STATIC ELECTRICITY DEFLECTING DEVICE, ELECTRON BEAM IRRADIATING APPARATUS, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND METHOD OF MANUFACTURING SUBSTRATE

Abstract

A substrate processing apparatus which irradiates a substrate under processing with an electron beam and processes the substrate with the electron beam is disclosed. The substrate processing apparatus includes an electron beam generation mechanism which generates the electron beam, first area having a plurality of first static electricity deflecting devices whose thicknesses gradually increase in a traveling direction of the electron beam, and a second area disposed on a downstream side of the electron beam of the first area and having a plurality of second static electricity deflecting devices whose thicknesses are nearly same in the traveling direction of the electron beam. The substrate processing apparatus may further include a plurality of lenses whose thicknesses gradually decrease in the traveling direction of the electron beam, at least one of the plurality of lenses being disposed in each of the first area and the second area.

Description

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a plan view showing an outline of the structure of a substrate processing apparatus according to an embodiment of the present invention;

FIG. 2 is a perspective view describing an outline of the structure of an atmospheric aligner shown in FIG. 1;

FIG. 3 is a perspective view describing an outline of the structure of a heat processing section shown in FIG. 2;

FIG. 4 is a sectional view describing an outline of the structure of the heat processing section shown in FIG. 2;

FIG. 5 is a sectional view describing an outline of the structure of the atmospheric aligner shown in FIG. 2;

FIG. 6 is a plan view describing an outline of the structure of a vacuum preparation chamber shown in FIG. 1;

FIG. 7 is a sectional view describing an outline of the structure of a reduced pressure transferring chamber shown in FIG. 1;

FIG. 8 is a plan view describing an outline of the structure of an exposure processing section shown in FIG. 1;

FIG. 9 is a flow chart describing a process flow with respect to the structure of the substrate processing apparatus shown in FIG. 1;

FIG. 10 is a schematic sectional view describing the structure of the exposure processing chamber shown in FIG. 1;

FIG. 11 is a sectional view describing an outline of the structure of principal portions of the exposure processing chamber shown in FIG. 10;

FIG. 12 is a sectional view describing an outline of the structure of principal portions of the exposure processing chamber shown in FIG. 10;

FIG. 13 is a plan view describing an outline of the structure of principal portions of a stage shown in FIG. 12;

FIG. 14 is a schematic diagram describing the structure of a static electricity chuck mechanism section of the exposure processing chamber shown in FIG. 10;

FIG. 15 is a conceptual diagram showing a basic structure of an electron beam irradiating apparatus disposed in the exposure processing chamber shown in FIG. 10;

FIG. 16 is a perspective view showing an outline of a static electricity deflecting device of a column of the electron beam irradiating apparatus shown in FIG. 15;

FIG. 17 is a top view showing the static electricity deflecting device shown in FIG. 16;

FIG. 18 is a perspective view showing an outline of the static electricity deflecting device shown in FIG. 16, the static electricity deflecting device being cut in an axial direction;

FIG. 19 is a partial plan view showing the static electricity deflecting device shown in FIG. 16;

FIG. 20 is a top view showing a static electricity deflecting device according to a modification of the embodiment;

FIG. 21 is a top view showing a static electricity deflecting device according to another modification of the embodiment;

FIG. 22 is a top view showing a static electricity deflecting device according to another modification of the embodiment;

FIG. 23 is a perspective view showing an outline of a lens of the column of the electron beam irradiating apparatus shown in FIG. 15;

FIG. 24 is a sectional view showing an outline of the lens shown in FIG. 23, taken along line A-A′;

FIG. 25 is a plan view describing an outline of the structure of the substrate processing apparatus shown in FIG. 1;

FIG. 26 is a sectional view describing an outline of the structure of the substrate processing apparatus shown in FIG. 1;

FIG. 27 is a sectional view describing an outline of the structure of the substrate processing apparatus shown in FIG. 1;

FIG. 28 is a perspective view describing an outline of the structure of the substrate processing apparatus shown in FIG. 1;

FIG. 29 is a plan view describing an outline of the structure of the substrate processing apparatus shown in FIG. 1;

FIG. 30 is a schematic diagram describing an outline of the structure of a control system of the substrate processing apparatus shown in FIG. 1;

FIG. 31 is a plan view showing the structure of a substrate processing apparatus according to another embodiment of the present invention;

FIG. 32 is a perspective view showing an outline of the structure of Helmholtz coils shown in FIG. 31;

FIG. 33 is a sectional view describing an outline of a static electricity deflecting device according to another embodiment of the present invention;

FIG. 34 is a sectional view describing an outline of a static electricity deflecting device according to another embodiment of the present invention;

FIG. 35 is a sectional view describing an outline of a static electricity deflecting device according to another embodiment of the present invention;

FIG. 36 is a sectional view describing an outline of a manufacturing process of the static electricity deflecting device shown in FIG. 17;

FIG. 37 is a sectional view describing an outline of a manufacturing process of the static electricity deflecting device shown in FIG. 17;

FIG. 38 is a perspective view describing an outline of a static electricity deflecting device according to another embodiment of the present invention;

FIG. 39 is a perspective view describing an outline of a static electricity deflecting device according to another embodiment of the present invention;

FIG. 40 is a perspective view describing an outline of principal sections of the static electricity deflecting device shown in FIG. 39;

FIG. 41 is a perspective view describing an outline of the static electricity deflecting device shown in FIG. 40;

FIG. 42 is a perspective view describing an outline of the static electricity deflecting device shown in FIG. 40;

FIG. 43 is a perspective view describing an outline of the static electricity deflecting device shown in FIG. 39;

FIG. 44 is a perspective view describing an outline of the static electricity deflecting device shown in FIG. 40;

FIG. 45 is a schematic diagram describing an outline of the structure of a substrate processing apparatus according to another embodiment of the present invention;

FIG. 46 is a sectional view showing an outline of a lens according to another embodiment of the present invention;

FIG. 47 is a sectional view showing an outline of a lens according to another embodiment of the present invention; and

FIG. 48 is a sectional view showing an outline of a lens according to another embodiment of the present invention.

Claims

1. A static electricity deflecting device for a substrate processing apparatus which irradiates a substrate under processing with an electron beam and processes the substrate with the electron beam, comprising: a passing portion which causes the electron beam to pass;a plurality of groove portions radially formed from the passing portion;a space portion which is disposed at an outer position of each of the plurality of groove portions and whose width is larger than a width of each of the plurality of groove portions;a conductive film disposed in each of the plurality of space portions such that the conductive film is visible from the passing portion, the conductive film being substantially grounded;an insulative portion disposed in each of the plurality of space portions such that the insulative portion is not visible from the passing portion; andan electrically conductive film which electrically connects the conductive film.

2. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 1, wherein the conductive film and the electrically conductive film are made of a same material and unified.

3. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 1, further comprising: a conductive film which is disposed between adjacent two of the plurality of groove portions on a passing portion side and at which a predetermined power is applied.

4. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 3, further comprising: a power supply pin through which the power is supplied to the conductive film; andan insertion opening into which the power supply pin is inserted.

5. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 1, further comprising:a convex portion or a concave portion disposed on an upstream side and/or a downstream side of the electron beam.

6. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 1, further comprising: a power supply conductive film which is disposed between adjacent two of the plurality of groove portions on a passing portion side and at which a predetermined power is applied, powers applied to opposite power supply conductive films being same, powers applied to non-opposite power supply conductive films being different.

7. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 6, further comprising: a power supply conductive film, an insulative portion, and a conductive film are outwardly disposed in a concentric circular shape on an upstream side and/or a downstream side of the electron beam.

8. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 7, wherein a thickness of an area of the power supply conductive film and a thickness of a first area of the insulative portion are nearly same and a first thickness, andwherein a thickness of a second area other than the first area of the insulative portion and a thickness of an area of the conductive film are nearly same and a second thickness.

9. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 8, wherein the first thickness is smaller than the second thickness.

10. A static electricity deflecting device for a substrate processing apparatus which irradiates a substrate under processing with an electron beam and processes the substrate with the electron beam, comprising: a passing portion which causes the electron beam to pass;a plurality of electrode mechanisms each of which sandwiches adjacent two of a plurality of groove portions radially formed from the passing portion;a space portion disposed at an outer position of each of the plurality of groove portions, a width of the space portion being larger than a width of each of the plurality of groove portions;a plurality of conductive films disposed in each of the space portions and substantially grounded;an insulative portion disposed in each of the space portions;an electrically conductive film which electrically connects the plurality of conductive films,wherein the conducive film and the electrically conductive film are made of a same material and unified.

11. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 10, further comprising: a conductive film which is disposed between adjacent two of the plurality of groove portions on a passing portion side and at which a predetermined power is applied.

12. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 10, further comprising: a power supply pin through which the power is supplied to the conductive film; andan insertion opening into which the power supply pin is inserted.

13. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 10, further comprising: a convex portion or a concave portion disposed on an upstream side and/or a downstream side of the electron beam.

14. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 10, further comprising: a power supply conductive film which is disposed between adjacent two of the plurality of groove portions on the passing portion side and at which a predetermined power is applied, powers applied to opposite power supply conductive films being same, powers applied to non-opposite power supply conductive films being different.

15. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 14, further comprising: a power supply conductive film, an insulative portion, and a conductive film are outwardly disposed in a concentric circular shape on an upstream side and/or a downstream side of the electron beam.

16. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 15, wherein a thickness of an area of the power supply conductive film and a thickness of a first area of the insulative portion are nearly same and a first thickness, andwherein a thickness of a second area other than the first area of the insulative portion and a thickness of an area of the conductive film are nearly same and a second thickness.

17. The static electricity deflecting device for the substrate processing apparatus as set forth in claim 16, wherein the first thickness is smaller than the second thickness.

18. A method of manufacturing a static electricity deflecting device for a substrate processing apparatus which irradiates a substrate under processing with an electron beam and processes the substrate with the electron beam, comprising the steps of: radially forming a through-hole in each of a plurality of electrode mechanisms radially formed;sealing the through-hole on a side of which the electron beam passes with a conductive member;inserting a conducive pin from an outer position of the through-hole and pressing an edge portion of the conductive pin into the conductive member;scraping off the conductive member until a thickness of the conductive member becomes a predetermined thickness; andforming a conducive film for a thickness larger than a predetermined thickness of the conductive member after the scraping step.

19. The method of manufacturing the static electricity deflecting device for the substrate processing apparatus as set forth in claim 18, wherein the conductive film forming step is performed by forming the conductive film on the side of which the electron beam passes and on an upstream side and/or a downstream side of the electron beam.