SUBSTRATE PROCESSING APPARATUS

Abstract

A substrate processing apparatus comprises an interface block. An exposure device is arranged adjacent to the interface block. The interface block includes a placement/bake unit. A substrate that has been subjected to exposure processing in the exposure device is subjected to cleaning and drying processing in a second cleaning/drying processing unit, and is then transported to a placement/heating unit. In the placement/heating unit, the substrate is subjected to post-exposure bake processing.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a substrate processing apparatus according to a first embodiment of the present invention;

FIG. 2 is a schematic side view of the substrate processing apparatus shown in FIG. 1 as viewed from the +X direction;

FIG. 3 is a schematic side view of the substrate processing apparatus shown in FIG. 1 as viewed from the −X direction;

FIG. 4 is a schematic side view of an interface block as viewed from the +Y side;

FIG. 5 is a perspective view of the appearance of a placement/heating unit

FIG. 6 is a cross-sectional view of the placement/heating unit shown in FIG. 5;

FIG. 7 is a diagram for explaining the operation of the placement/heating unit;

FIG. 8 is a diagram for explaining the operation of the placement/heating unit;

FIG. 9 is a diagram for explaining the configuration of a cleaning/drying processing unit;

FIG. 10 is a diagram for explaining the operation of the cleaning/drying processing unit;

FIG. 11 is a schematic view showing a nozzle for cleaning processing and a nozzle for drying processing that are integrally formed;

FIG. 12 is a schematic view showing another example of the nozzle for drying processing;

FIG. 13 is a diagram for in explaining a method of subjecting a substrate to drying processing in a case where the nozzle for drying processing shown in FIG. 12 is used;

FIG. 14 is a schematic view showing another example of the nozzle for drying processing;

FIG. 15 is a schematic view showing another example of the cleaning/drying processing unit;

FIG. 16 is a diagram for explaining a method of subjecting a substrate to drying processing in a case where the cleaning/drying processing unit shown unit in FIG. 15 is used;

FIG. 17 is a vertical sectional view showing an example of the internal configuration of a two-fluid nozzle used for cleaning and drying processing; and

FIG. 18 is a diagram for explaining a method of subjecting a substrate to cleaning and drying processing in a case where the two-fluid nozzle shown in FIG. 17 is used.

Claims

1. A substrate processing apparatus that is arranged adjacent to an exposure device, comprising: a processing section for subjecting a substrate to processing; andan interface that transfers and receives the substrate between said processing section and said exposure device,said processing section includinga photosensitive film formation unit that forms a photosensitive film composed of a photosensitive material on the substrate,said interface includinga thermal processing unit that subjects the substrate after exposure processing by said exposure device to thermal processing,a first transport unit that transports the substrate between said processing section and said thermal processing unit, anda second transport unit that transports the substrate between said exposure device and said thermal processing unit,said second transport unit carrying the substrate after the exposure processing by said exposure device into said thermal processing unit,said first transport unit carrying the substrate after the thermal processing by said thermal processing unit out of said thermal processing unit.

2. The substrate processing apparatus according to claim 1, wherein said thermal processing unit includesa supporting portion that supports the substrate carried into or out of the thermal processing unit,a heating portion that subjects the substrate to heating processing, anda transport device that transports the substrate between said supporting portion and said heating portion.

3. The substrate processing apparatus according to claim 2, further comprising a controller that controls said heating unit so as to heat the substrate after the exposure processing by said exposure device at predetermined timing.

4. The substrate processing apparatus according to claim 1, wherein said interface further includes a platform on which the substrate is temporarily placed,said first transport unit transporting the substrate after predetermined processing by said processing section to said platform, andsaid second transport unit transporting the substrate from said platform to said exposure device.

5. The substrate processing apparatus according to claim 4, wherein said platform is a temperature control waiting unit that makes the substrate before the exposure processing by said exposure device wait until the substrate can be carried into said exposure device while keeping the substrate at a predetermined temperature.

6. The substrate processing apparatus according to claim 4, wherein at least one of said processing section and said interface includes a drying processing unit that subjects the substrate to drying processing after the exposure processing by said exposure device and before the thermal processing by said thermal processing unit.

7. The substrate processing apparatus according to claim 6, wherein said drying processing unit subjects the substrate to cleaning processing before subjecting the substrate to the drying processing.

8. The substrate processing apparatus according to claim 6, wherein at least one of said processing section and said interface includes a cleaning processing unit that subjects the substrate to the cleaning processing before the exposure processing by said exposure device.

9. The substrate processing apparatus according to claim 8, wherein said cleaning processing unit subjects the substrate to the drying processing after subjecting the substrate to the cleaning processing.

10. The substrate processing apparatus according to claim 8, wherein said processing section, said interface, and said exposure device are arranged side by side in a first direction,said interface has at least one side surface in a second direction perpendicular to said first direction within a horizontal plane, andsaid drying processing unit is arranged on the side of said one side surface within said interface.

11. The substrate processing apparatus according to claim 10, wherein said interface has another side surface opposite to said one side surface in said second direction, andsaid cleaning processing unit is arranged on the side of said opposite side surface within said interface.

12. The substrate processing apparatus according to claim 11, wherein said thermal processing unit and said platform are stacked in a substantially central part in said second direction within said interface,said first transport unit is arranged between said cleaning processing unit and said thermal processing unit, andsaid second transport unit is arranged between said thermal processing unit and said drying processing unit.

13. The substrate processing apparatus according to claim 6, wherein said second transport unit includes first and second holders that each hold the substrate,said first holder holding the substrate when the substrate is transported before the exposure processing by said exposure device and after the drying processing by said drying processing unit, andsaid second holder holding the substrate when the substrate after said exposure processing is transported from said exposure device to said drying processing unit.

14. The substrate processing apparatus according to claim 13, wherein said second holder is provided below said first holder.

15. The substrate processing apparatus according to claim 1, wherein said interface further includes an edge exposure unit that exposes a peripheral portion of the substrate, andsaid first transport unit transports the substrate among said processing section, said edge exposure unit, said cleaning processing unit, and said platform.