Power semiconductor modules and method for producing them

Abstract

A power semiconductor module in a pressure contact embodiment and a method for producing such modules, for disposition on a cooling component. Load terminals of the modules are formed as metal molded bodies having at least one contact element, one flat portion, and contact feet emanating therefrom. Each flat portion is disposed parallel to, and spaced from, the surface of the substrate. The contact feet extend from the flat portion to the substrate. An elastic intermediate layer is disposed between adjacent load terminals, in the region of the respective flat portions, and the intermediate layer and load terminals form a stack.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiment according to the invention will be described in further detail in terms of the exemplary embodiments of FIGS. 1 and 2, in which like numerals represent like elements.

FIG. 1 shows a cross-section through a power semiconductor module of a preferred embodiment of the invention.

FIG. 2 is a perspective, showing a stack of load terminals of the power semiconductor module of a preferred embodiment of the invention.

Claims

1. A power semiconductor module for use in a pressure contact environment, and for disposition on a cooling component, the power semiconductor module comprising: a) a substrate having an insulation body, andconductor tracks disposed on a first main face of said substrate, said first main face being oriented toward the interior of the power semiconductor module;b) at least two power semiconductor components disposed on said substrate and electrically connected to said conductor tracks;c) a housing forming a portion of the exterior of said power semiconductor module;d) at least two conductive load terminals, each of said load terminals having at least one contact element;a generally flat portion disposed parallel to, and spaced from, said first main face of said substrate;a plurality of contact feet extending from said flat portion and contacting said substrate; andcontrol terminals leading to the exterior of said power semiconductor module;e) an elastic intermediate layer disposed between at least one pair of adjacent load terminals in the region of said respective flat portions thereof, wherein said load terminals and said elastic intermediate layer form a stack; andf) a pressure device for exerting pressure on said stack to maintain said stack in a desired position in said housing.

2. The power semiconductor module of claim 1, wherein said elastic intermediate layer is formed as a silicone pad having a minimum thickness of about 1 mm.

3. The power semiconductor module of claim 1, wherein said elastic intermediate layer electrically insulates said pair of load terminals from one another.

4. The power semiconductor module of claim 3, wherein parts of said flat portions of said load terminals are disposed proximate each other to form thereby said stack, said load terminals being insulated electrically from one another by said elastic intermediate layer; andwherein said pressure device exerts pressure on said stack, and thereby urges said load terminals into electrical contact with said conductor tracks.

5. The power semiconductor module of claim 1, wherein said pressure device includes at least one pressure element for exerting pressure on said stack.

6. The power semiconductor module of claim 5, further comprising a second elastic insulating layer disposed between said pressure element and said stack.

7. The power semiconductor module of claim 1, wherein said load terminals and said elastic intermediate layer are attached together by adhesive bonding.

8. The power semiconductor module of claim 1, wherein said load terminals and said elastic intermediate layer are laminated together.

9. The power semiconductor module of claim 1, wherein said pressure device and said stack have respective recesses therein for permitting passage therethrough of auxiliary terminals.

10. A method for producing a power semiconductor module for disposition on a cooling component, the power semiconductor module having a housing, comprising the following steps: a) forming a stack of at least two conductive load terminals with at least one intermediate insulating layer disposed between two adjacent load terminals;b) disposing said stack in the housing of the power semiconductor module;c) disposing a pressure device above said stack;d) preliminarily locking said pressure device on or in the housing; ande) disposing at least one substrate, having power semiconductor components disposed thereon, in a recess of said housing.

11. The method of claim 10, wherein said load terminals include contact feet for contacting said substrate, and wherein said method further comprises the steps of: forming said flat portions of said load terminals and said contact feet from a flat metal body by stamping and bending said flat metal body;joining each said load terminals to a respective contact device;laminating said load terminals into said stack with said elastic intermediate layers; anddisposing said contact devices outside of said housing.