1. Technical Field
The disclosure relates to a support device, and more particularly, to a support device used in personal computers.
2. Description of Related Art
A central processing unit (CPU) is mounted on a motherboard in a computer for processing data. When the computer is operated, heat produced by the CPU must be dispersed external to the computer. If heat builds up internal to the computer, this creates excessively high temperature which will lower the performance of the CPU and/or even permanently damage the CPU. Various cooling devices are provided in the computer for dissipating heat. Traditional cooling devices have a number of fins stacked together to dissipate heat. The stacked fins of the cooling devices are mounted on a main board on which the CPU is mounted. Therefore the full weight of the cooling devices and the CPU is directly supported by the main board, and as a result the main board is prone to damages due to the weight.
Therefore, it is desirable to provide a support device and an electronic device using the same to support a cooling device used in a personal computer to eliminate or at least alleviate the above problems.
Referring to
The circuit board 10 includes an upper surface 12 and a lower surface 15 at an opposite side of the circuit board 10. The circuit board 10 includes a number of conductive tracks (not shown) and a number of electronic members (not labeled) attached on the upper surface 12. The circuit board 10 defines a number of through holes 11 through the upper and lower surfaces 12, 15, and a receiving space 13 formed in the upper surface 12 for receiving the CPU 20 therein. The circuit board 10 includes a number of grounding rings 14 formed on the lower surface 15 around the corresponding through holes 11.
The CPU 20 is received in the receiving space 13 of the circuit board 10. Alternatively, the CPU 20 can be substituted by other data processing modules.
The support device 30 is made of electrical-conductive material, and includes a substrate 31, a number of protrusions 32, and a number of conductive pads 35. The protrusions 32 perpendicularly extend away from a surface of the substrate 31 and are arranged as a matrix corresponding to the through holes 11 of the circuit board 10. Each of the protrusions 32 defines a threaded hole 33 therein. The conductive pads 35 are mounted on the substrate 31 around the corresponding protrusions 32. The protrusions 32 are fitted into the through holes 11 of the circuit board 10. The conductive pads 35 and the grounding ring 14 of the circuit board 10 are arranged to be connected to each other for grounding the circuit board 10 when the protrusions 32 are fitted into the through holes 11. Therefore, the electronic members and the CPU 20 mounted on the circuit board 10 are immunized from static electricity.
The insulated pad 40 is positioned between the support device 30 and the circuit board 10 for protecting the support device 30 from electrically contacting the lead pins (not shown) of the circuit board 10. The insulated pad 40 defines a number of orifices 41 running through itself for the corresponding protrusions 32 passing through to fit into the corresponding through holes 11 of the circuit board 10.
The cooling device 50 is attached on the circuit board 10 and contacts the CPU 20 for dispersing the heat produced by the CPU 20 and protecting the CPU 20 from over heating. The cooling device 50 defines a number of step holes 51 thereon for engaging with the corresponding fastening members 70 to fix the cooling device 50 on the support device 30.
Each of the elastic members 60 is a spring and received in the corresponding step hole 51 of the cooling device 50.
Further referring to
In the present invention, the support device 30 is employed to support the cooling device 50 thereby releasing the circuit board 10 from being directly weighed down by the cooling device 50. Therefore, the circuit board 10 has a longer service life.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.
Number | Date | Country | Kind |
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200810302441.1 | Jun 2008 | CN | national |