"High Performance Multilevel Interconnection System with Stacked Interlayer Dielectrics by Plasma CVD and Bias Sputtering", Abe et al., Jun. 12-13, 1989 VMIC Conference, 1989 IEEE, pp. 404-410. |
"A New Reliability Problem Associated with Ar Ion Sputter Cleaning of Interconnect Vias", Tomioka et al., 1989 IEEE/IRPS, pp. 53-58. |
"Comparison of Electromigration Phenomenon Between Aluminum Interconnection of Various Multilayers Materials", Fujii et al., Jun. 12-13, 1989 VMIC Conference, 1989 IEEE, pp. 477-483. |
"VLSI Electronics Microstructure Science", vol. 15, 1987, Edited by Norman G. Einspruch, pp. 304-305. |