by mechanical means

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H01L2224/85947

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85947by mechanical means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for tool mark free stitch bonding
- Patent number 12,142,595
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device
- Patent number 10,224,470
- Issue date Mar 5, 2019
- Nichia Corporation
- Akinori Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heavy-wire bond arrangement and method for producing same
- Patent number 9,992,861
- Issue date Jun 5, 2018
- Technische Universitat Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device, and wire-bonding apparatus
- Patent number 9,922,952
- Issue date Mar 20, 2018
- Shinkawa Ltd.
- Yoshihito Hagiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming three-dimensional wire loops and wire loops forme...
- Patent number 9,881,891
- Issue date Jan 30, 2018
- ASM Technology Singapore Pte. Ltd.
- Jeffrey Grijaldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a lead with selectively modified electrica...
- Patent number 9,673,137
- Issue date Jun 6, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 9,461,216
- Issue date Oct 4, 2016
- Nichia Corporation
- Akinori Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire tail connector for a semiconductor device
- Patent number 9,362,244
- Issue date Jun 7, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package signal routing using conductive vias
- Patent number 8,927,417
- Issue date Jan 6, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,609,527
- Issue date Dec 17, 2013
- Oki Semiconductor Co., Ltd.
- Isao Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tack adhesion testing device
- Patent number 8,322,207
- Issue date Dec 4, 2012
- Silverbrook Research Pty Ltd
- Nadine Lee-Yen Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module, power semiconductor module assembly and...
- Patent number 8,319,335
- Issue date Nov 27, 2012
- Infineon Technologies AG
- Reinhold Bayerer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wire bond encapsulant control method
- Patent number 8,293,589
- Issue date Oct 23, 2012
- Zamtec Limited
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive systems and devices including wires coupled to anisotrop...
- Patent number 8,097,947
- Issue date Jan 17, 2012
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prefabricated lead frame and bonding method using the same
- Patent number 8,084,847
- Issue date Dec 27, 2011
- Samsung Electronics Co., Ltd.
- Lei Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic component with wire bonds in low modulus fill encapsulant
- Patent number 8,063,318
- Issue date Nov 22, 2011
- Silverbrook Research Pty Ltd
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for processing and bonding a wire
- Patent number 8,053,906
- Issue date Nov 8, 2011
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire loop and method of forming the wire loop
- Patent number 8,048,720
- Issue date Nov 1, 2011
- Kulicke and Soffa Industries, Inc.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of electronic components
- Patent number 8,039,974
- Issue date Oct 18, 2011
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wire bond encapsulation profiling
- Patent number 8,025,204
- Issue date Sep 27, 2011
- Silverbrook Research Pty Ltd
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming assymetrical encapsulant bead
- Patent number 8,017,450
- Issue date Sep 13, 2011
- Silverbrook Research Pty Ltd
- Nadine Lee-Yen Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of reducing wire bond profile height in integrated circuits...
- Patent number 7,988,033
- Issue date Aug 2, 2011
- Silverbrook Research Pty Ltd
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebonder forming low profile wire bonds between integrated circui...
- Patent number 7,946,465
- Issue date May 24, 2011
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of controlling satellite drops from an encapsulant jetter
- Patent number 7,915,091
- Issue date Mar 29, 2011
- Silverbrook Research Pty Ltd
- Nadine Lee-Yen Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of adhering wire bond loops to reduce loop height
- Patent number 7,875,504
- Issue date Jan 25, 2011
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit support for low profile wire bond
- Patent number 7,824,013
- Issue date Nov 2, 2010
- Silverbrook Research Pty Ltd
- Laval Chung-Long-Shan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of encapsulating wire bonds
- Patent number 7,803,659
- Issue date Sep 28, 2010
- Silverbrook Research Pty Ltd
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wire bonding an integrated circuit die and a printed circ...
- Patent number 7,802,715
- Issue date Sep 28, 2010
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bond method for angularly disposed conductive pads and a devic...
- Patent number 7,772,045
- Issue date Aug 10, 2010
- Randy Wayne Bindrup
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...
- Publication number 20240421055
- Publication date Dec 19, 2024
- STMicroelectronics International N.V.
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY FOR STITCH BOND
- Publication number 20240250060
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...
- Publication number 20230163097
- Publication date May 25, 2023
- SHINKAWA LTD.
- Hiroaki YOSHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
- Publication number 20220199571
- Publication date Jun 23, 2022
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUPD WIRE BOND CAPILLARY DESIGN
- Publication number 20210111146
- Publication date Apr 15, 2021
- Skyworks Solutions, Inc.
- Miguel Camargo Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND WIRE-BONDING APPARATUS
- Publication number 20160365330
- Publication date Dec 15, 2016
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARD AND METHOD FOR PRODUCING A CHIP CARD
- Publication number 20140354490
- Publication date Dec 4, 2014
- Manfred Michalk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20140319567
- Publication date Oct 30, 2014
- Nichia Corporation.
- Akinori YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SIGNAL ROUTING USING CONDUCTIVE VIAS
- Publication number 20140167262
- Publication date Jun 19, 2014
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
- Publication number 20140070235
- Publication date Mar 13, 2014
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME
- Publication number 20130220673
- Publication date Aug 29, 2013
- Technische Universitaet Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip Mounting Structure and Flip-chip Mounting Method
- Publication number 20120273942
- Publication date Nov 1, 2012
- Japan Aviation Electronics Industry ,Limited
- Daisuke Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS
- Publication number 20120048185
- Publication date Mar 1, 2012
- SILVERBROOK RESEARCH PTY LTD
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS
- Publication number 20120018905
- Publication date Jan 26, 2012
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20110151622
- Publication date Jun 23, 2011
- Panasonic Corporation
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS
- Publication number 20110068469
- Publication date Mar 24, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20110070729
- Publication date Mar 24, 2011
- Oki Semiconductor Co., Ltd.
- Isao Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module, Power Semiconductor Module Assembly and...
- Publication number 20100252922
- Publication date Oct 7, 2010
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF ELECTRONIC COMPONENTS
- Publication number 20100244282
- Publication date Sep 30, 2010
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP
- Publication number 20100230809
- Publication date Sep 16, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WIRE BONDING AN INTEGRATED CIRCUIT DIE AND A PRINTED CIRC...
- Publication number 20100133323
- Publication date Jun 3, 2010
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BOND ENCAPSULANT CONTROL METHOD
- Publication number 20100124803
- Publication date May 20, 2010
- SILVERBROOK RESEARCH PTY LTD
- Laval Chung-Long-Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTROLLING SATELLITE DROPS FROM AN ENCAPSULANT JETTER
- Publication number 20100075025
- Publication date Mar 25, 2010
- SILVERBROOK RESEARCH PTY LTD
- Nadine Lee-Yen Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING VOIDS IN ENCAPSULANT
- Publication number 20100075465
- Publication date Mar 25, 2010
- SILVERBROOK RESEARCH PTY LTD
- Nadine Lee-Yen Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING ASSYMETRICAL ENCAPSULANT BEAD
- Publication number 20100075466
- Publication date Mar 25, 2010
- SILVERBROOK RESEARCH PTY LTD
- Nadine Lee-Yen Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF REDUCING VOIDS IN ENCAPSULANT
- Publication number 20100075464
- Publication date Mar 25, 2010
- SILVERBROOK RESEARCH PTY LTD
- Nadine Lee-Yen Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING ASSYMETRICAL ENCAPSULANT BEAD
- Publication number 20100075446
- Publication date Mar 25, 2010
- SILVERBROOK RESEARCH PTY LTD
- Nadine Lee-Yen Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TACK ADHESION TESTING DEVICE
- Publication number 20100072473
- Publication date Mar 25, 2010
- SILVERBROOK RESEARCH PTY LTD
- Nadine Lee-Yen Chew
- H01 - BASIC ELECTRIC ELEMENTS

by mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and methods for tool mark free stitch bonding

Wire bonding device, wire cutting method and non-transitory compute...

Light emitting device

Heavy-wire bond arrangement and method for producing same

Method for producing semiconductor device, and wire-bonding apparatus

Method of forming three-dimensional wire loops and wire loops forme...

Electronic device having a lead with selectively modified electrica...

Light emitting device

Wire tail connector for a semiconductor device

Semiconductor package signal routing using conductive vias

Method of manufacturing semiconductor device

Tack adhesion testing device

Power semiconductor module, power semiconductor module assembly and...

Wire bond encapsulant control method

Conductive systems and devices including wires coupled to anisotrop...

Prefabricated lead frame and bonding method using the same

Electronic component with wire bonds in low modulus fill encapsulant

Semiconductor package and method for processing and bonding a wire

Wire loop and method of forming the wire loop

Assembly of electronic components

Method of wire bond encapsulation profiling

Method of forming assymetrical encapsulant bead

Method of reducing wire bond profile height in integrated circuits...

Wirebonder forming low profile wire bonds between integrated circui...

Method of controlling satellite drops from an encapsulant jetter

Method of adhering wire bond loops to reduce loop height

Integrated circuit support for low profile wire bond

Method of encapsulating wire bonds

Method of wire bonding an integrated circuit die and a printed circ...

Wire bond method for angularly disposed conductive pads and a devic...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...

CAPILLARY FOR STITCH BOND

DOCUMENT STRUCTURE FORMATION

WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING

CUPD WIRE BOND CAPILLARY DESIGN

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND WIRE-BONDING APPARATUS

CHIP CARD AND METHOD FOR PRODUCING A CHIP CARD

LIGHT EMITTING DEVICE

SEMICONDUCTOR PACKAGE SIGNAL ROUTING USING CONDUCTIVE VIAS

WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS

HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME

Flip-chip Mounting Structure and Flip-chip Mounting Method

APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS

ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS

Method of manufacturing semiconductor device

SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS

Method of manufacturing semiconductor device

Power Semiconductor Module, Power Semiconductor Module Assembly and...

ASSEMBLY OF ELECTRONIC COMPONENTS

WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP

METHOD OF WIRE BONDING AN INTEGRATED CIRCUIT DIE AND A PRINTED CIRC...

WIRE BOND ENCAPSULANT CONTROL METHOD

METHOD OF CONTROLLING SATELLITE DROPS FROM AN ENCAPSULANT JETTER

METHOD OF REDUCING VOIDS IN ENCAPSULANT

METHOD OF FORMING ASSYMETRICAL ENCAPSULANT BEAD

METHOD OF REDUCING VOIDS IN ENCAPSULANT

METHOD OF FORMING ASSYMETRICAL ENCAPSULANT BEAD

TACK ADHESION TESTING DEVICE