.25 inches, about 11.75 inches, about 12.25 inches, or any value between the aforementioned values.


In some embodiments, the PIP may comprise a thickness of about 0.25 inches. In some embodiments, the PIP may comprise a thickness of about 0.05 inches, about 0.1 inches, about 0.15 inches, about 0.2 inches, about 0.25 inches, about 0.3 inches, about 0.35 inches, about 0.4 inches, about 0.45 inches, about 0.5 inches, about 0.55 inches, about 0.6 inches, about 0.65 inches, about 0.7 inches, about 0.75 inches, about 0.8 inches, about 0.85 inches, about 0.9 inches, about 0.95 inches, about 1 inches, about 1.05 inches, about 1.1 inches, about 1.15 inches, about 1.2 inches, about 1.25 inches, about 1.3 inches, about 1.35 inches, about 1.4 inches, about 1.45 inches, about 1.5 inches, about 1.55 inches, about 1.6 inches, about 1.65 inches, about 1.7 inches, about 1.75 inches, about 1.8 inches, about 1.85 inches, about 1.9 inches, about 1.95 inches, about 2 inches, about 2.05 inches, about 2.1 inches, about 2.15 inches, about 2.2 inches, about 2.25 inches, about 2.3 inches, about 2.35 inches, about 2.4 inches, about 2.45 inches, about 2.5 inches, or any value between the aforementioned values.



FIG. 12 illustrates another example powder ingress preventor according to some embodiments herein. In some embodiments, the washer PIP may comprise a larger outer diameter. In some embodiments, the outer diameter may be about 8 inches.



FIG. 13 illustrates another example powder ingress preventor according to some embodiments herein. In some embodiments, the PIP may comprise an annular ring with a plurality of holes through the annular ring. In some embodiments, the plurality of holes form one or more concentric circles through a surface of the washer. In some embodiments, the annular ring may comprise one or more cutouts or serrations on the interior opening of the ring.



FIG. 14 illustrates another example powder ingress preventor according to some embodiments herein. FIG. 15 illustrates a side view of the example powder ingress preventor of FIG. 14. In some embodiments, the PIP may comprise an inverted cone shape with a rim. In some embodiments, the rim may comprise one or more holes through the ring. In some embodiments, the inverted cone may extend downward and radially inward to an opening at the bottom of the cone. In some embodiments, the opening may comprise one or more cutouts or serrations.



FIG. 16A-16C illustrate an example microwave plasma apparatus comprising a powder ingress preventor according to some embodiments herein. FIG. 17 illustrates an example microwave plasma apparatus comprising a waveguide and plasma applicator with a powder ingress preventor according to some embodiments herein. As noted above, in some embodiments, the PIP may comprise a sleeve piece laying in the applicator around the liner.



FIG. 18 illustrates an example microwave plasma apparatus comprising a waveguide and plasma applicator with a powder ingress preventor according to some embodiments herein. As illustrated in FIG. 18, a microwave plasma apparatus may comprise a core plasma tube comprising an upper neck and a lower neck, separated by a plasma applicator in communication with a waveguide configured to transmit microwave power from a microwave power source. In some embodiments, a torch liner may be provided within the core plasma tube and extending from the upper neck through the applicator and lower neck into the reaction chamber. In some embodiments, a PIP may be provided surrounding the torch liner within the applicator and/or lower neck of the core plasma tube. In some embodiments, the PIP may comprise a ring structure 1800 comprising a bearing surface 1802 and a tube. In some embodiments, the bearing surface 1802 may contact a lower surface of the applicator, while the tube may comprise an annular ring surrounding the torch liner. In some embodiments, the tube may be concentric with the core plasma tube and the torch liner. In some embodiments, the tube may comprise an opening or annulus with a diameter greater than the diameter of the torch liner, such that a gap is provided between the torch liner and PIP tube. In some embodiments, the tube of the PIP ring structure 1800 may extend downward from the applicator into the lower neck of the core plasma tube.


EXAMPLES
Example 1

The PIP illustrated in FIGS. 6-8 was evaluated using an O2 plasma at 30 kW power and a pressure of about 90 psi (about 4654.34 Torr) to about 120 psi (about 6205.79 Torr), with about 20 kg of material feed input. After each test, the plasma apparatus was inspected for powder ingress. Compared to a system without a PIP, powder ingress was greatly reduced or entirely eliminated. The outer surface of the PIP had a heavy coating of powder, while the inner surface showed no signs of powder ingress. The PIP showed no signs of damage. In some embodiments, installation of a PIP in the microwave plasma apparatus requires no retuning of the plasma apparatus or process.


Example 2

A test was conducted using 24 kW to 34 kW extended runs with Tungsten-Rhenium powder having a particle size of about 5 μm to 25 μm using the PIP of FIGS. 6-8. The powder was fed at 0.5-3.0 kg/hour through a single injector. Waveguide gas was flown at 1.5 scfm. Adding a PIP to the plasma apparatus resulted in no change in plasma stability, and no change in reflected power without additional tuning of the plasma. The PIP collected a large amount of powder and powder in the plasma applicator was drastically reduced or fully eliminated. There was a large amount of powder buildup on the inside of PIP, and on the outside of liner where the PIP overlapped.


There was more powder buildup in the lower neck of the PIP. The buildup on the interior was textured instead of a typical smooth buildup. There was increased plasma arcing on the liner.


Additional Embodiments

In the foregoing specification, the invention has been described with reference to specific embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention. The specification and drawings are, accordingly, to be regarded in an illustrative rather than restrictive sense.


Indeed, although this invention has been disclosed in the context of certain embodiments and examples, it will be understood by those skilled in the art that the invention extends beyond the specifically disclosed embodiments to other alternative embodiments and/or uses of the invention and obvious modifications and equivalents thereof. In addition, while several variations of the embodiments of the invention have been shown and described in detail, other modifications, which are within the scope of this invention, will be readily apparent to those of skill in the art based upon this disclosure. It is also contemplated that various combinations or sub-combinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the invention. It should be understood that various features and aspects of the disclosed embodiments can be combined with, or substituted for, one another in order to form varying modes of the embodiments of the disclosed invention. Any methods disclosed herein need not be performed in the order recited. Thus, it is intended that the scope of the invention herein disclosed should not be limited by the particular embodiments described above.


It will be appreciated that the systems and methods of the disclosure each have several innovative aspects, no single one of which is solely responsible or required for the desirable attributes disclosed herein. The various features and processes described above may be used independently of one another or may be combined in several ways. All possible combinations and subcombinations are intended to fall within the scope of this disclosure.


Certain features that are described in this specification in the context of separate embodiments also may be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment also may be implemented in multiple embodiments separately or in any suitable subcombination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination may in some cases be excised from the combination, and the claimed combination may be directed to a subcombination or variation of a subcombination. No single feature or group of features is necessary or indispensable to each and every embodiment.


It will also be appreciated that conditional language used herein, such as, among others, “can,” “could,” “might,” “may,” “e.g.,” and the like, unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments include, while other embodiments do not include, certain features, elements and/or steps. Thus, such conditional language is not generally intended to imply that features, elements and/or steps are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without author input or prompting, whether these features, elements and/or steps are included or are to be performed in any particular embodiment. The terms “comprising,” “including,” “having,” and the like are synonymous and are used inclusively, in an open-ended fashion, and do not exclude additional elements, features, acts, operations, and so forth. In addition, the term “or” is used in its inclusive sense (and not in its exclusive sense) so that when used, for example, to connect a list of elements, the term “or” means one, some, or all of the elements in the list. In addition, the articles “a,” “an,” and “the” as used in this application and the appended claims are to be construed to mean “one or more” or “at least one” unless specified otherwise. Similarly, while operations may be depicted in the drawings in a particular order, it is to be recognized that such operations need not be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. Further, the drawings may schematically depict one more example processes in the form of a flowchart. However, other operations that are not depicted may be incorporated in the example methods and processes that are schematically illustrated. For example, one or more additional operations may be performed before, after, simultaneously, or between any of the illustrated operations. Additionally, the operations may be rearranged or reordered in other embodiments. In certain circumstances, multitasking and parallel processing may be advantageous. Moreover, the separation of various system components in the embodiments described above should not be understood as requiring such separation in all embodiments, and it should be understood that the described program components and systems may generally be integrated together in a single software product or packaged into multiple software products. Additionally, other embodiments are within the scope of the following claims. In some cases, the actions recited in the claims may be performed in a different order and still achieve desirable results.


Further, while the methods and devices described herein may be susceptible to various modifications and alternative forms, specific examples thereof have been shown in the drawings and are herein described in detail. It should be understood, however, that the invention is not to be limited to the particular forms or methods disclosed, but, to the contrary, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the various implementations described and the appended claims. Further, the disclosure herein of any particular feature, aspect, method, property, characteristic, quality, attribute, element, or the like in connection with an implementation or embodiment can be used in all other implementations or embodiments set forth herein. Any methods disclosed herein need not be performed in the order recited. The methods disclosed herein may include certain actions taken by a practitioner; however, the methods can also include any third-party instruction of those actions, either expressly or by implication. The ranges disclosed herein also encompass any and all overlap, sub-ranges, and combinations thereof. Language such as “up to,” “at least,” “greater than,” “less than,” “between,” and the like includes the number recited. Numbers preceded by a term such as “about” or “approximately” include the recited numbers and should be interpreted based on the circumstances (e.g., as accurate as reasonably possible under the circumstances, for example ±5%, ±10%, ±15%, etc.). For example, “about 3.5 mm” includes “3.5 mm.” Phrases preceded by a term such as “substantially” include the recited phrase and should be interpreted based on the circumstances (e.g., as much as reasonably possible under the circumstances). For example, “substantially constant” includes “constant.” Unless stated otherwise, all measurements are in standard conditions including temperature and pressure.


As used herein, a phrase referring to “at least one of” a list of items refers to any combination of those items, including single members. As an example, “at least one of: A, B, or C” is intended to cover: A, B, C, A and B, A and C, B and C, and A, B, and C. Conjunctive language such as the phrase “at least one of X, Y and Z,” unless specifically stated otherwise, is otherwise understood with the context as used in general to convey that an item, term, etc. may be at least one of X, Y or Z. Thus, such conjunctive language is not generally intended to imply that certain embodiments require at least one of X, at least one of Y, and at least one of Z to each be present. The headings provided herein, if any, are for convenience only and do not necessarily affect the scope or meaning of the devices and methods disclosed herein.


Accordingly, the claims are not intended to be limited to the embodiments shown herein but are to be accorded the widest scope consistent with this disclosure, the principles and the novel features disclosed herein.

Claims
  • 1. A microwave plasma apparatus for processing a material, comprising: a core plasma tube;a liner located within and concentric with the core plasma tube;a plasma applicator; anda ring structure located between the core plasma tube and the liner, the ring structure concentric with the core plasma tube and the liner, and the ring structure comprising: a bearing surface, the bearing surface contacting a bottom surface of the plasma applicator; andan opening, the opening surrounding the liner and having a diameter greater than an outer diameter of the liner.
  • 2. The microwave plasma apparatus of claim 1, wherein the ring structure is formed of glass or quartz.
  • 3. The microwave plasma apparatus of claim 1, wherein the ring structure comprises a single piece of material.
  • 4. The microwave plasma apparatus of claim 1, wherein the ring structure comprises an assembly comprising two or more pieces, wherein the assembly comprises a first piece comprising a flange and a second piece comprising a tube.
  • 5. The microwave plasma apparatus of claim 1, wherein the ring structure comprises a washer, wherein the washer comprises a plurality of holes.
  • 6. The microwave plasma apparatus of claim 5, wherein the plurality of holes form one or more concentric circles on a surface of the washer.
  • 7. The microwave plasma apparatus of claim 1, wherein the opening comprises one or more indentations or serrations.
  • 8. The microwave plasma apparatus of claim 1, wherein the ring structure comprises an inverted cone, wherein the inverted cone comprises a rim, the rim comprising one or more holes formed through the rim, wherein the inverted cone comprises a serrated bottom opening.
  • 9. The microwave plasma apparatus of claim 8, wherein the inverted cone comprises a serrated bottom opening.
  • 10. A ring structure for preventing powder ingress within a microwave plasma apparatus, the ring structure comprising: a bearing surface, the bearing surface contacting a lower surface of a plasma applicator of the microwave plasma apparatus; andan opening, the opening the opening surrounding a liner of the microwave plasma apparatus and having a diameter greater than an outer diameter of the liner.
  • 11. The ring structure of claim 10, wherein the ring structure is formed of glass or quartz.
  • 12. The ring structure of claim 10, wherein the ring structure comprises a single piece of material.
  • 13. The ring structure of claim 10, wherein the ring structure comprises an assembly comprising two or more pieces, wherein the assembly comprises a first piece comprising a flange and a second piece comprising a tube.
  • 14. The ring structure of claim 10, wherein the ring structure comprises a washer, wherein the washer comprises a plurality of holes, wherein the plurality of holes form one or more concentric circles on a surface of the washer.
  • 15. The ring structure of claim 10, wherein the opening comprises one or more indentations or serrations.
  • 16. The ring structure of claim 10, wherein the ring structure comprises an inverted cone, the rim comprising one or more holes formed through the rim, wherein the inverted cone comprises a serrated bottom opening.
INCORPORATION BY REFERENCE TO ANY PRIORITY APPLICATIONS

This application claims the priority benefit under 35 U.S.C. § 119(e) of U.S. Provisional Application No. 63/373,528, filed Aug. 25, 2022, the entire disclosure of which is incorporated herein by reference in its entirety. Any and all applications for which a foreign or domestic priority claim is identified in the Application Data Sheet as filed with the present application are hereby incorporated by reference under 37 CFR 1.57.

US Referenced Citations (593)
Number Name Date Kind
1699205 Emil et al. Jan 1929 A
2892215 Gerhard et al. Jun 1959 A
3290723 John et al. Dec 1966 A
3293334 Bylund et al. Dec 1966 A
3434831 Knopp Mar 1969 A
3466165 Rhys et al. Sep 1969 A
RE26879 Kelso May 1970 E
3652259 Knopp Mar 1972 A
3802816 Kaufmann Apr 1974 A
3845344 Rainer Oct 1974 A
3909241 Cheney et al. Sep 1975 A
3966374 Honnorat et al. Jun 1976 A
3974245 Cheney et al. Aug 1976 A
4076640 Forgensi et al. Feb 1978 A
4177026 Honnorat et al. Dec 1979 A
4212837 Kubo et al. Jul 1980 A
4221554 Oguchi et al. Sep 1980 A
4221775 Anno Sep 1980 A
4265730 Hirose et al. May 1981 A
4423303 Hirose et al. Dec 1983 A
4431449 Dillon et al. Feb 1984 A
4439410 Santen et al. Mar 1984 A
4544404 Yolton et al. Oct 1985 A
4569823 Westin Feb 1986 A
4599880 Stepanenko et al. Jul 1986 A
4611108 Leprince et al. Sep 1986 A
4670047 Kopatz et al. Jun 1987 A
4692584 Caneer, Jr. Sep 1987 A
4705560 Kemp et al. Nov 1987 A
4711660 Kemp et al. Dec 1987 A
4711661 Kemp et al. Dec 1987 A
4714587 Eylon et al. Dec 1987 A
4731110 Kopatz et al. Mar 1988 A
4731111 Kopatz et al. Mar 1988 A
4772315 Johnson et al. Sep 1988 A
4778515 Kemp et al. Oct 1988 A
4780131 Kemp et al. Oct 1988 A
4783216 Kemp et al. Nov 1988 A
4783218 Kemp et al. Nov 1988 A
4787934 Johnson et al. Nov 1988 A
4802915 Kopatz et al. Feb 1989 A
4836850 Kemp et al. Jun 1989 A
4859237 Johnson et al. Aug 1989 A
4923509 Kemp et al. May 1990 A
4923531 Fisher May 1990 A
4943322 Kemp et al. Jul 1990 A
4944797 Kemp et al. Jul 1990 A
4952389 Szymanski et al. Aug 1990 A
5022935 Fisher Jun 1991 A
5032202 Tsai Jul 1991 A
5041713 Weidman Aug 1991 A
5095048 Takahashi et al. Mar 1992 A
5114471 Johnson et al. May 1992 A
5131992 Church et al. Jul 1992 A
5200595 Boulos et al. Apr 1993 A
5234526 Chen Aug 1993 A
5290507 Runkle Mar 1994 A
5292370 Tsai et al. Mar 1994 A
5370765 Dandl Dec 1994 A
5376475 Ovshinsky et al. Dec 1994 A
5395453 Noda Mar 1995 A
5411592 Ovshinsky et al. May 1995 A
5431967 Manthiram et al. Jul 1995 A
5518831 Tou et al. May 1996 A
5567243 Foster Oct 1996 A
5665640 Foster Sep 1997 A
5671045 Woskov et al. Sep 1997 A
5676919 Kawamura et al. Oct 1997 A
5750013 Lin May 1998 A
5776323 Kobashi Jul 1998 A
5866213 Foster Feb 1999 A
5876684 Withers Mar 1999 A
5909277 Woskov et al. Jun 1999 A
5958361 Laine et al. Sep 1999 A
5969352 French Oct 1999 A
5980977 Deng et al. Nov 1999 A
5989648 Phillips Nov 1999 A
6027585 Patterson et al. Feb 2000 A
6200651 Roche et al. Mar 2001 B1
6221125 Soda et al. Apr 2001 B1
6261484 Phillips et al. Jul 2001 B1
6274110 Kim et al. Aug 2001 B1
6329628 Kuo et al. Dec 2001 B1
6334882 Aaslund Jan 2002 B1
6362449 Hadidi et al. Mar 2002 B1
6376027 Lee et al. Apr 2002 B1
6409851 Sethuram et al. Jun 2002 B1
6428600 Flurschuetz et al. Aug 2002 B1
6543380 Sung-Spitzl Apr 2003 B1
6551377 Leonhardt Apr 2003 B1
6569397 Yadav et al. May 2003 B1
6579573 Strutt et al. Jun 2003 B2
6589311 Han et al. Jul 2003 B1
6607693 Saito et al. Aug 2003 B1
6652822 Phillips et al. Nov 2003 B2
6676728 Han et al. Jan 2004 B2
6689192 Phillips et al. Feb 2004 B1
6752979 Talbot et al. Jun 2004 B1
6755886 Phillips et al. Jun 2004 B2
6780219 Singh et al. Aug 2004 B2
6793849 Gruen et al. Sep 2004 B1
6805822 Takei et al. Oct 2004 B2
6838072 Kong et al. Jan 2005 B1
6869550 Dorfman et al. Mar 2005 B2
6902745 Lee et al. Jun 2005 B2
6919257 Gealy et al. Jul 2005 B2
6919527 Boulos et al. Jul 2005 B2
6989529 Wiseman Jan 2006 B2
7066980 Akimoto et al. Jun 2006 B2
7091441 Kuo Aug 2006 B1
7108733 Enokido Sep 2006 B2
7125537 Liao et al. Oct 2006 B2
7125822 Nakano et al. Oct 2006 B2
7175786 Celikkaya et al. Feb 2007 B2
7182929 Singhal et al. Feb 2007 B1
7220398 Sutorik et al. May 2007 B2
7235118 Bouaricha et al. Jun 2007 B2
7285194 Uno et al. Oct 2007 B2
7285307 Hohenthanner et al. Oct 2007 B2
7297310 Peng et al. Nov 2007 B1
7297892 Kelley et al. Nov 2007 B2
7344776 Kollmann et al. Mar 2008 B2
7357910 Phillips et al. Apr 2008 B2
7368130 Kim et al. May 2008 B2
7374704 Che et al. May 2008 B2
7375303 Twarog May 2008 B2
7381496 Onnerud et al. Jun 2008 B2
7431750 Liao et al. Oct 2008 B2
7442271 Asmussen et al. Oct 2008 B2
7491468 Okada et al. Feb 2009 B2
7517513 Sarkas et al. Apr 2009 B2
7524353 Johnson et al. Apr 2009 B2
7534296 Swain et al. May 2009 B2
7572315 Boulos et al. Aug 2009 B2
7622211 Vyas et al. Nov 2009 B2
7629553 Fanson et al. Dec 2009 B2
7700152 Laine et al. Apr 2010 B2
7776303 Hung et al. Aug 2010 B2
7806077 Lee et al. Oct 2010 B2
7828999 Yubuta et al. Nov 2010 B2
7901658 Weppner et al. Mar 2011 B2
7931836 Xie et al. Apr 2011 B2
7939141 Matthews et al. May 2011 B2
8007691 Sawaki et al. Aug 2011 B2
8043405 Johnson et al. Oct 2011 B2
8092941 Weppner et al. Jan 2012 B2
8101061 Suh et al. Jan 2012 B2
8168128 Seeley et al. May 2012 B2
8178240 Wang et al. May 2012 B2
8192865 Buiel et al. Jun 2012 B2
8193291 Zhang Jun 2012 B2
8211388 Woodfield et al. Jul 2012 B2
8268230 Cherepy et al. Sep 2012 B2
8283275 Heo et al. Oct 2012 B2
8303926 Luhrs et al. Nov 2012 B1
8329090 Hollingsworth et al. Dec 2012 B2
8329257 Larouche et al. Dec 2012 B2
8338323 Takasu et al. Dec 2012 B2
8389160 Venkatachalam et al. Mar 2013 B2
8420043 Gamo et al. Apr 2013 B2
8439998 Ito et al. May 2013 B2
8449950 Shang et al. May 2013 B2
8478785 Jamjoom et al. Jul 2013 B2
8492303 Bulan et al. Jul 2013 B2
8529996 Bocian et al. Sep 2013 B2
8592767 Rappe et al. Nov 2013 B2
8597722 Albano et al. Dec 2013 B2
8623555 Kang et al. Jan 2014 B2
8658317 Weppner et al. Feb 2014 B2
8685593 Dadheech et al. Apr 2014 B2
8728680 Mikhail et al. May 2014 B2
8735022 Schlag et al. May 2014 B2
8748785 Jordan et al. Jun 2014 B2
8758957 Dadheech et al. Jun 2014 B2
8784706 Shevchenko et al. Jul 2014 B2
8822000 Kumagai et al. Sep 2014 B2
8840701 Borland et al. Sep 2014 B2
8877119 Jordan et al. Nov 2014 B2
8911529 Withers et al. Dec 2014 B2
8919428 Cola et al. Dec 2014 B2
8945431 Schulz et al. Feb 2015 B2
8951496 Hadidi et al. Feb 2015 B2
8956785 Dadheech et al. Feb 2015 B2
8968587 Shin et al. Mar 2015 B2
8968669 Chen Mar 2015 B2
8980485 Lanning et al. Mar 2015 B2
8999440 Zenasni et al. Apr 2015 B2
9023259 Hadidi et al. May 2015 B2
9051647 Cooperberg et al. Jun 2015 B2
9065141 Merzougui et al. Jun 2015 B2
9067264 Moxson et al. Jun 2015 B2
9079778 Kelley et al. Jul 2015 B2
9085490 Taylor et al. Jul 2015 B2
9101982 Aslund Aug 2015 B2
9136569 Song et al. Sep 2015 B2
9150422 Nakayama et al. Oct 2015 B2
9193133 Shin et al. Nov 2015 B2
9196901 Se-Hee et al. Nov 2015 B2
9196905 Tzeng et al. Nov 2015 B2
9206085 Hadidi et al. Dec 2015 B2
9242224 Redjdal et al. Jan 2016 B2
9259785 Hadidi et al. Feb 2016 B2
9293302 Risby et al. Mar 2016 B2
9321071 Jordan et al. Apr 2016 B2
9322081 McHugh et al. Apr 2016 B2
9352278 Spatz et al. May 2016 B2
9356281 Verbrugge et al. May 2016 B2
9368772 Chen et al. Jun 2016 B1
9378928 Zeng Jun 2016 B2
9412998 Rojeski et al. Aug 2016 B2
9421612 Fang et al. Aug 2016 B2
9425463 Hsu et al. Aug 2016 B2
9463435 Schulz et al. Oct 2016 B2
9463984 Sun et al. Oct 2016 B2
9520593 Sun et al. Dec 2016 B2
9520600 Dadheech et al. Dec 2016 B2
9624565 Lee et al. Apr 2017 B2
9630162 Sunkara et al. Apr 2017 B1
9643891 Hadidi et al. May 2017 B2
9700877 Kim et al. Jul 2017 B2
9705136 Rojeski Jul 2017 B2
9718131 Boulos et al. Aug 2017 B2
9735427 Zhang Aug 2017 B2
9738788 Gross et al. Aug 2017 B1
9751129 Boulos et al. Sep 2017 B2
9767990 Zeng Sep 2017 B2
9768033 Ranjan et al. Sep 2017 B2
9776378 Choi Oct 2017 B2
9782791 Redjdal et al. Oct 2017 B2
9782828 Wilkinson Oct 2017 B2
9796019 She et al. Oct 2017 B2
9796020 Aslund Oct 2017 B2
9831503 Sopchak Nov 2017 B2
9871248 Rayner et al. Jan 2018 B2
9879344 Lee et al. Jan 2018 B2
9899674 Hirai et al. Feb 2018 B2
9917299 Behan et al. Mar 2018 B2
9932673 Jordan et al. Apr 2018 B2
9945034 Yao et al. Apr 2018 B2
9945564 Gao et al. Apr 2018 B2
9947926 Kim et al. Apr 2018 B2
9981284 Guo et al. May 2018 B2
9991458 Rosenman et al. Jun 2018 B2
9999922 Struve Jun 2018 B1
10011491 Lee et al. Jul 2018 B2
10050303 Anandan et al. Aug 2018 B2
10057986 Prud'Homme et al. Aug 2018 B2
10065240 Chen Sep 2018 B2
10079392 Huang et al. Sep 2018 B2
10116000 Federici et al. Oct 2018 B1
10130994 Fang et al. Nov 2018 B2
10167556 Ruzic et al. Jan 2019 B2
10170753 Ren et al. Jan 2019 B2
10193142 Rojeski Jan 2019 B2
10244614 Foret Mar 2019 B2
10279531 Pagliarini May 2019 B2
10283757 Noh et al. May 2019 B2
10319537 Claussen et al. Jun 2019 B2
10333183 Sloop Jun 2019 B2
10350680 Yamamoto et al. Jul 2019 B2
10403475 Cooperberg et al. Sep 2019 B2
10411253 Tzeng et al. Sep 2019 B2
10439206 Behan et al. Oct 2019 B2
10442000 Fukada et al. Oct 2019 B2
10461298 Herle Oct 2019 B2
10477665 Hadidi et al. Nov 2019 B2
10493524 She et al. Dec 2019 B2
10522300 Yang Dec 2019 B2
10526684 Ekman et al. Jan 2020 B2
10529486 Nishisaka Jan 2020 B2
10543534 Hadidi et al. Jan 2020 B2
10584923 de Bock Mar 2020 B2
10593985 Sastry et al. Mar 2020 B2
10610929 Fang et al. Apr 2020 B2
10637029 Gotlib Vainshtein et al. Apr 2020 B2
10638592 Foret Apr 2020 B2
10639712 Barnes May 2020 B2
10647824 Hwang et al. May 2020 B2
10655206 Moon et al. May 2020 B2
10665890 Kang et al. May 2020 B2
10668566 Smathers et al. Jun 2020 B2
10669437 Cox et al. Jun 2020 B2
10688564 Boulos et al. Jun 2020 B2
10707477 Sastry et al. Jul 2020 B2
10717150 Aleksandrov et al. Jul 2020 B2
10727477 Kim et al. Jul 2020 B2
10741845 Yushin et al. Aug 2020 B2
10744590 Maier et al. Aug 2020 B2
10756334 Stowell et al. Aug 2020 B2
10766787 Sunkara et al. Sep 2020 B1
10777804 Sastry et al. Sep 2020 B2
10858255 Koziol et al. Dec 2020 B2
10858500 Chen et al. Dec 2020 B2
10892477 Choi et al. Jan 2021 B2
10930473 Paukner et al. Feb 2021 B2
10930922 Sun et al. Feb 2021 B2
10937632 Stowell et al. Mar 2021 B2
10943744 Sungail et al. Mar 2021 B2
10944093 Paz et al. Mar 2021 B2
10950856 Park et al. Mar 2021 B2
10964938 Rojeski Mar 2021 B2
10987735 Hadidi et al. Apr 2021 B2
10998552 Lanning et al. May 2021 B2
11011388 Eason May 2021 B2
11031641 Gupta et al. Jun 2021 B2
11050061 Kim et al. Jun 2021 B2
11072533 Shevchenko et al. Jul 2021 B2
11077497 Motchenbacher et al. Aug 2021 B2
11077524 Smathers et al. Aug 2021 B2
11108050 Kim et al. Aug 2021 B2
11116000 Sandberg et al. Sep 2021 B2
11130175 Parrish et al. Sep 2021 B2
11130994 Shachar et al. Sep 2021 B2
11133495 Gazda et al. Sep 2021 B2
11148202 Hadidi et al. Oct 2021 B2
11167556 Shimada et al. Nov 2021 B2
11170753 Nomura et al. Nov 2021 B2
11171322 Seol et al. Nov 2021 B2
11183682 Sunkara et al. Nov 2021 B2
11193142 Angelidaki et al. Dec 2021 B2
11196045 Dadheech et al. Dec 2021 B2
11219884 Takeda et al. Jan 2022 B2
11244614 He et al. Feb 2022 B2
11245065 Ouderkirk et al. Feb 2022 B1
11245109 Tzeng et al. Feb 2022 B2
11254585 Ekman et al. Feb 2022 B2
11273322 Zanata et al. Mar 2022 B2
11273491 Barnes Mar 2022 B2
11299397 Lanning et al. Apr 2022 B2
11311937 Hadidi et al. Apr 2022 B2
11311938 Badwe et al. Apr 2022 B2
11319537 Dames et al. May 2022 B2
11333183 Desai et al. May 2022 B2
11335911 Lanning et al. May 2022 B2
11350680 Rutkoski et al. Jun 2022 B2
11411253 Busacca et al. Aug 2022 B2
11439206 Santos Sep 2022 B2
11442000 Vaez-Iravani et al. Sep 2022 B2
11461298 Shemmer et al. Oct 2022 B1
11465201 Barnes Oct 2022 B2
11471941 Barnes Oct 2022 B2
11477665 Franke et al. Oct 2022 B2
11577314 Hadidi et al. Feb 2023 B2
11590568 Badwe et al. Feb 2023 B2
11611130 Wrobel et al. Mar 2023 B2
11633785 Badwe et al. Apr 2023 B2
11654483 Larouche et al. May 2023 B2
11717886 Badwe et al. Aug 2023 B2
11839919 Hadidi et al. Dec 2023 B2
11855278 Holman et al. Dec 2023 B2
11919071 Badwe et al. Mar 2024 B2
11923176 Stowell et al. Mar 2024 B2
11963287 Shang et al. Apr 2024 B2
20010016283 Shiraishi et al. Aug 2001 A1
20010021740 Lodyga et al. Sep 2001 A1
20020054912 Kim et al. May 2002 A1
20020112794 Sethuram et al. Aug 2002 A1
20030024806 Foret Feb 2003 A1
20030027021 Sharivker et al. Feb 2003 A1
20030070620 Cooperberg et al. Apr 2003 A1
20030077398 Strutt et al. Apr 2003 A1
20030129497 Yamamoto et al. Jul 2003 A1
20030172772 Sethuram et al. Sep 2003 A1
20030186128 Singh et al. Oct 2003 A1
20030207978 Yadav et al. Nov 2003 A1
20040013941 Kobayashi et al. Jan 2004 A1
20040045807 Sarkas et al. Mar 2004 A1
20040060387 Tanner-Jones Apr 2004 A1
20040123699 Liao et al. Jul 2004 A1
20040247522 Mills Dec 2004 A1
20050005844 Kitagawa et al. Jan 2005 A1
20050025698 Talbot et al. Feb 2005 A1
20050072496 Hwang et al. Apr 2005 A1
20050163696 Uhm et al. Jul 2005 A1
20050242070 Hammer Nov 2005 A1
20050260786 Yoshikawa et al. Nov 2005 A1
20060040168 Sridhar Feb 2006 A1
20060141153 Kubota et al. Jun 2006 A1
20060145124 Hsiao et al. Jul 2006 A1
20060291827 Suib et al. Dec 2006 A1
20070077350 Hohenthanner et al. Apr 2007 A1
20070089860 Hou et al. Apr 2007 A1
20070092432 Prud'Homme Apr 2007 A1
20070209758 Sompalli et al. Sep 2007 A1
20070221635 Boulos et al. Sep 2007 A1
20070259768 Kear et al. Nov 2007 A1
20080029485 Kelley et al. Feb 2008 A1
20080055594 Hadidi et al. Mar 2008 A1
20080182114 Kim et al. Jul 2008 A1
20080220244 Wai et al. Sep 2008 A1
20080286490 Bogdanoff et al. Nov 2008 A1
20080296268 Mike et al. Dec 2008 A1
20080305025 Mtner et al. Dec 2008 A1
20090074655 Suciu Mar 2009 A1
20090093553 Kleine et al. Apr 2009 A1
20090155689 Zaghib et al. Jun 2009 A1
20090196801 Mills Aug 2009 A1
20090202869 Sawaki et al. Aug 2009 A1
20090258255 Terashima et al. Oct 2009 A1
20090266487 Tian et al. Oct 2009 A1
20090304941 McLean Dec 2009 A1
20090305132 Gauthier et al. Dec 2009 A1
20100007162 Han et al. Jan 2010 A1
20100096362 Hirayama et al. Apr 2010 A1
20100176524 Burgess et al. Jul 2010 A1
20100219062 Leon Sanchez Sep 2010 A1
20110005461 Vandermeulen Jan 2011 A1
20110006254 Richard et al. Jan 2011 A1
20120015284 Merzougui et al. Jan 2012 A1
20120027955 Sunkara et al. Feb 2012 A1
20120034135 Risby Feb 2012 A1
20120048064 Kasper et al. Mar 2012 A1
20120051962 Imam et al. Mar 2012 A1
20120074342 Kim et al. Mar 2012 A1
20120100438 Fasching et al. Apr 2012 A1
20120112379 Beppu et al. May 2012 A1
20120122017 Mills May 2012 A1
20120224175 Minghetti Sep 2012 A1
20120230860 Ward-Close et al. Sep 2012 A1
20120240726 Kim et al. Sep 2012 A1
20120294919 Jaynes et al. Nov 2012 A1
20130032753 Yamamoto et al. Feb 2013 A1
20130071284 Kano et al. Mar 2013 A1
20130075390 Ashida Mar 2013 A1
20130078508 Tolbert et al. Mar 2013 A1
20130084474 Mills Apr 2013 A1
20130087285 Kofuji et al. Apr 2013 A1
20140048516 Gorodetsky et al. Feb 2014 A1
20140202286 Yokoyama et al. Jul 2014 A1
20140271843 Ma Sep 2014 A1
20140272430 Kalayaraman Sep 2014 A1
20140322632 Sugimoto et al. Oct 2014 A1
20140373344 Takada et al. Dec 2014 A1
20150000844 Woo Jan 2015 A1
20150101454 Shimizu et al. Apr 2015 A1
20150167143 Luce et al. Jun 2015 A1
20150171455 Mills Jun 2015 A1
20150255767 Aetukuri et al. Sep 2015 A1
20150259220 Rosocha et al. Sep 2015 A1
20150270106 Kobayashi et al. Sep 2015 A1
20150333307 Thokchom et al. Nov 2015 A1
20150342491 Marecki Dec 2015 A1
20150348754 Zeng Dec 2015 A1
20150351652 Marecki Dec 2015 A1
20160028088 Romeo et al. Jan 2016 A1
20160030359 Ma Feb 2016 A1
20160045841 Kaplan et al. Feb 2016 A1
20160152480 Jang et al. Jun 2016 A1
20160172163 Kaneko et al. Jun 2016 A1
20160189933 Kobayashi et al. Jun 2016 A1
20160197341 Lu et al. Jul 2016 A1
20160254540 Lee et al. Sep 2016 A1
20160284519 Kobayashi et al. Sep 2016 A1
20160285090 Ozkan et al. Sep 2016 A1
20160287113 Hebert et al. Oct 2016 A1
20160300692 Zeng Oct 2016 A1
20160308244 Badding et al. Oct 2016 A1
20160332232 Forbes et al. Nov 2016 A1
20160351910 Albano et al. Dec 2016 A1
20160358757 Ikeda et al. Dec 2016 A1
20170009328 Germann et al. Jan 2017 A1
20170070180 Mills Mar 2017 A1
20170113935 Pennington et al. Apr 2017 A1
20170120339 Aslund May 2017 A1
20170125842 Meguro et al. May 2017 A1
20170151609 Elsen et al. Jun 2017 A1
20170176977 Huang et al. Jun 2017 A1
20170179477 Walters et al. Jun 2017 A1
20170209922 Kato et al. Jul 2017 A1
20170338464 Fasching et al. Nov 2017 A1
20170368604 Wilkinson Dec 2017 A1
20170373344 Hadidi et al. Dec 2017 A1
20180022928 Blush Jan 2018 A1
20180025794 Lahoda et al. Jan 2018 A1
20180083264 Soppe Mar 2018 A1
20180104745 L'Esperance et al. Apr 2018 A1
20180114677 Komatsu et al. Apr 2018 A1
20180130638 Ahmad et al. May 2018 A1
20180134629 Kolios May 2018 A1
20180138018 Voronin et al. May 2018 A1
20180159178 Weisenstein et al. Jun 2018 A1
20180169763 Dorval et al. Jun 2018 A1
20180214956 Larouche et al. Aug 2018 A1
20180218883 Iwao Aug 2018 A1
20180241956 Suzuki Aug 2018 A1
20180248175 Ghezelbash et al. Aug 2018 A1
20180277826 Gayden et al. Sep 2018 A1
20180277849 Gayden Sep 2018 A1
20180294143 Chua et al. Oct 2018 A1
20180346344 Chen et al. Dec 2018 A1
20180353643 Ma Dec 2018 A1
20180363104 Fujieda et al. Dec 2018 A1
20180366707 Johnson et al. Dec 2018 A1
20180375149 Beck et al. Dec 2018 A1
20190001416 Larouche et al. Jan 2019 A1
20190061005 Kelkar Feb 2019 A1
20190069944 Fischer Mar 2019 A1
20190084290 Stoyanov et al. Mar 2019 A1
20190088993 Ohta Mar 2019 A1
20190125842 Grabowski May 2019 A1
20190127835 Yang et al. May 2019 A1
20190157045 Meloni May 2019 A1
20190160528 Mcgee et al. May 2019 A1
20190165413 Furusawa May 2019 A1
20190173130 Schuhmacher et al. Jun 2019 A1
20190193151 Okumura et al. Jun 2019 A1
20190218650 Subramanian et al. Jul 2019 A1
20190271068 Sungail et al. Sep 2019 A1
20190292441 Hill et al. Sep 2019 A1
20190334206 Sastry et al. Oct 2019 A1
20190341650 Lanning et al. Nov 2019 A9
20190348202 Sachdev et al. Nov 2019 A1
20190362936 Van Den Berg et al. Nov 2019 A1
20190381564 Barnes Dec 2019 A1
20190389734 Dietz et al. Dec 2019 A1
20200067128 Chmiola et al. Feb 2020 A1
20200136176 Chen Apr 2020 A1
20200149146 Chen et al. May 2020 A1
20200153037 Renna et al. May 2020 A1
20200187607 Law Jun 2020 A1
20200198977 Hof et al. Jun 2020 A1
20200203706 Holman et al. Jun 2020 A1
20200207668 Cavalli et al. Jul 2020 A1
20200215606 Barnes Jul 2020 A1
20200220222 Watarai et al. Jul 2020 A1
20200223704 Neale et al. Jul 2020 A1
20200227728 Huang et al. Jul 2020 A1
20200254432 Shirman et al. Aug 2020 A1
20200276638 King et al. Sep 2020 A1
20200288561 Huh Sep 2020 A1
20200314991 Duanmu Oct 2020 A1
20200335754 Ramasubramanian et al. Oct 2020 A1
20200335781 Oshita et al. Oct 2020 A1
20200350565 Oshita et al. Nov 2020 A1
20200358093 Oshita et al. Nov 2020 A1
20200358096 Paulsen et al. Nov 2020 A1
20200381217 Kraus et al. Dec 2020 A1
20200388857 Sunkara et al. Dec 2020 A1
20200391295 Dorval et al. Dec 2020 A1
20200395607 Tzeng Dec 2020 A1
20200403236 Colwell Dec 2020 A1
20200407858 Sano et al. Dec 2020 A1
20210002759 Zhang et al. Jan 2021 A1
20210024358 Chae et al. Jan 2021 A1
20210047186 Ifuku et al. Feb 2021 A1
20210057191 Stowell et al. Feb 2021 A1
20210075000 Holman et al. Mar 2021 A1
20210078072 Barnes Mar 2021 A1
20210085468 Ryd et al. Mar 2021 A1
20210098826 Chung et al. Apr 2021 A1
20210129216 Barnes May 2021 A1
20210139331 Kang et al. May 2021 A1
20210187614 Tsubota et al. Jun 2021 A1
20210226302 Lanning et al. Jul 2021 A1
20210253430 Zaplotnik et al. Aug 2021 A1
20210273217 Park et al. Sep 2021 A1
20210273292 Yun et al. Sep 2021 A1
20210276094 Sobu et al. Sep 2021 A1
20210296731 Wrobel et al. Sep 2021 A1
20210310110 Stowell et al. Oct 2021 A1
20210339313 Motchenbacher et al. Nov 2021 A1
20210344059 Ekman et al. Nov 2021 A1
20210367264 Hadidi et al. Nov 2021 A1
20220041457 Pullen et al. Feb 2022 A1
20220063012 Murata et al. Mar 2022 A1
20220127145 Ding et al. Apr 2022 A1
20220134430 Larouche et al. May 2022 A1
20220143693 Larouche et al. May 2022 A1
20220209298 Kim et al. Jun 2022 A1
20220223379 Holman Jul 2022 A1
20220228288 Holman Jul 2022 A1
20220267216 Holman et al. Aug 2022 A1
20220314325 Badwe Oct 2022 A1
20220324022 Badwe Oct 2022 A1
20220352549 Kim et al. Nov 2022 A1
20230001375 Kozlowski Jan 2023 A1
20230001376 Kozlowski Jan 2023 A1
20230032362 Holman et al. Feb 2023 A1
20230100863 Lianto Mar 2023 A1
20230143022 Mills May 2023 A1
20230144075 Badwe et al. May 2023 A1
20230211407 Hadidi Jul 2023 A1
20230219134 Houshmand et al. Jul 2023 A1
20230245896 Gupta Aug 2023 A1
20230247751 Kozlowski Aug 2023 A1
20230298885 Borude Sep 2023 A1
20230330747 Barnes Oct 2023 A1
20230330748 Badwe et al. Oct 2023 A1
20230377848 Holman et al. Nov 2023 A1
20230411123 Kozlowski et al. Dec 2023 A1
20240017322 Badwe et al. Jan 2024 A1
20240057245 Kozlowski et al. Feb 2024 A1
20240088369 Holman et al. Mar 2024 A1
Foreign Referenced Citations (281)
Number Date Country
2003211869 Sep 2003 AU
2014394102 Jun 2020 AU
2947531 Nov 2015 CA
1188073 Jul 1998 CN
1653869 Aug 2005 CN
1675785 Sep 2005 CN
1967911 May 2007 CN
101191204 Jun 2008 CN
101391307 Mar 2009 CN
101728509 Jun 2010 CN
101804962 Aug 2010 CN
101716686 Feb 2011 CN
102179521 Sep 2011 CN
102328961 Jan 2012 CN
102394290 Mar 2012 CN
102412377 Apr 2012 CN
102427130 Apr 2012 CN
102664273 Sep 2012 CN
102723502 Oct 2012 CN
102867940 Jan 2013 CN
102983312 Mar 2013 CN
103121105 May 2013 CN
103402921 Nov 2013 CN
102554242 Dec 2013 CN
103456926 Dec 2013 CN
103682372 Mar 2014 CN
103682383 Mar 2014 CN
103700815 Apr 2014 CN
103874538 Jun 2014 CN
103956520 Jul 2014 CN
104064736 Sep 2014 CN
104084592 Oct 2014 CN
104209526 Dec 2014 CN
104218213 Dec 2014 CN
204156003 Feb 2015 CN
104485452 Apr 2015 CN
104752734 Jul 2015 CN
104772473 Jul 2015 CN
103515590 Sep 2015 CN
105514373 Apr 2016 CN
106001597 Oct 2016 CN
106044777 Oct 2016 CN
106159316 Nov 2016 CN
106216703 Dec 2016 CN
106450146 Feb 2017 CN
106493350 Mar 2017 CN
206040854 Mar 2017 CN
106684387 May 2017 CN
106756417 May 2017 CN
106784692 May 2017 CN
107093732 Aug 2017 CN
107170973 Sep 2017 CN
107579241 Jan 2018 CN
107931622 Apr 2018 CN
108134104 Jun 2018 CN
108145170 Jun 2018 CN
108217612 Jun 2018 CN
108649190 Oct 2018 CN
108666563 Oct 2018 CN
108672709 Oct 2018 CN
108878862 Nov 2018 CN
108907210 Nov 2018 CN
108933239 Dec 2018 CN
108963239 Dec 2018 CN
109167070 Jan 2019 CN
109301212 Feb 2019 CN
109616622 Apr 2019 CN
109742320 May 2019 CN
109808049 May 2019 CN
109888233 Jun 2019 CN
110153434 Aug 2019 CN
110218897 Sep 2019 CN
110299516 Oct 2019 CN
110790263 Feb 2020 CN
110993908 Apr 2020 CN
111099577 May 2020 CN
111342163 Jun 2020 CN
111370751 Jul 2020 CN
111403701 Jul 2020 CN
111515391 Aug 2020 CN
111970807 Nov 2020 CN
112259740 Jan 2021 CN
112331947 Feb 2021 CN
112397706 Feb 2021 CN
112421006 Feb 2021 CN
112421048 Feb 2021 CN
112447977 Mar 2021 CN
112768709 May 2021 CN
112768710 May 2021 CN
112768711 May 2021 CN
112864453 May 2021 CN
113097487 Jul 2021 CN
113104838 Jul 2021 CN
113764688 Dec 2021 CN
113871581 Dec 2021 CN
114388822 Apr 2022 CN
114744315 Jul 2022 CN
114824297 Jul 2022 CN
115394976 Nov 2022 CN
10335355 Nov 2004 DE
102009033251 Sep 2010 DE
102010006440 Aug 2011 DE
102011109137 Feb 2013 DE
102018132896 Jun 2020 DE
0256233 Feb 1988 EP
2292557 Mar 2011 EP
3143838 Mar 2017 EP
3474978 May 2019 EP
2525122 Oct 1983 FR
2591412 Jun 1987 FR
2595745 Dec 2021 GB
2620597 Jan 2024 GB
202011017775 Oct 2021 IN
63-243212 Oct 1988 JP
10-172564 Jun 1998 JP
10-296446 Nov 1998 JP
11-064556 Mar 1999 JP
2001-064703 Mar 2001 JP
2001-504753 Apr 2001 JP
2001-348296 Dec 2001 JP
2002-249836 Sep 2002 JP
2002-332531 Nov 2002 JP
2004-034014 Feb 2004 JP
2004-505761 Feb 2004 JP
2004-193115 Jul 2004 JP
2004-232084 Aug 2004 JP
2004-311297 Nov 2004 JP
2004-340414 Dec 2004 JP
2004-362895 Dec 2004 JP
2005-015282 Jan 2005 JP
2005-072015 Mar 2005 JP
2005-076052 Mar 2005 JP
2005-135755 May 2005 JP
2005-187295 Jul 2005 JP
2005-222956 Aug 2005 JP
2005-272284 Oct 2005 JP
2006-040722 Feb 2006 JP
2007-113120 May 2007 JP
2007-138287 Jun 2007 JP
2007-149513 Jun 2007 JP
2007-238402 Sep 2007 JP
2008-230905 Oct 2008 JP
2008-243447 Oct 2008 JP
2009-187754 Aug 2009 JP
2010-024506 Feb 2010 JP
2010-097914 Apr 2010 JP
2011-108406 Jun 2011 JP
2011-222323 Nov 2011 JP
2011-258348 Dec 2011 JP
2012-046393 Mar 2012 JP
2012-151052 Aug 2012 JP
2012-234788 Nov 2012 JP
2013-062242 Apr 2013 JP
2013-063539 Apr 2013 JP
2013-069602 Apr 2013 JP
2013-076130 Apr 2013 JP
2015-048269 Mar 2015 JP
2015-122218 Jul 2015 JP
2016-029193 Mar 2016 JP
2016-047961 Apr 2016 JP
6103499 Mar 2017 JP
2017-524628 Aug 2017 JP
2018-141762 Sep 2018 JP
2018-528328 Sep 2018 JP
2018-190563 Nov 2018 JP
2019-055898 Apr 2019 JP
2019-516020 Jun 2019 JP
2019-112699 Jul 2019 JP
2019-520894 Jul 2019 JP
2020-121898 Aug 2020 JP
2021-061089 Apr 2021 JP
2021-061090 Apr 2021 JP
2021-116191 Aug 2021 JP
2022-530649 Jun 2022 JP
10-0582507 May 2006 KR
10-2007-0076686 Jul 2007 KR
10-2009-0070140 Jul 2009 KR
10-1133094 Apr 2012 KR
10-2014-0001813 Mar 2014 KR
10-1684219 Dec 2016 KR
10-2017-0039922 Apr 2017 KR
10-2017-0045181 Apr 2017 KR
10-2018-0001799 Jan 2018 KR
10-2018-0035750 Apr 2018 KR
10-1907912 Oct 2018 KR
10-1907916 Oct 2018 KR
10-1923466 Nov 2018 KR
10-2101006 Apr 2020 KR
10-2124946 Jun 2020 KR
10-2020-0131751 Nov 2020 KR
10-2021-0057253 May 2021 KR
2744449 Mar 2021 RU
521539 Feb 2003 TW
M303584 Dec 2006 TW
200737342 Oct 2007 TW
200823313 Jun 2008 TW
I329143 Aug 2010 TW
201112481 Apr 2011 TW
201225389 Jun 2012 TW
201310758 Mar 2013 TW
201411922 Mar 2014 TW
I593484 Aug 2017 TW
202002723 Jan 2020 TW
202033297 Sep 2020 TW
0377333 Sep 2003 WO
2004054017 Jun 2004 WO
2004089821 Oct 2004 WO
2005039752 May 2005 WO
2006100837 Sep 2006 WO
2010095726 Aug 2010 WO
2011082596 Jul 2011 WO
2011090779 Jul 2011 WO
2012023858 Feb 2012 WO
2012114108 Aug 2012 WO
2012144424 Oct 2012 WO
2012162743 Dec 2012 WO
2013017217 Feb 2013 WO
2014011239 Jan 2014 WO
2014110604 Jul 2014 WO
2014153318 Sep 2014 WO
2015064633 May 2015 WO
2015174949 Nov 2015 WO
2015187389 Dec 2015 WO
2016048862 Mar 2016 WO
2016082120 Jun 2016 WO
2016091957 Jun 2016 WO
2017074081 May 2017 WO
2017074084 May 2017 WO
2017080978 May 2017 WO
2017091543 Jun 2017 WO
2017106601 Jul 2017 WO
2017118955 Jul 2017 WO
2017130946 Aug 2017 WO
2017158349 Sep 2017 WO
2017177315 Oct 2017 WO
2017178841 Oct 2017 WO
2017223482 Dec 2017 WO
2018133429 Jul 2018 WO
2018141082 Aug 2018 WO
2018145750 Aug 2018 WO
2019045923 Mar 2019 WO
2019052670 Mar 2019 WO
2019095039 May 2019 WO
2019124344 Jun 2019 WO
2019139773 Jul 2019 WO
2019178668 Sep 2019 WO
2019243870 Dec 2019 WO
2019246242 Dec 2019 WO
2019246257 Dec 2019 WO
2020009955 Jan 2020 WO
2020013667 Jan 2020 WO
2020041767 Feb 2020 WO
2020041775 Feb 2020 WO
2020091854 May 2020 WO
2020132343 Jun 2020 WO
2020223358 Nov 2020 WO
2020223374 Nov 2020 WO
2021029769 Feb 2021 WO
2021046249 Mar 2021 WO
2021085670 May 2021 WO
2021115596 Jun 2021 WO
2021118762 Jun 2021 WO
2021127132 Jun 2021 WO
2021159117 Aug 2021 WO
2021191281 Sep 2021 WO
2021245410 Dec 2021 WO
2021245411 Dec 2021 WO
2021263273 Dec 2021 WO
2022005999 Jan 2022 WO
2022032301 Feb 2022 WO
2022043701 Mar 2022 WO
2022043702 Mar 2022 WO
2022043704 Mar 2022 WO
2022043705 Mar 2022 WO
2022067303 Mar 2022 WO
2022075846 Apr 2022 WO
2022107907 May 2022 WO
2022133585 Jun 2022 WO
2022136699 Jun 2022 WO
2023022492 Feb 2023 WO
2024013488 Jan 2024 WO
Non-Patent Literature Citations (112)
Entry
“Build Boldly”, Technology Demonstration, 6K Additive, [publication date unknown], in 11 pages.
“High-entropy alloy”, Wikipedia, webpage last edited Dec. 29, 2022 (accessed Jan. 17, 2023), in 16 pages. URL: https://en.wikipedia.org/wiki/High-entropy_alloy.
6K, “6K Launches World's First Premium Metal Powders For Additive Manufacturing Derived From Sustainable Sources”, Cision PR Newswire, Nov. 4, 2019, in 1 page. URL: https://www.prnewswire.com/news-releases/6k-launches-worlds-first-premium-metal-powders-for-additive-manufacturing-derived-from-sustainable-sources-300950791.html.
Ajayi, B. et al., “A rapid and scalable method for making mixed metal oxide alloys for enabling accelerated materials discovery”, Journal of Materials Research, Jun. 2016, vol. 31, No. 11, pp. 1596-1607.
Ajayi, B. P. et al., “Atmospheric plasma spray pyrolysis of lithiated nickel-manganese-cobalt oxides for cathodes in lithium-ion batteries”, Chemical Engineering Science, vol. 174, Sep. 14, 2017, pp. 302-310.
Ali, M. et al., Spray Flame Synthesis (SFS) of Lithium Lanthanum Zirconate (LLZO) Solid Electrolyte, Materials, vol. 14, No. 13, 2021, pp. 1-13.
Barbis et al., “Titanium powders from the hydride-dehydride process.” Titanium Powder Metallurgy. Butterworth-Heinemann, 2015. pp. 101-116.
Bardos, L., et al., “Differences between microwave and RF activation of nitrogen for the PECVD process”, J. Phys. D: Appl. Phys., vol. 15, 1982, pp. 79-82.
Bardos, L., et al., “Microwave Plasma Sources and Methods in Processing Technology”, IEEE Press, 2022, 10 pages.
Bobzin, K. et al., “Modelling and Diagnostics of Multiple Cathodes Plasma Torch System for Plasma Spraying”, Frontiers of Mechanical Engineering, Sep. 2011, vol. 6, pp. 324-331.
Bobzin, K. et al., “Numerical and Experimental Determination of Plasma Temperature during Air Plasma Spraying with a Multiple Cathodes Torch”, Journal of Materials Processing Technology, Oct. 2011, vol. 211, pp. 1620-1628.
Boulos, M. I., “The inductively coupled radio frequency plasma.” Journal of High Temperature Material Process, Jan. 1997, vol. 1, pp. 17-39.
Boulos, M., “Induction Plasma Processing of Materials for Powders, Coatings, and Near-Net-Shape Parts”, Advanced Materials & Processes, Aug. 2011, pp. 52-53, in 3 pages.
Boulos, M., “Plasma power can make better powders”, Metal Powder Report, May 2004, vol. 59(5), pp. 16-21.
Carreon, H. et al., “Study of Aging Effects in a Ti-6AL-4V alloy with Widmanslallen and Equiaxed Microstructures by Non-destructive Means”, AIP Conference Proceedings 1581, 2014 (published online Feb. 17, 2015), pp. 739-745.
Chang, S. et al., “One-Step Fast Synthesis of Li4Ti5012 Particles Using an Atmospheric Pressure Plasma Jet”, Journal of the American Ceramic Society, Dec. 26, 2013, vol. 97, No. 3, pp. 708-712.
Chau, J. L. K. et al. “Microwave Plasma Production of Metal Nanopowders,” Jun. 12, 2014, Inorganics, vol. 2, pp. 278-290 (Year: 2014).
Chen, G. et al., “Spherical Ti-6Al-4V Powders Produced by Gas Atomization”, Key Engineering Materials, vol. 704, Aug. 2016, pp. 287-292. URL: https://www.scientific.net/KEM.704.287.
Chen, Z., et al., “Advanced cathode materials for lithium-ion batteries”, MRS Bulletin, vol. 36, No. 7, 2011, pp. 498-505.
Chikumba et al., “High Entropy Alloys: Development and Applications” 7th International Conference on Latest Trends in Engineering & Technology (ICLTET'2015) Nov. 26-27, 2015 Irene, Pretoria (South Africa).
Choi, S. I., et al., “Continuous process of carbon nanotubes synthesis by decomposition of methane using an arc-jet plasma”, Thin Solid Films, 2006, vol. 506-507, 2006, pp. 244-249.
Coldwell, D. M. et al., “The reduction of SiO.sub.2 with Carbon in a Plasma”, Journal of Electrochemical Society, Jan. 1977, vol. 124, pp. 1686-1689.
Collin, J. E., et al., “Ionization of methane and it's electronic energy levels”, Canadian Journal of Chemistry, 2011, vol. 45, No. 16, pp. 1875-1882.
Dearmiti, C., “26. Functional Fillers for Plastics”, in Applied Plastics Engineering Handbook—Processing and Materials, ed., Myer Kuiz, Elsevier, 2011, pp. 455-468.
Decker, J., et al., “Sample preparation protocols for realization of reproducible characterization of single-wall carbon nanotubes”, Metrologia, 2009, vol. 46, No. 6, pp. 682-692.
Ding, F., et al., “Nucleation and Growth of Single-Walled Carbon Nanotubes: A Molecular Dynamics Study”, J. Phys. Chem. B, vol. 108, 2004, pp. 17369-17377.
Ding, F., et al., “The Importance of Strong Carbon-Metal Adhesion for Catalytic Nucleation of Single-Walled Carbon Nanotubes”, Nano Letters, 2008, vol. 8, No. 2, pp. 463-468.
Dolbec, R., “Recycling Spherical Powders”, Presented at Titanium 2015, Orlando, FL, Oct. 2015, in 20 pages.
Dors, M., et al., “Chemical Kinetics of Methane Pyrolysis in Microwave Plasma at Atmospheric Pressure”, Plasma Chem Plasma Process, 2013, vol. 34, No. 2, pp. 313-326.
Eremin, A., et al., “The Role of Methyl Radical in Soot Formation”, Combustion Science and Technology, vol. 191, No. 12, 2008, pp. 2226-2242.
Finckle, J. R., et al., “Plasma Pyrolysis of Methane to Hydrogen and Carbon Black”, Industrial Engineering and Chemical Research, 2002. Vol. 41, No. 6, 2002, pp. 1425-1435.
Fu, D., et al., “Direct synthesis of Y-junction carbon nanotubes by microwave-assisted pyrolysis of methane”, Materials Chemistry and Physics, vol. 118, vol. 2-3, 2009, pp. 501-505.
Fuchs, G.E. et al., “Microstructural evaluation of as-solidified and heat-treated y-TiAl based powders”, Materials Science and Engineering, 1992, A152, pp. 277-282.
Gleiman, S. et al., “Melting and spheroidization of hexagonal boron nitride in a microwave-powered, atmospheric pressure nitrogen plasma”, Journal of Materials Science, Aug. 2002, vol. 37(16), pp. 3429-3440.
Grace, J. et al., “Connecting particle sphericity and circularity”, Particuology, vol. 54, 2021, pp. 1-4, ISSN 1674-2001, https://doi .org/10.1016/j.partic.2020.09.006. (Year: 2020).
Gradl, P. et al., “GRCop-42 Development and Hot-fire Testing Using Additive Manufacturing Powder Bed Fusion for Channel-Cooled Combustion Chambers”, 55th AIAA/SAE/ASEE Joint Propulsion Conference 2019, Aug. 2019, pp. 1-26.
Haghighatpanah, S., et al., “Computational studies of catalyst-free single walled carbon nanotube growth”, J Chem Phys, vol. 139, No. 5, 10 pages.
Haneklaus, N., et al., “Stop Smoking—Tube-In-Tube Helical System for Flameless Calcination of Minerals”, Processes, vol. 5, No. 4, 2017, pp. 1-12.
He et al., “A precipitation-hardened high-entropy alloy with outstanding tensile properties” Acta Materialia 102, Jan. 2016, pp. 187-196.
Houmes et al., “Microwave Synthesis of Ternary Nitride Materials”, Journal of Solid State Chemistry, vol. 130, Issue 2, May 1997, pp. 266-271.
Huo, H., et al., “Composite electrolytes of polyethylene oxides/garnets interfacially wetted by ionic liquid for room-temperature solid-state lithium battery”, Journal of Power Sources, vol. 372, 2017, pp. 1-7.
International Search Report and Written Opinion, re PCT Application No. PCT/US2023/072411, mailed Nov. 8, 2023.
Irle, S., et al., “Milestones in molecular dynamics simulations of single-walled carbon nanotube formation: A brief critical review”, Nano Research, 2009, vol. 2, No. 10, 14 pages.
Ivasishin, et al., “Innovative Process for Manufacturing Hydrogenated Titanium Powder for Solid State Production of R/M Titanium Alloy Components” Titanium 2010, Oct. 3-6, 2010, 27 pages.
Jasek, O., et al., “Microwave plasma-based high temperature dehydrogenation of hydrocarbons and alcohols as a single route to highly efficient gas phase synthesis of freestanding graphene”, Nanotechnology, 2021, vol. 32, 11 pages.
Jasinski, M., et al., “Atmospheric pressure microwave plasma source for hydrogen production”, International Journal of Hydrogen Energy, vol. 38, Issue 26, 2013, pp. 11473-11483.
Jasinski, M., et al., “Hydrogen production via methane reforming using various microwave plasma sources”, Chem. Listy, 2008, vol. 102, pp. s1332-s1337.
Jia, H. et al., “Hierarchical porous silicon structures with extraordinary mechanical strength as high-performance lithium-ion battery anodes”, Nature Communications, Mar. 2020, vol. 11, in 9 pages. URL: httos://doi.ora/10.1038/s41467-020-15217-9.
Kassel, L. S., “The Thermal Decomposition of Methane”, Journal of the American Chemical Society, vol. 54, No. 10, 1932, pp. 3949-3961.
Kerscher, F., et al., “Low-carbon hydrogen production via electron beam plasma methane pyrolysis: Techno-economic analysis and carbon footprint assessment”, International Journal of Hydrogen Energy, vol. 46, Issue 38, 2021, pp. 19897-19912.
Yang et al., “Preparation of Spherical Titanium Powders from Polygonal Titanium Hydride Powders by Radio Frequency Plasma Treatment” Materials Transactions, vol. 54, No. 12 (2013) pp. 2313-2316.
Zavilopulo, A. N., et al., “Ionization and Dissociative Ionization of Methane Molecules”, Technical Physics, vol. 58, No. 9, 2013, pp. 1251-1257.
Zeng, X., et al., “Growth and morphology of carbon nanostructures by microwave-assisted pyrolysis of methane”, Physica E., vol. 42, No. 8, 2010, pp. 2103-2108.
Zhang , K., Ph.D., “The Microstructure and Properties of Hipped Powder Ti Alloys”, a thesis submitted to The University of Birmingham, College of Engineering and Physical Sciences, Apr. 2009, in 65 pages.
Zhang et al., Microstructures and properties of high-entropy alloys, Progress in Materials Science, vol. 61, 2013, pp. 1-93.
Zhang, H., et al., “Plasma activation of methane for hydrogen production in a N2 rotating gliding arc warm plasma: A chemical kinetics study”, Chemical Engineering Journal, vol. 345, 2018, pp. 67-78.
Zhang, J., et al., “Flexible and ion-conducting membrane electrolytes for solid-state lithium batteries: Dispersion of garnet nanoparticles in insulating polyethylene oxide”, Nano Energy, vol. 28, 2016, pp. 447-454.
Zhang, X. et al., “High thickness tungsten coating with low oxygen content prepared by air plasma spray”, Cailliao Gongcheng. (2014) (5) pp. 23-28 (Year: 2014).
Zhang, Y. D. et al., “High-energy cathode materials for Li-ion batteries: A review of recent developments”, Science China Technological Sciences, Sep. 2015, vol. 58(11), pp. 1809-1828.
Zhang, Y. S. et al., “Core-shell structured titanium-nitrogen alloys with high strength, high thermal stability and good plasticity”, Scientific Reports, Jan. 2017, vol. 7, in 8 pages.
Zhong, R., et al., “Continuous preparation and formation mechanism of few-layer graphene by gliding arc plasma”, Chemical Engineering Journal, vol. 387, 2020, 10 pages.
Zielinski, A et al., “Modeling and Analysis of a Dual-Channel Plasma Torch in Pulsed Mode Operation For Industrial Space, and Launch Applications”, IEEE Transactions on Plasma Science, Jul. 2015, vol. 43(7), pp. 2201-2206.
Kim, H., et al., “Three-Dimensional Porous Silicon Particles for Use in High-Performance Lithium Secondary Batteries”, Angewandte Chemie International Edition, vol. 47, No. 2, Dec. 15, 2008, pp. 10151-10154.
Kim, K. S., et al., “Synthesis of single-walled carbon nanotubes by induction thermal plasma”, Nano Research, 2009, vol. 2, No. 10, pp. 800-817.
Kim, S. et al., “Thermodynamic Evaluation of Oxygen Behavior in Ti Powder Deoxidized by Ca Reductant”, Met. Mater. Int., 2016, vol. 22, pp. 658-662.
Ko, M. et al., “Challenges in Accommodating vol. Change of Si Anodes for Li-Ion Batteries”, Chem Electro Chem, Aug. 2015, vol. 2, pp. 1645-1651. URL: https://doi.org/10.1002/celc.201500254.
Kotlyarov, V. I. et al, “Production of Spherical Powders on the Basis of Group IV Metals for Additive Manufacturing”, Inorganic Materials: Applied Research, Pleiades Publishing, May 2017, vol. 8, No. 3, pp. 452-458.
Kumal, R. R., et al., “Microwave Plasma Formation of Nanographene and Graphitic Carbon Black”, C—Journal of Carbon Research, 2020, vol. 6, No. 4, 10 pages.
Laine, R. M. et al., “Making nanosized oxide powders from precursors by flame spray pyrolysis”, Key Engineering Materials, Jan. 1999, vol. 159-160, pp. 17-24.
Lee, D. H., et al., “Comparative Study of Methane Activation Process by Different Plasma Sources”, Plasma Chem. Plasma Process., vol. 33, No. 4, 2013, pp. 647-661.
Lee, D. H., et al., “Mapping Plasma Chemistry in Hydrocarbon Fuel Processing Processes”, Plasma Chem. Plasma Process., vol. 33, No. 1, 2013, pp. 249-269.
Li, L. et al., “Spheroidization of silica powders by radio frequency inductively coupled plasma with Ar—H2 and Ar—N2 as the sheath gases at atmospheric pressure”, International Journal of Minerals, Metallurgy, and Materials, Sep. 2017, vol. 24(9), pp. 1067-1074.
Li, X. et al., “Mesoporous silicon sponge as an anti-pulverization structure for high-performance lithium-ion battery anodes”, Nature Communications, Jul. 2014, vol. 5, Article No. 4105, in 7 pages. URL: httDs://doi.orq/10.1038/ncomms5105.
Li, Z. et al., “Strong and Ductile Non-Equicaloric High-Entropy Alloys: Design, Processing, Microstructure, and Mechanical Properties”, The Journal of the Minerals, Metals & Materials Society, Aug. 2017, vol. 69(1), pp. 2099-2106. URL: https://doi.org/10.1007/s11837-017-2540-2.
Lin et al., “A low temperature molten salt process for aluminothermic reduction of silicon oxides to crystalline Si for Li-ion batteries”, Energy Environ. Sci., 2015, 8, 3187 (Year: 2015).
Lin, M., “Gas Quenching with Air Products' Rapid Gas Quenching Gas Mixture”, Air Products, Dec. 31, 2007, in 4 pages. URL: hllps://www.airproducts.co.uk/-/media/airproducts/liles/en/330/330-07-085-us-gas-quenching-wilh-air-products-rapid-Jas-quenching-gas-mixture.pdf.
Liu, Y., et al., “Advances of microwave plasma-enhanced chemical vapor deposition in fabrication of carbon nanotubes: a review”, J Mater Sci., vol. 55, 2021, pp. 12559-12583.
Liu, Z., et al., “Synthesis and characterization of LiNi1-x-yCoxMnyO2 as the cathode materials of secondary lithium batteries”, Journal of Power Sources, vol. 81-82, Sep. 1999, pp. 416-419.
Majewksi, T., “Investigation of W—Re—Ni heavy alloys produced from plasma spheroidized powders”, Solid State Phenomena, Mar. 2013, vol. 199, pp. 448-453.
Miller et al., “The reduction of silica with carbon and silicon carbide”, Journal of the American Ceramic Society, 1978, 62 (Year: 1978).
Moisan, M. et al., “Waveguide-Based Single and Multiple Nozzle Plasma Torches: the Tiago Concept”, Plasma Sources Science and Technology, Jun. 2001, vol. 10, pp. 387-394.
Moldover, M. R. et al., “Measurement of the Universal Gas Constant R Using a Spherical Acoustic Resonator”, Physical Review Letters, Jan. 1988, vol. 60(4), pp. 249-252.
Muoio, C. et al., “Phase Homogeneity in Y2O3—MgO Nanocomposites Synthesized by Thermal Decomposition of Nitrate Precursors with Ammonium Acetate Additions” J. Am. Ceram. Soc., 94[12] 4207-4217, 2011.
Murugan et al. “Nanostructured a/ß-tungsten by reduction of WO3 under microwave plasma”, Int. Journal of Refractory Metals and Hard Materials 29 (2011) 128-133. (Year: 2011).
Nichols, F. A., “On the spheroidization of rod-shaped particles of finite length”, Journal of Materials Science, Jun. 1976, vol. 11, pp. 1077-1082.
Nyutu, E. et al., “Ultrasonic Nozzle Spray in Situ Mixing and Microwave-Assisted Preparation of Nanocrystalline Spinel Metal Oxides: Nickel Ferrite and Zinc Aluminate”, Journal of Physical Chemistry C, Feb. 1, 2008, vol. 112, No. 5, pp. 1407-1414.
Ohta, R. et al., “Effect of PS-PVD production throughput on Si nanoparticles for negative electrode of lithium ion batteries”, Journal of Physics D: Applied Physics, Feb. 2018, vol. 51(1), in 7 pages.
Olsvik, O., et al., “Thermal Coupling of Methane—A Comparison Between Kinetic Model Data and Experimental Data”, Thermochimica Acta., vol. 232, No. 1, 1994, pp. 155-169.
Or, T. et al., “Recycling of mixed cathode lithium-ion batteries for electric vehicles: Current status and future outlook”, Carbon Energy, Jan. 2020, vol. 2, pp. 6-43. URL: https://doi.org/10.1002/cey2.29.
Park et al. “Preparation of spherical WTaMoNbV refractory high entropy alloy powder by inductively-coupled thermal plasma”, Materials Letters 255 (2019) 126513 (Year: 2019).
Popescu et al.. “New TiZrNbTaFe high entropy alloy used for medical applications” IOP Conference Series: Materials Science and Engineering 400. Mod Tech 2018 (2018), 9 pages.
Pulsation Reactors—Thermal Processing for Extraordinary Material Properties, retrieved from https://www.ibu-tec.com/facilities/pulsation-reactors/, retrieved on Mar. 18, 2023, pp. 5.
Reig, L. et al., “Microstructure and Mechanical Behavior of Porous Ti—6Al—4V Processed by Spherical Powder Sintering”, Materials, Oct. 23, 2013, vol. 6, pp. 4868-4878.
Sabat, K.C., “Hydrogen Plasma—Thermodynamics”, Journal of Physics: Conference Series, 2019, International Conference on Applied Physics, Powder and Material Science, in 6 pages.
Sastry, S.M.L. et al., “Rapid Solidification Processing of Titanium Alloys”, Journal of Metals (JOM), Sep. 1983, vol. 35, pp. 21-28.
Savage, S. J. et al., “Production of rapidly solidified metals and alloys”, Journal of Metals (JOM), Apr. 1984, vol. 36, pp. 20-33.
Schmidt-Ott, K., “Plasma-Reduction: Its Potential for Use in the Conservation of Metals”, Proceedings of Metal 2004, Oct. 2004, pp. 235-246.
Seehra, M. S., et al., “Correlation between X-ray diffraction and Raman spectra of 16 commercial graphene-based materials and their resulting classification”, Carbon N Y., 2017, vol. 111, pp. 380-384.
Sheng, Y. et al., “Preparation of Micro-spherical Titanium Powder by RF Plasma”, Rare Metal Materials and Engineering, Jun. 2013, vol. 42, No. 6, pp. 1291-1294.
Sheng, Y. et al., “Preparation of Spherical Tungsten Powder by RF Induction Plasma”, Rare Metal Materials and Engineering, Nov. 2011, vol. 40, No. 11, pp. 2033-2037.
SK makes world's 1st NCM battery with 90% nickel, The Investor, available online <https://www.theinvestor.co.kr/view.php?ud=20200810000820>, dated Aug. 10, 2020, 2 pages.
Suryanarayana, C. et al., “Rapid solidification processing of titanium alloys”, International Materials Reviews, 1991, vol. 36, pp. 85-123.
Suryanarayana, C., “Recent Developments in Mechanical Alloying”, Reviews on Advanced Materials Science, Aug. 2008, vol. 18(3), pp. 203-211.
Tang, H. P. et al., “Effect of Powder Reuse Times on Additive Manufacturing of Ti—6Al—4V by Selective Electron Beam Melting”, JOM, Mar. 2015, vol. 67, pp. 555-563.
Taylor, G., et al.; “Reduction of Metal Oxides by Hydrogen”, 1930, vol. 52 (Year: 1930).
Thierry, “Hydrogen (H2) Plasma”, Thierry Corp., retrieved from internet on Feb. 15, 2024, in 2 pages. URL: https://www.thierry-corp.com/plasma-knowledgebase/hydrogen-h2-plasma.
Van Laar, J. H. et al., “Spheroidization of Iron Powder in a Microwave Plasma Reactor”, Journal of the Southern African Institute of Mining and Metallurgy, Oct. 2016, vol. 116, No. 10, pp. 941-946.
Veith, M. et al., “Low temperature synthesis of nanocrystalline Y3Al5012 (YAG) and Ce-doped Y3Al5012 via different sol-gel methods”, J. Maler Chem, 1999, pp. 3069-3079.
Walter et al., “Microstructural and mechanical characterization of sol gel-derived Si—O—C glasses” Journal of the European Ceramic Society, vol. 22, Issue 13, Dec. 2002, pp. 2389-2400.
Wang, H., et al., “A detailed kinetic modeling study of aromatics formation in laminar premixed acetylene and ethylene flames” Combustion and Flame, vol. 110, No. 1-2, 1997, pp. 173-221.
Wang, J. et al., “Preparation of Spherical Tungsten and Titanium Powders by RF Induction Plasma Processing”, Rare Metals, Jun. 2015 (published online May 31, 2014), vol. 34, No. 6, pp. 431-435.
Wang, Y. et al., “Developments in Nanostructured Cathode Materials for High-Performance Lithium-Ion Batteries”, Advanced Materials, Jun. 2008, pp. 2251-2269.
Related Publications (1)
Number Date Country
20240071725 A1 Feb 2024 US
Provisional Applications (1)
Number Date Country
63373528 Aug 2022 US