The present disclosure relates to a raw material supply apparatus and a raw material supply method.
A technique of producing a gas is known, in which after dissolving a solid raw material in a solvent and spraying it into a process chamber, an interior of the process chamber is heated such that the solvent is removed and the solid raw material remains, and then the interior of the process chamber is heated to sublimate the solid raw material (see, e.g., Patent Document 1).
Patent Document
Japanese Laid-open Publication No. 2004-115831
The present invention provides a technique capable of improving an operation rate of a processing apparatus.
A raw material supply apparatus according to an embodiment of the present disclosure includes: a container configured to store a solution obtained by dissolving a first solid raw material in a solvent or a dispersion system obtained by dispersing the first solid raw material in a dispersion medium; an injection part configured to spray the solution or the dispersion system to inject the solution or the dispersion system into the container; an exhaust port configured to exhaust an inside of the container; a heating part configured to heat a second solid raw material formed by removing the solvent or the dispersion medium from the solution or the dispersion system; and a deposition part provided between the injection part and the exhaust port in the container and configured to deposit the second solid raw material.
According to the present disclosure, it is possible to improve an operation rate of a processing apparatus.
Non-limiting exemplary embodiments of the present disclosure will now be described with reference to the accompanying drawings. Throughout the accompanying drawings, the same or corresponding members or parts are denoted by the same or corresponding reference numerals, and redundant explanation thereof will be omitted.
The raw material source 10 supplies a solution, which is obtained by dissolving a first solid raw material in a solvent, or a slurry, which is obtained by dispersing the first solid raw material in a solvent (dispersion medium), to the raw material supply apparatuses 30 and 40. The raw material source 10 may be any source as long as it can supply the solution or slurry to the raw material supply apparatuses 30 and 40, and its form is not particularly limited.
The raw material source 10 is connected to the raw material supply apparatus 30 via pipes L10 and L11, and supplies the solution, which is obtained by dissolving the first solid raw material in the solvent, or the slurry, which is obtained by dispersing the first solid raw material in the solvent, to the raw material supply apparatus 30 through the pipes L10 and L11. A valve V11 is interposed in the pipe L11. When the valve V11 is opened, the solution or slurry is supplied from the raw material source 10 to the raw material supply apparatus 30, and when the valve V11 is closed, the supply of the solution or slurry from the raw material source 10 to the raw material supply apparatus 30 is cut off. Further, the pipe L11 may be provided with a flow rate controller (not shown) for controlling a flow rate of the solution or slurry flowing through the pipe L11, an additional valve, and the like.
Further, the raw material source 10 is connected to the raw material supply apparatus 40 via pipes L10 and L12, and supplies the solution, which is obtained by dissolving the first solid raw material in the solvent, or the slurry, which is obtained by dispersing the first solid raw material in the solvent, to the raw material supply apparatus 40 through the pipes L10 and L12. A valve V12 is interposed in the pipe L12. When the valve V12 is opened, the solution or slurry is supplied from the raw material source 10 to the raw material supply apparatus 40, and when the valve V12 is closed, the supply of the solution or slurry from the raw material source 10 to the raw material supply apparatus 40 is cut off. Further, the pipe L12 may be provided with a flow rate controller (not shown) for controlling a flow rate of the solution or slurry flowing through the pipe L12, an additional valve, and the like.
The first solid raw material is not particularly limited, but may be, for example, an organic metal complex containing a metal element such as strontium (Sr), molybdenum (Mo), ruthenium (Ru), zirconium (Zr), hafnium (Hf), tungsten (W), or aluminum (Al), or chloride containing a metal element such as tungsten (W) or aluminum (Al).
As the solvent, it is sufficient if the first solid raw material can be dissolved or dispersed to form a solution or slurry. For example, the solvent may be hexane.
The carrier gas source 20 supplies a carrier gas to the raw material supply apparatuses 30 and 40. The carrier gas source 20 is connected to the raw material supply apparatus 30 via pipes L20 and L21, and supplies the carrier gas to the raw material supply apparatus 30 through the pipes L20 and L21. A valve V21 is interposed in the pipe L21. When the valve V21 is opened, the carrier gas is supplied from the carrier gas source 20 to the raw material supply apparatus 30, and when the valve V21 is closed, the supply of the carrier gas from the carrier gas source 20 to the raw material supply apparatus 30 is cut off. Further, the pipe L21 may be provided with a flow rate controller (not shown) for controlling a flow rate of the carrier gas flowing through the pipe L21, an additional valve, and the like.
Further, the carrier gas source 20 is connected to the raw material supply apparatus 40 via pipes L20 and L22, and supplies the carrier gas to the raw material supply apparatus 40 through the pipes L20 and L22. A valve V22 is interposed in the pipe L22. When the valve V22 is opened, the carrier gas is supplied from the carrier gas source 20 to the raw material supply apparatus 40, and when the valve V22 is closed, the supply of the carrier gas from the carrier gas source 20 to the raw material supply apparatus 40 is cut off. Further, the pipe L22 may be provided with a flow rate controller (not shown) for controlling a flow rate of the carrier gas flowing through the pipe L22, an additional valve, and the like.
The carrier gas is not particularly limited, but may be, for example, an inert gas such as nitrogen (N2) or argon (Ar).
The raw material supply apparatuses 30 and 40 store the solution obtained by dissolving the first solid raw material in the solvent or the slurry obtained by dispersing the first solid raw material in the solvent, which is supplied from the raw material source 10. The raw material supply apparatus 30 and the raw material supply apparatus 40 are provided in parallel, and may have the same configuration, for example. Hereinafter, the raw material supply apparatus 30 will be described by way of example, but the raw material supply apparatus 40 may have the same configuration as the raw material supply apparatus 30.
The container 31 stores the solution or slurry.
The raw material injection part 32 sprays the solution or slurry supplied from the raw material source 10 through the pipe L11 to inject the solution or slurry into the container 31. The raw material injection part 32 vaporizes the solvent before the solution or slurry reaches the deposition part 36, by spraying the solution or slurry. The raw material injection part 32 may be, for example, a spray nozzle.
The carrier gas injection part 33 injects the carrier gas, which is supplied from the carrier gas source 20 through the pipe L21, into the container 31.
The exhaust port 34 is provided at a lower portion of the container 31 and exhausts the inside of the container 31. The processing apparatus 50 is connected to the exhaust port 34 via a pipe L51. Further, a valve V51 is interposed in the pipe L51. An exhaust device 60 is connected between the exhaust port 34 and the valve V51 in the pipe L51 via a pipe L61. When a valve V61 is opened, the inside of the container 31 can be exhausted by the exhaust device 60.
The heating part 35 heats a solid raw material (hereinafter, also referred to as a “second solid raw material M2”), which is formed by removing the solvent from the solution or slurry, to sublimate the second solid raw material M2 to generate a reactive gas. The heating part 35 may be, for example, a heater disposed so as to cover a bottom portion and an outer periphery of the container 31. The heating part 35 is configured to be capable of heating the inside of the container 31 to a temperature at which the second solid raw material M2 can be sublimated to generate the reactive gas.
The deposition part 36 is provided between the raw material injection part 32 and the exhaust port 34 in the container 31, and deposits the second solid raw material M2. It is desirable that the deposition part 36 is disposed so as to partition the inside of the container 31 into a region including the raw material injection part 32 and a region including the exhaust port 34. With such a configuration, when the reactive gas generated by sublimating the second solid raw material M2 is supplied to the processing apparatus 50 from the exhaust port 34, impurities such as particles are captured by the deposition part 36, so that it is possible to prevent the impurities such as particles from being supplied into the processing apparatus 50. The deposition part 36 may be made of a material that allows the reactive gas to pass therethrough and captures the second solid raw material M2 and the impurities such as particles. For example, the deposition part 36 is made of a porous material. The porous material may be a porous metallic material such as a sintered body of stainless steel, or a porous ceramic material.
In the raw material supply apparatus 30 described above, by opening the valve V11 and spraying and injecting the solution or slurry into the container 31 from the raw material injection part 32, the solvent is vaporized before the solution or slurry reaches the deposition part 36, and the second solid raw material M2 is deposited on the deposition part 36. In this way, in the raw material supply apparatus 30, the solution or slurry is deposited and stored in a solid state in the deposition part 36, so that an amount of storable solid raw material per fixed volume increases.
Further, in the example of
Further, in the example of
As shown in
The exhaust port 34 is provided at the upper portion of the container 31 and exhausts the inside of the container 31. The processing apparatus 50 is connected to the exhaust port 34 via the pipe L51. Further, the valve V51 is interposed in the pipe L51. The exhaust device 60 is connected between the exhaust port 34 and the valve V51 in the pipe L51 via the pipe L61. When the valve V61 is opened, the inside of the container 31 can be exhausted by the exhaust device 60. Further, the filter F is interposed between the exhaust port 34 and the valve V51 in the pipe L51. In the example shown in
In the raw material supply apparatus 30 described above, by opening the valve V11 and spraying and injecting the solution or slurry into the container 31 from the raw material injection part 32, the solvent is vaporized before the solution or slurry reaches a bottom portion 31b of the container 31, and the second solid raw material M2 is deposited on the bottom portion 31b of the container 31. With this configuration, in the raw material supply apparatus 30, the solution or slurry is deposited and stored in a solid state on the bottom portion 31b of the container 31, so that an amount of storable solid raw material per fixed volume increases.
In the example of
Further, in the example of
The processing apparatus 50 is connected to the raw material supply apparatus 30 via the pipe L51 and a pipe L50, and the reactive gas generated by heating and sublimating the second solid raw material M2 in the raw material supply apparatus 30 is supplied to the processing apparatus 50. The valve V51 is interposed in the pipe L51. When the valve V51 is opened, the reactive gas is supplied from the raw material supply apparatus 30 to the processing apparatus 50, and when the valve V51 is closed, the supply of the reactive gas from the raw material supply apparatus 30 to the processing apparatus 50 is cut off.
Further, the processing apparatus 50 is connected to the raw material supply apparatus 40 via a pipe L52 and the pipe L50, and the reactive gas generated by heating and sublimating the second solid raw material M2 in the raw material supply apparatus 40 is supplied to the processing apparatus 50. A valve V52 is interposed in the pipe L52. When the valve V52 is opened, the reactive gas is supplied from the raw material supply apparatus 40 to the processing apparatus 50, and when the valve V52 is closed, the supply of the reactive gas from the raw material supply apparatus 40 to the processing apparatus 50 is cut off.
The processing apparatus 50 executes various processes such as a film-forming process on a substrate such as a semiconductor wafer by using the reactive gas supplied from the raw material supply apparatuses 30 and 40. The processing apparatus 50 includes a process container 51, a mass flow meter 52, and a valve 53. The process container 51 accommodates one or more substrates. The mass flow meter 52 is interposed in the pipe L50 and measures a flow rate of the reactive gas flowing through the pipe L50. The valve 53 is interposed in the pipe L50. When the valve V53 is opened, the reactive gas is supplied from the raw material supply apparatuses 30 and 40 to the process container 51, and when the valve V53 is closed, the supply of the reactive gas from the raw material supply apparatuses 30 and 40 to the process container 51 is cut off.
The control device 90 controls individual components of the raw material supply system. For example, the control device 90 controls operations of the raw material source 10, the carrier gas source 20, the raw material supply apparatuses 30 and 40, the processing apparatus 50, and the like. Further, the control device 90 controls opening and closing of various valves. The control device 90 may be, for example, a computer.
An example of an operation (raw material supply method) of the raw material supply system 1 will be described. In the raw material supply system 1, the control device 90 controls the opening and closing of the valves V11, V12, V21, V22, V51, and V52, so that one of the two raw material supply apparatuses 30 and 40 provided in parallel supplies the reactive gas to the processing apparatus 50, and the other thereof fills the solid raw material. Hereinafter, an example of the operation of the raw material supply system 1 will be described in detail.
First, a case where the raw material supply apparatus 30 supplies the reactive gas to the processing apparatus 50 and the raw material supply apparatus 40 fills the solid raw material will be described with reference to
The control device 90 controls the heating part 35 (see
Next, a case where the state (see
First, the control device 90 turns off the heating part 35 of the raw material supply apparatus 30 and closes the valves V21, V51, and V12. As a result, the supply of the reactive gas from the raw material supply apparatus 30 to the processing apparatus 50 is stopped.
Subsequently, the control device 90 controls the heating part of the raw material supply apparatus 40 to heat and sublimate the second solid raw material M2 deposited on the deposition part in the container, thereby generating the reactive gas. Further, the control device 90 opens the valves V22 and V52. As a result, the carrier gas is injected from the carrier gas source 20 into the raw material supply apparatus 40 through the pipes L20 and L22, and the reactive gas generated in the container, together with the carrier gas, is supplied to the processing apparatus 50 through the pipes L52 and L50. Further, the control device 90 opens the valve V11. As a result, the solution or slurry is injected from the raw material source 10 into the raw material supply apparatus 30 through the pipes L10 and L11, and the second solid raw material M2 is deposited on the deposition part 36 in the container 31 of the raw material supply apparatus 30. As described above, when the valves V11, V22, and V52 are in the opened state and the valves V12, V21, and V51 are in the closed state, the raw material supply apparatus 40 supplies the reactive gas to the processing apparatus 50, and the raw material supply apparatus 30 fills the solid raw material.
As described above, in the raw material supply system 1, the control device 90 controls the opening and closing of the valves V11, V12, V21, V22, V51, and V52 so that one of the two raw material supply apparatuses 30 and 40 supplies the reactive gas to the processing apparatus 50 and the other thereof fills the solid raw material. As a result, since the raw material can be automatically replenished to the raw material supply apparatuses 30 and 40, continuous operation capacity of the processing apparatus 50 can be improved, which improves the operation rate of the processing apparatus 50.
In addition, in the raw material supply system 1, the solution or slurry is sprayed and injected into the container 31 from the raw material injection part 32 so that the solvent is vaporized and deposited as the second solid raw material M2 before the solution or slurry reaches the deposition part 36 or the bottom portion 31b of the container 31. As described above, in the raw material supply system 1, since the solution or slurry injected into the container 31 is deposited and stored in a solid state on the deposition part 36 or the bottom portion 31b of the container 31, the amount of storable solid raw material per fixed volume can be increased. In contrast, when the solution is stored in a liquid state in the container 31, a size of the container 31 depends on solubility of the solid raw material in the solvent. Therefore, when the solid raw material has low solubility, a maximum amount of the solid raw material that can be stored in the container 31 is lowered.
In addition, in the raw material supply system 1, the solution, which is obtained by dissolving the solid raw material in the solvent, or the slurry, which is obtained by dispersing the solid raw material in the solvent, is sprayed to vaporize the solvent and after being deposited as the solid raw material M2 on the deposition part 36, the second solid raw material M2 is sublimated and supplied to the processing apparatus 50. This simplifies a flow rate control and facilitates controlling a large-scale flow rate.
It should be considered that the embodiments disclosed this time are exemplary in all respects, not restrictive. The above embodiments may be omitted, replaced, or changed in various forms without departing from the appended claims and the gist thereof.
In the above embodiment, the solution, which is obtained by dissolving the first solid raw material in the solvent, or the slurry which is obtained by dispersing the first solid raw material in the dispersion medium, has been described as an example, but the present disclosure is not limited thereto. For example, instead of the slurry, a dispersion system such as a colloidal solution which is obtained by dispersing the first solid raw material in a dispersion medium can also be used. For example, by using the colloidal solution, it is possible to fill a precursor having a higher concentration than using a solution or a slurry. The dispersion system includes a slurry and a colloid as the subordinate concept. The slurry is also referred to as a suspension. The colloid includes a colloidal solution as the subordinate concept. The colloidal solution is also referred to as a sol.
This international application claims priority based on Japanese Patent Application No. 2019-173419, filed on Sep. 24, 2019, the entire contents of which are incorporated herein by reference.
1: raw material supply system. 30: raw material supply apparatus, 31: container, 32: raw material injection part, 34: exhaust port, 35: heating part, 36: deposition part, 40: raw material supply apparatus, 50: processing apparatus, 60: exhaust device, M1: first solid raw material, M2: second solid raw material
Number | Date | Country | Kind |
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2019-173419 | Sep 2019 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2020/034970 | 9/15/2020 | WO |