SEMICONDUCTOR DEVICE AND MEMORY CARD USING THE SAME

Abstract

A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing a structure of a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a plan view showing the semiconductor device shown in FIG. 1.

FIG. 3 is a rear view showing the semiconductor device shown in FIG. 1.

FIG. 4 is a view showing an example of a second wiring network provided on a second main surface of a circuit board composing the semiconductor device shown in FIG. 1.

FIG. 5 is a view showing another example of the second wiring network provided on the second main surface of the circuit board composing the semiconductor device shown in FIG. 1.

FIG. 6 is a view showing another example of the circuit board composing the semiconductor device shown in FIG. 1.

FIGS. 7A, 7B and 7C are views showing a manufacturing process of the semiconductor device shown in FIG. 1.

FIGS. 8A and 8B are plan views showing a cutting step of a circuit board frame in the manufacturing process of the semiconductor device shown in FIG. 1.

FIGS. 9A and 9B are plan views showing another cutting step of the circuit board frame in the manufacturing process of the semiconductor device shown in FIG. 1.

Claims

1. A semiconductor device, comprising: a substrate including a first main surface, a second main surface on an opposite of the first main surface, and a curved portion provided in at least one side of an external shape thereof;a semiconductor element mounted on at least one of the first and second main surfaces of the substrate; anda wiring network provided on at least one of the first and second main surfaces of the substrate,wherein distance from the side including the curved portion of the substrate to the wiring network is larger than distance from at least one of the other sides of the substrate to the wiring network.

2. The semiconductor device as set forth in claim 1, wherein the distance from the side including the curved portion of the substrate to the wiring network is 0.5 mm or more.

3. The semiconductor device as set forth in claim 1, wherein the substrate includes a cut-out portion provided in the side including the curved portion.

4. The semiconductor device as set forth in claim 1, wherein the substrate includes a curved corner portion, and distance from the curved corner portion to the wiring network is larger than the distance from the other side to the wiring network.

5. The semiconductor device as set forth in claim 1, wherein the substrate includes a dummy wiring provided between the side including the curved portion and the wiring network.

6. The semiconductor device as set forth in claim 1, wherein the wiring network includes a plating lead wire, and the plating lead wire is drawn out toward the other side of the substrate.

7. A semiconductor device, comprising: a substrate including a first main surface, a second main surface on an opposite of the first main surface, and a curved portion provided in at least one side of an external shape thereof;an external connecting terminal formed on the first main surface of the substrate;a first wiring network provided in a region except a region formed the external connecting terminal on the first main surface of the substrate;a second wiring network provided on the second main surface of the substrate; anda semiconductor element mounted on the second main surface of the substrate,wherein distance from the side including the curved portion of the substrate to the first wiring network is larger than distance from at least one of the other sides of the substrate to the first wiring network, and distance from the side including the curved portion of the substrate to the second wiring network is larger than distance from at least one of the other sides of the substrate to the second wiring network.

8. The semiconductor device as set forth in claim 7, wherein the distances from the side including the curved portion of the substrate to the first and second wiring networks are 0.5 mm or more.

9. The semiconductor device as set forth in claim 7, wherein the substrate includes a cut-out portion provided in the side including the curved portion.

10. The semiconductor device as set forth in claim 7, wherein the substrate includes a curved corner portion, and distance from the curved corner portion to the first wiring network is larger than the distance from the other side to the first wiring network, and distance from the curved corner portion to the second wiring network is larger than the distance from the other side to the second wiring network.

11. The semiconductor device as set forth in claim 7, wherein the substrate includes a dummy wiring provided between the side including the curved portion and at least one of the first and second wiring networks.

12. The semiconductor device as set forth in claim 7, wherein at least one of the first and second wiring networks includes a plating lead wire, and the plating lead wire is drawn out toward the other side of the substrate.

13. A memory card, comprising: a substrate including a first main surface, a second main surface on an opposite of the first main surface, and a curved portion provided in at least one side of an external shape thereof;an external connecting terminal formed on the first main surface of the substrate;a first wiring network provided in a region except a region formed the external connecting terminal on the first main surface of the substrate;an insulating layer formed on the first main surface of the substrate to cover the first wiring network;a second wiring network provided on the second main surface of the substrate;a semiconductor memory element mounted on the second main surface of the substrate; anda sealing resin layer formed on the second main surface of the substrate to seal the semiconductor memory element,wherein distance from the side including the curved portion of the substrate to the first wiring network is larger than distance from at least one of the other sides of the substrate to the first wiring network, and distance from the side including the curved portion of the substrate to the second wiring network is larger than distance from at least one of the other sides of the substrate to the second wiring network.

14. The memory card as set forth in claim 13, further comprising: a controller element mounted on the second main surface of the substrate.

15. The memory card as set forth in claim 13, wherein the distances from the side including the curved portion of the substrate to the first and second wiring networks are 0.5 mm or more.

16. The memory card as set forth in claim 13, wherein the substrate includes a cut-out portion provided in the side including the curved portion.

17. The memory card as set forth in claim 13, wherein the substrate includes a curved corner portion, and distance from the curved corner portion to the first wiring network is larger than the distance from the other side to the first wiring network, and distance from the curved corner portion to the second wiring network is larger than the distance from the other side to the second wiring network.

18. The memory card as set forth in claim 13, wherein the substrate includes a dummy wiring provided between the side including the curved portion and at least one of the first and second wiring networks.

19. The memory card as set forth in claim 13, wherein at least one of the first and second wiring networks includes a plating lead wire, and the plating lead wire is drawn out toward the other side of the substrate.

20. The memory card as set forth in claim 13, wherein the insulating layer and the sealing resin layer expose outside.