Zinc oxide crystal growth substrate

Abstract

A zinc oxide crystal growth substrate is disclosed. The zinc oxide crystal growth substrate includes a thin layer of single crystal zinc oxide deposited on an self supporting substrate surface by a chemical deposition process. The chemical deposition process is selected from RF sputtering, CVD (chemical vapor deposition), MOCVD (metal organic chemical vapor deposition), spin coating, electrophoresis, and hydrothermal growth processes. The self supporting substrate may be amorphous, polycrystalline, or crystalline. The thin layer of zinc oxide has a crystal lattice which permits the crystal growth of a crystal compatible with zinc oxide. The compatible crystal has a lattice parameter within about 5% of a corresponding lattice parameter of the zinc oxide.

Description

BACKGROUND OF THE INVENTION

[0002] The present invention provides zinc oxide crystal growth substrates.

[0003] Zinc oxide (ZnO) is a wide band gap semiconductor with potential for use in electrically excited devices such as light emitting devices (LEDs), laser diodes (LDs), field effect transistors (FETs), photodetectors operating in the ultraviolet and at blue wavelengths of the visible spectrum, and other similar devices. Currently gallium nitride (GaN), heteroepitaxially deposited on a single crystal substrate such as sapphire or silicon carbide, is used in radiation detecting and light emitting devices for these purposes.

[0004] Some characteristic parameters of GaN and the substrates used for its growth are shown in Table 1.

TABLE 1
			Thermal
		Lattice	Expansion
	Lattice	Parameters	Coefficient
Crystal	Type	[nm]	[106/K]
GaN	hexagonal (wurtzite)	a = 0.3189	5.59
		c = 0.5185	3.17
Alpha-Al2O3	hexagonal (wurtzite)	a = 0.4758	7.5
		c = 1.2991	8.5
6H—SiC	hexagonal (sphalerite)	a = 0.3081	4.2
		c = 1.511	4.68
NdGaO3	Orthorhombic	a = 0.5422	11.9
		b = 0.5499	6.6
		c = 0.7708	5.8
YSZ	Cubic (fluorite)	a = 0.515	11.4
Si	Cubic silicon	a = 0.3431	2.44
ZnO	hexagonal (wurtzite)	a = 0.3252	2.9
		c = 0.5213	4.75

[0005] Due to differences in crystal lattice parameters and coefficient of thermal expansion, a high density of crystal lattice dislocations is often introduced into the GaN crystal. This introduces a large lattice strain, which may create a nucleation site that may propagate lattice defects into the growing layer, and ultimately degrade the optical properties of the GaN and result in inferior device performance. A buffer layer may be placed between the GaN and the substrate, but it does not eliminate the defect migration into the active layer during crystal growth. Moreover, the buffer layer is generally deposited on a conventional self supporting crystal growth substrate such as sapphire (Al2O3) or SiC. The sapphire and silicon carbide substrates are relatively expensive. It would be an advancement in the art to provide a low cost alternative substrate for GaN crystal growth, or other active crystals.

[0006] From Table 1, ZnO is a good substrate for the crystal growth of GaN. Zinc oxide has been grown as a single crystal boule, sliced into thin wafer self supporting substrate, and used as a crystal growth substrate. This is a complicated and expensive process. It would be an advancement in the art to provide an efficient and economical method of preparing a ZnO crystal growth substrate.

BRIEF SUMMARY OF THE INVENTION

[0007] The present invention is drawn to a single crystal zinc oxide crystal growth substrate. A thin layer of single crystal zinc oxide is deposited on a self supporting substrate surface. The zinc oxide has a crystal lattice which permits the crystal growth of a crystal compatible with zinc oxide.

[0008] The self supporting substrate includes crystalline, polycrystalline, and amorphous substrates. Conventional crystal growth substrates, such as sapphire and silicon carbide may be used. But the present invention may advantageously be used with lower cost substrates including, but not limited to, amorphous fused silica (SiO2), polycrystalline alumina, and crystalline silicon wafer.

[0009] Crystals compatible with zinc oxide will typically have a lattice parameter within about 5% of a corresponding lattice parameter of the zinc oxide. Examples of possible compatible crystals include, but are not limited to, AlN, SiC, and GaN, as well as n-type and p-type zinc oxide. The thin layer of zinc oxide may optionally be doped with n-type or p-type dopants.

[0010] The thin layer of single crystal zinc oxide is deposited on the self supporting substrate surface by a chemical deposition process, which may include, but is not limited to, RF sputtering, CVD (chemical vapor deposition), MOCVD (metal organic chemical vapor deposition), spin coating, electrophoresis, and hydrothermal growth processes. The thickness of the zinc oxide layer may vary depending on the desired application. In many applications, the thickness will be less than about 5 μm. However, in some applications the thickness may be greater than about 5 μm. Deposition processes may be repeated as needed to build up a desired thickness.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0011] A more particular description of the invention briefly described above will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. These drawings depict only typical embodiments of the invention and are not therefore to be considered to be limiting of its scope. The invention will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:

[0012] FIG. 1 is a schematic representation of a sputtering system used in the fabrication of certain zinc oxide crystal growth substrates.

[0013] FIG. 2 is graph of the X-ray diffraction pattern generated by sputtered arsenic doped polycrystalline zinc oxide.

[0014] FIG. 3 is a graph of the X-ray diffraction pattern generated by a zinc oxide thin film within the scope of the present invention showing single crystal (002) plane.

[0015] FIG. 4 is a schematic diagram of a zinc semiconductor heterostructure device containing an active region.

[0016] FIG. 5 is a schematic diagram of a zinc oxide semiconductor device of FIG. 3 without an active region.

[0017] FIG. 6A is a schematic diagram of a conventional GaN solid state device fabricated on a sapphire or SiC substrate.

[0018] FIG. 6B is a schematic diagram of a ZnO solid state device fabricated on an alternative self-supporting substrate within the scope of the present invention.

[0019] FIGS. 7A-7B are schematic representations of zinc oxide semiconductor devices fabricated with multiple quantum wells.

[0020] FIGS. 8A-8B are schematic representations of zinc oxide semiconductor devices fabricated with a single quantum well.

DETAILED DESCRIPTION OF THE INVENTION

[0021] The present invention is drawn to a zinc oxide crystal growth substrate. The zinc oxide crystal growth substrate includes a thin layer of single crystal zinc oxide deposited on an self supporting substrate surface by a chemical deposition process. The self supporting substrate may be amorphous, polycrystalline, or crystalline. As used herein, single crystal zinc oxide includes zinc oxide with a single predominant reflection on an X-ray diffraction pattern. Polycrystalline zinc oxide will possess multiple reflection peaks on an X-ray diffraction pattern. Persons skilled in the art will appreciate that a perfect single crystal, defect free, does not exist. There will always be some minor crystal defects present. As used herein, a single predominant reflection peak will possess at least 95% of the integrated area of the X-ray diffraction pattern, and more preferably greater than 99%.

[0022] From X-ray diffraction data, the single crystal zinc oxide may be oriented in the (002) plane. The zinc oxide may be oriented in other crystal planes depending on the crystal orientation of the self supporting substrate. For example, if (111) silicon or (111) sapphire is used as the self-supporting substrate, then (111) ZnO may be prepared.

[0023] The thin layer of zinc oxide has a crystal lattice which permits the crystal growth of a crystal compatible with zinc oxide. The compatible crystal preferably has a lattice parameter within about 5% of a corresponding lattice parameter of the zinc oxide. However, several compatible crystals are shown in Table 1, some of which have lattice parameter mismatches that exceed 5%. By closely matching the lattice parameters of the substrate and the crystal grown thereon, the resulting crystal may have fewer lattice defects transferred from the growth substrate into the grown crystal.

[0024] The self supporting substrate may be a low-cost substrate, including but not limited to, amorphous fused silica (SiO2), polycrystalline alumina, or crystalline silicon wafer. The amorphous substrate may also include an amorphous SiO2 coating on silicon wafer which may be a native oxide layer or a grown oxide layer. The self supporting substrate may include commonly used crystalline substrate materials, including but not limited to, silicon carbide and sapphire.

[0025] It is unexpected that fused silica may be used successfully as a self supporting substrate for single crystal zinc oxide. Amorphous fused silica possesses bond angles that can change readily and sustain strain. In contrast, some common crystalline substrate materials cannot support the strain created by different crystals grown thereon.

[0026] The compatible crystal may include, but is not limited to GaN, AlN, SiC, and ZnO. GaN, AlN, SiC, and ZnO may be useful for the fabrication semiconductor electronic devices, discussed above. AlN and SiC may also be useful used as a thermal management substrate because of their high thermal conductivity. In addition, because AlN and pure, grown SiC have high resistivity, AlN and SiC may replace BeO (beryllia) in microelectronics thermal management applications. For thermal management applications, the zinc oxide substrate does not need to be n-type or p-type doped. It is important that the substrate be a single crystal with a lattice that closely matches the crystal grown thereon.

[0027] Single crystal zinc oxide exhibits intrinsic n-type conduction due to the presence of excess donors. However, the electrical properties of the zinc oxide may be modified during deposition by incorporating either a p-type dopant or an n-type dopant. Zinc oxide based semiconductor devices containing a p-n junction may be readily fabricated utilizing a zinc oxide substrate within the scope of the present invention. The n-type zinc oxide may contain an n-type dopant selected from known dopant materials. Typical n-type dopants include, but are not limited to, ions of Al, Ga, B, H, Yb and other rare earth elements, Y, Sc, and mixtures thereof. The p-type zinc oxide may contain a p-type dopant selected from known p-type dopant materials. Typical p-type dopants include, but are not limited to, nitrogen, phosphorus, arsenic, antimony, bismuth, copper, chalcogenides of the foregoing, and mixtures thereof.

[0028] The chemical deposition process is preferably a commercially viable process including, but not limited to RF sputtering, CVD (chemical vapor deposition), MOCVD (metal organic chemical vapor deposition), spin coating, electrophoresis, and hydrothermal growth processes. Such processes may be used to deposit a thin layer of zinc oxide having a thickness less than about 5 μm. Thicker layers may be built up by repeating the deposition process.

[0029] In one embodiment within the scope of the invention, the chemical deposition process included RF sputtering using an RF sputtering system having a zinc metal target, a substrate surface, and a plasma comprising oxygen and an inert sputtering gas. The RF sputtering system operated at conditions which produced the thin layer of single crystal zinc oxide on the substrate surface.

[0030] In the RF magnetron sputtering process, a substrate is placed in a low-pressure chamber. The magnetron sputtering head is driven by an RF power source which generates a plasma and ionization of the gas or gases (e.g., argon and selected dopants). For RF sputtering, a high-frequency generator is used generating electromagnetic power in the MHz-Region (typically about 13.56 MHz). Argon ions bombard the target releasing ions from the target which are liberated and accelerated towards the substrate. Additional atoms in the plasma may also be deposited onto the substrate.

[0031] The system may operate at a power in the range from about 20 to about 120 watts. Persons skilled in the art will appreciate that the power may be varied to control deposition time and film thickness, as well as the quality of the resulting film.

[0032] Good results have been obtained when the inert sputtering gas is present in the sputtering atmosphere at a pressure in the range from about 4 to 20 mtorr. The inert sputtering gas is preferably selected from argon, krypton, xenon, neon, and helium. Argon is a presently preferred inert sputtering gas. Small amounts of oxygen may be included in the sputtering gas, usually at a pressure in the range from about 1 to 4 mtorr. In some embodiments, beneficial results have been obtained when the thin film is annealed at a temperature in the range from about 300 to about 430° C. for a time period in the range from about 1 to about 15 minutes.

[0033] A combination of sputtering and thermal evaporation may also be used to deposit the zinc oxide more quickly.

[0034] Spin coating is another useful process for depositing the thin film of zinc oxide. An organic molecule containing zinc, such as zinc 2-4 pentanedionate is used as the zinc source. A solution of this compound dissolved in a suitable solvent, such as butanol, is spun onto the substrate, such as fused silica. After a layer is spun on the substrate, it is heated to about 600° C. for about 10 minutes for pyrolysis of the organics. This procedure is repeated 5 or 6 times to get the desired film thickness. The substrate is annealed at about 700° C. for 1 to 5 hours in a nitrogen atmosphere. The required oxygen can come from the atmosphere or can come from being part of the organic precursors.

[0035] A single crystal zinc oxide crystal growth substrate may be prepared by metal organic chemical vapor deposition (MOCVD). MOCVD is a modified chemical vapor deposition process that works similar to the spin coating processes described above. The organic compounds may or may not be dissolved in a solvent. The difference being that the organic compounds are sprayed onto a spinning substrate, and the solvent is allowed to evaporate during deposition. The process occurs in a partial vacuum. The substrate often spins at a rate of about 50-100 rpm, and as high as 600 rpm. The organic compounds are forced through heated nozzles. The nozzles heat the liquid to the vapor point, and the vaporized compounds mix in a mixing chamber. Other compounds may be optionally added in the mixing chamber, such as nitrogen, ammonia, or dopants. The substrate surface is heated to a temperature of about 500 to 700° C. to cause pyrolysis. The organic compounds must be pyrolyzed in order to leave behind the desired metal oxide composition. In many MOCVD processes the organic constituents are engineered to be chemically bound into the same organic compound and sometimes each constituent is sprayed onto the substrate through separate nozzles.

EXAMPLES

[0036] The following examples are given to illustrate various embodiments within the scope of the present invention. These are given by way of example only, and it is to be understood that the following examples are not comprehensive or exhaustive of the many embodiments within the scope of the present invention.

[0037] While the following Examples relate to the deposition of p-type or n-type doped single crystal zinc oxide, it will be appreciated that the Examples can be modified to provide deposition of undoped single crystal zinc oxide.

[0038] Many of the following Examples involve sputtering. FIG. 1 illustrates a schematic representation of a sputtering system 10 used in some of the following examples. In RF sputtering, a substrate 12 is placed in a low-pressure chamber 14. The magnetron sputtering head 16 is driven by an RF power source (not shown) which generates a plasma and ionization of the sputtering gas or gases between the electrodes. The sputtering gas typically includes an inert sputtering gas, which may include, but is not limited to, argon, krypton, xenon, neon, and helium. The sputtering gas may optionally include one or more selected dopants. A plurality of gas sources 18, 20, 22, and 24 may provide N2, H2, Ar, O2, or other desired gases. For RF sputtering, a high-frequency generator is used generating electromagnetic power in the MHz-Region. Argon ions bombard the target 26, releasing ions from the target which are accelerated towards the substrate. Additional atoms in the plasma may also be deposited onto the substrate, such as dopant atoms.

[0039] In the sputtering system of FIG. 1, the substrate 12 is secured in place by a heated substrate fixture 28. The temperature of the heated substrate fixture 28 was measured and reported as the substrate temperature. The sputtering chamber 14 is constantly evacuated with a vacuum pump system 30. The sputtering atmosphere includes an inert sputtering gas mentioned above, and may optionally include other gases which are provided by the respective gas source 18, 20, 22, and 24. The gas pressures reported below, such as 10 mtorr, represent the gas pressure of the respective gas as it is introduced into the sputtering chamber 14. In some embodiments, volatile materials 32, such as arsenic for example, are evaporated in a heated basket, illustrated as the heated evaporator 34. The system includes online pressure measurement 36. It also includes thickness measurement capability 38. The system optionally includes an online mass spectrometer 40 which may measure the gas content and accurately determine the partial pressure of the sputtering atmosphere.

[0040] Unless specifically noted, the following are common conditions for the sputtering described in the Examples:

[0041] 1. The distance between the sputtering target and the deposition substrate was about 1.5 inches.

[0042] 2. Radio Frequency was 13.56 MHz. It will be appreciated by those skilled in the art that much lower and much higher frequencies may be used in RF sputtering systems. However, for practical considerations and FCC regulations, the radio frequency used was 13.56 MHz.

[0043] 3. The atmosphere was maintained by using a continuous vacuum, and pressures were controlled by addition of indicated gases. Some residual atmospheric oxygen or moisture adsorbs on the metal surfaces within the sputtering chamber. Therefore, oxygen out gases during the sputtering process at the operating temperature and pressure.

[0044] 4. The sputtering time was typically about 10 minutes, but some samples were sputtered for longer time periods, such as an hour, and some samples were sputtered for shorter periods, such as one minute. The sputtering time was selected to produce a film thickness of about one micron. It will be appreciated that several factors affect the film thickness, including, but not limited to, sputtering time, power, temperature, concentration of dopants, and evaporation of constituents of the sputtered thin film.

[0045] 5. One inch RF magnetron sputtering head was used with water cooling.

[0046] 6. All samples were tested for semiconductor type by Seebeck and Hall measurement.

[0047] 7. All chemicals were high purity from Alfa Aesar.

[0048] 8. In most cases, the operating condition ranges and experimental result ranges are drawn from multiple experiments. Thus, the reported examples and results may represent a composite of several actual experiments.

Example 1

Sputtering of ZnO

[0049] A thin film of undoped zinc oxide was deposited onto a self supporting substrate by RF sputtering. Both fused silica and silicon wafers were used as the self supporting substrate. The sputtering target composition was ZnO. The substrate temperature was between 350 and 550° C. The preferred temperature was about 400° C. The RF power was between 20 and 120 watts. The preferred power was about 60 watts. The sputtering atmosphere included argon at a gas pressure of about 4 to 20 mtorr and O2 at a gas pressure of about 1 to 4 mtorr. The preferred sputtering atmosphere pressures were about 9 mtorr argon and about 1 mtorr O2.

Example 2

Sputtering of ZnO with Arsenic as a Dopant

[0050] A thin film of p-type zinc oxide was deposited onto a self supporting substrate by RF sputtering. Both fused silica and silicon wafers were used as the self supporting substrate. The sputtering target composition was ZnO (0.99-0.95 moles)+As (0.01-0.05 moles). The preferred target composition was ZnO (0.98 moles)+As (0.02 moles). The substrate temperature was between 350 and 550° C. The preferred temperature was about 400° C. The RF power was between 20 and 120 watts. The preferred power was about 60 watts. The sputtering atmosphere included argon at a gas pressure of about 4 to 20 mtorr and O2 at a gas pressure of about 1 to 4 mtorr. The preferred sputtering atmosphere pressures were about 9 mtorr argon and about 1 mtorr O2.

[0051] The resulting transparent p-type zinc oxide layer had a resistance of about 10,000 ohms/square. After annealing at 440° C. in air, the resistance dropped to about 1,000 ohms/square. In another composition prepared in accordance with the procedure of this Example, the transparent p-type zinc oxide layer had a resistance ranging from 200,000 ohms/square to 10,000,000 ohms/square. This composition was not subsequently annealed.

Example 3

Sputtering of ZnO with Arsenic as a Dopant

[0052] A thin film of p-type zinc oxide was deposited onto a self supporting substrate by RF sputtering. Both fused silica and silicon wafers were used as the self supporting substrate. The sputtering target composition was ZnO (0.99-0.95 moles)+As (0.01-0.05 moles). The preferred target composition was ZnO (0.98 moles)+As (0.02 moles). The substrate temperature was between 350 and 550° C. The preferred temperature was about 400° C. The RF power was between 20 and 120 watts. The preferred power was about 60 watts. The sputtering atmosphere included argon at a gas pressure of about 4 to 20 mtorr and H2 at a gas pressure of about 1 to 4 mtorr. The preferred sputtering atmosphere pressures were about 9 mtorr argon and about 1 mtorr H2.

[0053] The resulting transparent p-type zinc oxide layer had a resistance of about 500 ohms/square. Without being bound by theory, it is believed that the hydrogen gas may moderate the concentration of oxygen in the sputtering atmosphere.

Example 4

Sputtering of ZnO with Arsenic as a Dopant

[0054] A thin film of p-type zinc oxide was deposited onto a self supporting substrate by RF sputtering. Both fused silica and silicon wafers were used as the self supporting substrate. A First Composition Layer comprising zinc and arsenic was deposited onto the self supporting substrate.

[0055] In one example, the First Composition Layer was deposited by thermal evaporation of zinc arsenide (Zn3As2 or ZnAs2) for a period of about 2-60 seconds, with a preferred period of about 14 seconds. The substrate temperature was about 360° C. Subsequent analysis of the First Composition Layer indicated that it contained zinc and arsenic in approximately equal atomic amounts. This suggests that the stoichiometry of the zinc arsenide had changed during thermal evaporation.

[0056] Thermal evaporation is a well known technique for depositing thin films, particularly metal and metal alloys. The following sequential basic steps take place: (i) a vapor is generated by boiling or subliming a source material, (ii) the vapor is transported from the source to the substrate, and (iii) the vapor is condensed to a solid film on the substrate surface. In the evaporative deposition process, a substrate is placed in a low-pressure chamber. A tungsten crucible is disposed below the substrate. The desired source material or mixture of source materials is placed in the crucible and heated to a temperature sufficiently high to evaporate the source material. The source material vapor condenses on the substrate, which may or may not be heated. Heating the substrate may enhance the bond between the deposited source material film and the substrate. The evaporative deposition process may be completed in less than a minute, and usually a few seconds.

[0057] In another example, the First Composition Layer was deposited by RF sputtering. In yet another example, the First Composition Layer was deposited by the combination of thermal evaporation and RF sputtering. It will be appreciated that the First Composition Layer may be deposited using other known, conventional, or novel deposition techniques, including, but not limited to, RF sputtering and evaporative deposition techniques described above, as well as chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), other evaporation and sputtering techniques, and combinations of these and other thin film deposition technologies.

[0058] Preparing a thin film by evaporation alone is a very quick process that is completed in a matter of seconds, but it is difficult to properly control the resulting thin film. In contrast, sputtering alone is a slow process that requires many minutes to complete. The combination of sputtering and thermal evaporation includes heat to facilitate evaporation of the source material and a RF field to induce sputtering. Alternatively, the RF field can be used to heat the source material disposed close to the RF magnetron head sufficiently to evaporate the source material for deposition by thermal evaporation. In this case, a small amount of sputtering will also occur. The resulting thin film is of good quality and quickly prepared. In this case, the combination of sputtering and evaporation was used to deposit Zn3As2 onto a fused silica substrate at 350° C. for about 50 seconds.

[0059] A Second Composition Layer comprising zinc oxide was deposited onto the First Composition Layer by RF sputtering. The sputtering target composition was ZnO. The substrate temperature was between 400 and 550° C. The preferred temperature was about 450° C. The RF power was between 20 and 120 watts. The preferred power was about 100 watts. The sputtering time was between 10 and 40 minutes, and preferably about 20 minutes. The sputtering atmosphere included argon at a gas pressure of about 4 to 20 mtorr. The preferred sputtering atmosphere pressure was about 10 mtorr argon.

[0060] A region of the arsenic doped p-type zinc oxide that was sputtered directly onto a fused silica substrate was analyzed by X-ray diffraction. A graph of the X-ray diffraction pattern is shown in FIG. 3 illustrating a single dominant peak representing the (002) plane. This indicates that single crystal p-type zinc oxide was deposited directly onto the amorphous fused silica substrate. By way of comparison, an X-ray diffraction pattern of polycrystalline zinc oxide is shown in FIG. 2.

Example 5

Sputtering of ZnO with Arsenic as a Dopant

[0061] A thin film of p-type zinc oxide was deposited onto a self supporting substrate by RF sputtering. Both fused silica and silicon wafers were used as the self supporting substrate. The sputtering target composition was Zn (0.99-0.95 moles)+As2O3 (0.01-0.05 moles). The preferred target composition was about Zn (0.99 moles)+As2O3 (0.01 moles). The substrate temperature was between 350 and 550° C. The preferred temperature was about 400° C. The RF power was between 15 and 40 watts. The preferred power was about 30 Watts. A lower power was used in this example to keep the powdered zinc metal in the target from being quickly vaporized and dispersed during the sputtering processing. The sputtering atmosphere included argon at a gas pressure of about 4 to 20 mtorr and O2 at a gas pressure of about 1 to 4 mtorr. The preferred sputtering atmosphere pressures were about 10 mtorr argon and about 1 mtorr O2.

[0062] The resulting transparent p-type zinc oxide layer had a resistance of about 100,000 ohms/square.

Example 6

Sputtering of ZnO with Arsenic as a Dopant

[0063] A thin film of p-type zinc oxide was deposited onto a self supporting substrate by RF sputtering. Both fused silica and silicon wafers were used as the self supporting substrate. The sputtering target composition was ZnO (0.99-0.95 moles)+As2O3 (0.01-0.05 moles). The preferred target composition was ZnO (0.99 moles)+As2O3 (0.01 moles). The substrate temperature was between 350 and 550° C. The preferred temperature was about 400° C. The RF power was between 20 and 120 watts. The preferred power was about 60 watts. The sputtering atmosphere included argon at a gas pressure of about 4 to 20 mtorr. The preferred sputtering atmosphere pressure was about 10 mtorr argon.

[0064] The resulting transparent p-type zinc oxide layer had a resistance of about 100,000 ohms/square.

Example 7

Sputtering of ZnO with Antimony as a Dopant

[0065] A thin film of p-type zinc oxide was deposited onto a self supporting substrate by RF sputtering. Both fused silica and silicon wafers were used as the self supporting substrate. The sputtering target composition was Zn (0.99-0.95 moles)+Sb (0.01-0.05 moles). The preferred target composition was Zn (0.99 moles)+Sb (0.01 moles). The substrate temperature was between 350 and 550° C. The preferred temperature was about 400° C. The RF power was between 20 and 120 watts. The preferred power was about 60 watts. The sputtering atmosphere included argon at a gas pressure of about 4 to 20 mtorr. The preferred sputtering atmosphere pressure was about 10 mtorr argon.

[0066] The resulting transparent p-type zinc oxide layer had a resistance of about 600,000 ohms/square. Without being bound by theory, it is believed that the oxygen needed to form the zinc oxide crystal lattice was obtained from residual oxygen in the sputtering system atmosphere.

[0067] The target composition is not limited to metallic zinc and antimony. The target may comprise zinc oxide and antimony metal, zinc metal and antimony oxide, and zinc oxide and antimony oxide. The sputtering atmosphere may include hydrogen gas at a gas pressure of about 0.1 to 4 mtorr in addition to the inert sputtering gas. Antimony-doped zinc oxide may also be prepared in a manner similar to Example 4 in which a First Composition Layer containing zinc and antimony is deposited. Antimony-doped zinc oxide has been prepared in a manner similar to Example 4 in which the First Composition Layer contains just antimony.

Example 8

Sputtering of ZnO with Copper as a Dopant

[0068] A thin film of p-type zinc oxide was deposited onto a self supporting substrate by RF sputtering. Both fused silica and silicon wafers were used as the self supporting substrate. A First Composition Layer comprising copper was deposited onto the self supporting substrate by RF sputtering for a period of from 5 to 40 minutes, with a preferred period of about 10 minutes at room temperature.

[0069] A Second Composition Layer comprising zinc oxide was deposited onto the First Composition Layer by RF sputtering. The sputtering target composition was ZnO. The substrate temperature was between 400 and 550° C. The preferred temperature was about 450° C. The RF power was between 20 and 120 watts. The preferred power was about 100 watts. The sputtering time was between 10 and 40 minutes, and preferably about 20 minutes. The sputtering atmosphere included argon at a gas pressure of about 4 to 20 mtorr. The preferred sputtering atmosphere pressure was about 10 mtorr argon.

[0070] At low concentration, copper may counteract the natural n-type property of ZnO resulting in a neutral or p-type semiconductor with low resistance. Without being bound by theory, it is believed that a quantity of copper may be evaporated during the sputtering step and become part of the sputtering plasma such that ZnO doped with copper was deposited onto substrate.

Example 9

Sputtering of ZnO with Arsenic as a Dopant

[0071] A thin film of p-type zinc oxide was deposited- onto a self supporting substrate by RF sputtering. Both fused silica and silicon wafers were used as the self supporting substrate. A First Composition Layer comprising zinc and arsenic was deposited onto the self supporting substrate. The First Composition Layer included Zn3As2, ZnAs2, or a mixture thereof. In one example, the zinc/arsenic layer was deposited by thermal evaporation for a period of about 2-60 seconds, with a preferred period of about 14 seconds. The temperature was about 360° C. The First Composition Layer may also be deposited by RF sputtering.

[0072] A Second Composition Layer comprising zinc oxide was deposited onto the First Composition Layer by RF sputtering. The sputtering target composition was ZnO. The substrate temperature was between 400 and 550° C. The preferred temperature was about 450° C. The RF power was between 20 and 120 watts. The preferred power was about 100 watts. The sputtering time was between 10 and 40 minutes, and preferably about 20 minutes. The sputtering atmosphere included argon at a gas pressure of about 4 to 20 mtorr and hydrogen at a gas pressure of about 0.1 to 4 mtorr. The preferred sputtering atmosphere pressure was about 10 mtorr argon and about 1 mtorr hydrogen.

[0073] The resulting p-type zinc oxide layer had a resistance of about 10 to 200 ohms/square.

Example 10

Sputtering of ZnO with Arsenic as Dopant

[0074] A thin film of p-type zinc oxide was deposited onto a self supporting substrate by RF sputtering. Fused silica was used as the self supporting substrate. The sputtering target composition was ZnO. The substrate temperature was between 350 and 550° C. The preferred temperature was about 400° C. The RF power was between 20 and 120 watts. The preferred power was about 60 watts. The sputtering atmosphere included argon at a gas pressure of about 4 to 20 mtorr. In addition, a basket containing arsenic was heated to a controlled temperature sufficient to evaporate the arsenic. The basket was positioned such that the arsenic was evaporated directly onto the fused silica at the same time the zinc oxide was sputtered onto the fused silica.

[0075] The resulting transparent p-type zinc oxide layer displayed visible diffraction rings, but was very clear and transparent. It will be appreciated that this process may be adapted for use with other p-type dopants besides arsenic.

[0076] Based upon arsenic vapor pressure data, As4 has a higher vapor pressure at a given temperature when compared to As3, As2, and As. Therefore, it is presently believed that As4 is the dominant volatile arsenic species at typical operating conditions. Without being bound by theory, it is believed As4 must be broken into individual arsenic atoms to be incorporated into the zinc oxide. An apparent threshold RF power of about 60 watts has been observed for the given experimental sputtering system used herein. It will be appreciated that this threshold RF power may vary depending upon the sputtering system used. Likewise, it will be appreciated that other means besides a RF field may be used to break the As4 molecular bonds.

[0077] A similar phenomenon has been observed with respect to antimony vapor pressures as with arsenic discussed above. Antimony generally requires a higher temperature to achieve the same vapor pressure as arsenic. Likewise, an apparent threshold RF power of about 90 watts has been observed for the given experimental sputtering system used herein.

Example 11

Evaporative Deposition of ZnO with Arsenic as a Dopant

[0078] A stable, p-type zinc oxide semiconductor material was prepared. Zinc metal, doped with 2 mole % arsenic, was deposited onto a fused silica substrate by thermal evaporation in an oxygen-rich atmosphere containing 20 mtorr argon and 10 mtorr oxygen at a temperature of about 430° C. During the deposition process, the zinc and/or arsenic was partially oxidized. The resulting As-doped ZnO thin film exhibited p-type characteristics. It had a Seebeck voltage of about positive 6 mV D.C. Increasing the oxygen pressure may result in a more complete formation of ZnO. While no further heating or annealing was performed in this example, additional heating or annealing may be desirable to control the level of zinc oxidation and/or optimize the electronic properties of the p-type semiconductor material.

Example 12

Spin Coating of Arsenic-Doped ZnO

[0079] A stable, p-type zinc oxide semiconductor material may be prepared by spin coating using arsenic as the dopant. Fused silica is used as the self supporting substrate. Zinc 2-4 pentanedionate is used as the zinc source and arsenic III ethoxide is used as the arsenic source. These compounds are dissolved in butanol which serves as a common solvent. This solution is spun onto a fused silica slide.

[0080] After a layer is spun on the substrate, it is heated to about 600° C. for about 10 minutes for pyrolysis of the organics. This procedure is repeated 5 or 6 times to get the desired film thickness. The substrate is annealed at about 700° C. for 1 to 5 hours in a nitrogen atmosphere. Control of the partial pressures of all inorganic components is desirable for the desired doped zinc oxide composition, otherwise evaporation or one or more ingredients or formation of undesired compounds may occur. The oxygen can come from the atmosphere or can come from being part of the organic precursors.

Example 13

Spin Coating of Antimony-Doped ZnO

[0081] A stable, p-type zinc oxide semiconductor material may be prepared by spin coating in accordance with the method of Example 12, except that antimony is used as the dopant instead of arsenic. Antimony chloride (SbCl3) is used as the antimony source.

Example 14

MOCVD of P-Type ZnO

[0082] A stable, p-type zinc oxide semiconductor material may be prepared by metal organic chemical vapor deposition (MOCVD) using arsenic, antimony, or other p-type dopant. The typical MOCVD process is described above.

Example 15

Fabrication of Zinc Oxide P/N Junction

[0083] A zinc oxide p/n junction was fabricated. A thin film of p-type zinc oxide was deposited onto a self supporting silicon wafer substrate by RF sputtering in accordance with Example 4. In Example 4, a thin film of zinc arsenide was first deposited onto the silicon wafer and the p-type zinc oxide was sputtered on top of the zinc arsenide. A thin film of n-type zinc oxide was sputtered on top of the p-type zinc oxide at about 300° C. The sputtering target included ZnO (99.925 mole %) and Ga2O3 (0.075 mole %) that had been mixed, sintered, and annealed at about 1100° C. The sputtering step occurred at a temperature of about 350° C. The sputtering atmosphere included argon at a gas pressure of about 4 to 20 mtorr. About 10% hydrogen gas may alternatively be included in the sputtering atmosphere to produce n-type zinc oxide. Electrodes were attached to the p/n junction. Current vs. voltage was measured to show rectification of the p/n junction. A luminescent emission at room temperature was briefly observed before the p/n junction failed. Failure occurred because the electrical resistance dropped too quickly allowing excessive current to overpower the p/n junction.

[0084] Semiconductor heterostructures may be fabricated based upon p/n junction described above. These devices may be prepared by depositing multiple layers of p-type and n-type semiconductors. Such heterostructures may be fabricated using matching or compatible semiconductor crystals. Examples of two possible semiconductor heterostructure devices are illustrated in FIGS. 4 and 5. It will be appreciated that the illustrated devices are given by way of example and not limitation. Persons skilled in the art will recognize that numerous variations of these devices are possible.

[0085] The device shown in FIG. 4 includes a self supporting substrate 50. The substrate may be a known crystalline substrate or it may be a low cost substrate including, but not limited to, silicon wafers, polycrystalline alumina, and amorphous self supporting substrate surfaces like fused silica. A layer of n-type zinc oxide 52 doped with an n-type dopant, such as gallium, is deposited on the substrate 50. The n-type zinc oxide layer 52 may be about 0.4 μm thick. The device may include additional n-type zinc oxide layers 54, 56, comprising magnesium and cadmium alloys. For example, layer 54 may have a composition of Mg.15Zn.85O doped with gallium, and it may have a thickness of about 0.15 μm. Layer 56 may have a composition of Cd.06Zn94O doped with gallium, and it may have a thickness of about 0.05 μm. The thin cadmium zinc oxide alloy layer 56 is the active region wherein light generation occurs. Deposited on top of the active region layer 56 are one or more p-type zinc layers 58, 60. Layer 58 may have a composition of Mg.15Zn.85O doped with arsenic, and it may have a thickness of about 0.15 μm. Layer 60 may be p-type zinc oxide doped with a p-type dopant, such as arsenic.

[0086] It will be appreciated by persons having ordinary skill in the art that actual composition of the n-type and p-type zinc oxide layers may vary. Similarly the concentration of magnesium and cadmium in the zinc oxide alloys may vary.

[0087] FIG. 5 illustrates a device substantially identical to the device of FIG. 4, except that there is no separate active region.

[0088] Single or multiple quantum well (MQW) heterostructures may be fabricated to render the p/n junction more efficient. A single quantum well is made of two alternating semiconductor materials. One layer is a barrier layer defined by a higher band gap than the second layer. The second layer's band gap defines the bottom of the quantum well. For example, MgO may be alloyed with ZnO to form the barrier layer, and the undoped ZnO will define the bottom of the well. This produces a more efficient device and raises the band edge. Conversely, CdO may be alloyed with ZnO to define the bottom layer of the quantum well, and the undoped ZnO defines the barrier layer. This produces a more efficient device and lowers the band edge.

[0089] An additional advantage of a quantum well is that the layers can be mechanically strained to raise or lower the band edge. Mechanical strain may exist if the two layers have slightly different crystal lattice constants. For most zinc oxide materials the band edge is around 390 nm, but some of the zinc oxide semiconductor materials fabricated in accordance with the present invention had a band edge of about 370 nm.

[0090] The number of quantum wells may vary. Good results may be obtained with just one quantum well. Typically the number of quantum wells may range from about 1 to 10, and more preferably from about 3 to 7 quantum wells. The total thickness of the quantum well alternating layers must in the vicinity of, or less than, the electron de Broglie wavelength (100 Å). These heterostructures may be fabricated through a chemical deposition process, including but not limited to those described above, such as sputtering, CVD, MOCVD, etc.

[0091] FIG. 6A is a schematic representation of a typical state of the art GaN-based semiconductor device 80 containing MQWs 82. It will be appreciated that GaN devices are complicated to manufacture because of the expensive sapphire or SiC substrate 84 and multiple layers 86, 88 required to match the crystal lattice of GaN and the substrate. In contrast, FIG. 6B is a schematic representation of a zinc oxide based semiconductor device 90 containing MQWs 92. Because single crystal zinc oxide 94 may be deposited directly on a low-cost substrate 96, such as fused silica or a silicon wafer, the zinc oxide based semiconductor device fabricated within the scope of the present invention represents a substantial improvement over conventional GaN-based semiconductor devices.

[0092] FIG. 7A is a schematic representation of one possible zinc oxide based semiconductor device 100 fabricated with MQWs. Three quantum wells are shown containing alternating layers of undoped ZnO 102 (20 Å-100 Å) and Cd.2Zn.8O 104 (10 Å-25 Å). The cadmium content may be varied. The amount of cadmium in the cadmium zinc oxide alloy 104 may vary depending on the desired shifting of the band gap. The cadmium content preferably ranges from about 1 to 20 mole %, and more typically about 10 mole %.

[0093] The semiconductor device 100 includes a layer of n-type zinc oxide 106, approximately 2 μm thick, doped with an n-type dopant, such as Ga or Al, deposited on a self supporting substrate 108. A layer of p-type zinc oxide 110, approximately 2 μm thick, doped with a p-type dopant, such as arsenic, may be deposited on top of the MQWs, layers 102, 104. A layer of p-type zinc oxide 112, approximately 5 μm thick, doped with a p-type dopant, such as arsenic, may be deposited on top of layer 110.

[0094] FIG. 7B is a schematic representation of a zinc oxide based semiconductor device 120 similar to that of FIG. 7A except that the quantum wells include a magnesium zinc oxide alloy instead of a cadmium zinc oxide alloy. The alternating layers of magnesium zinc oxide alloy 124 may have the formula Mg.1Zn.9O (10 Å-25 Å). The magnesium content may be varied. The amount of magnesium the magnesium zinc oxide alloy 124 may vary depending on the desired shifting of the band gap. The magnesium content preferably ranges from about 1 to 20 mole %, and more typically about 10 mole %.

[0095] FIG. 8A is a schematic representation of one possible zinc oxide based semiconductor device fabricated with a single quantum well having a composition substantially the same as the device shown in FIG. 7A. As mentioned above, the number of quantum wells can vary, just as the composition of the quantum well layers and the p-type and n-type semiconductor material used in the device.

[0096] FIG. 8B is a schematic representation of a zinc oxide based semiconductor device similar to that of FIG. 8A except that the quantum well includes a magnesium zinc oxide alloy instead of a cadmium zinc oxide alloy.

[0097] It will be appreciated that the present invention provides zinc oxide crystal growth substrates useful for a variety of different applications. The zinc oxide substrates are commercially viable.

[0098] The present invention may be embodied in other specific forms without departing from its structures, methods, or other essential characteristics as broadly described herein and claimed hereinafter. The described embodiments are to be considered in all respects only as illustrative, and not restrictive. The scope of the invention is, therefore, indicated by the appended claims, rather than by the foregoing description. All changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. A single crystal zinc oxide substrate comprising: an amorphous self supporting substrate surface; and a thin layer of single crystal zinc oxide deposited on the substrate surface by a chemical deposition process, wherein the thin layer of zinc oxide has a crystal lattice which permits the crystal growth of a crystal compatible with zinc oxide.

2. A single crystal zinc oxide substrate according to claim 1, wherein the single crystal zinc oxide is oriented in the (002) plane.

3. A single crystal zinc oxide substrate according to claim 1, wherein the compatible crystal has a lattice parameter within about 5% of a corresponding lattice parameter of the zinc oxide.

4. A single crystal zinc oxide substrate according to claim 1, wherein the compatible crystal comprises GaN.

5. A single crystal zinc oxide substrate according to claim 1, wherein the compatible crystal comprises epitaxial GaN.

6. A single crystal zinc oxide substrate according to claim 1, wherein the compatible crystal is selected from AlN, SiC, and GaN.

7. A single crystal zinc oxide substrate according to claim 1, wherein the compatible crystal comprises p-type or n-type ZnO.

8. A single crystal zinc oxide substrate according to claim 1, wherein the chemical deposition process is selected from RF sputtering, CVD (chemical vapor deposition), MOCVD (metal organic chemical vapor deposition), spin coating, electrophoresis, and hydrothermal growth processes.

9. A single crystal zinc oxide substrate according to claim 1, wherein the thin layer of zinc oxide has a thickness less than about 5 μm.

10. A single crystal zinc oxide substrate according to claim 1, wherein the thin layer of zinc oxide has a thickness greater than about 5 μm.

11. A single crystal zinc oxide substrate according to claim 1, wherein the substrate surface is fused silica (SiO2).

12. A single crystal zinc oxide substrate according to claim 1, wherein the substrate is an amorphous SiO2 coating on a silicon wafer.

13. A single crystal zinc oxide substrate according to claim 1, wherein the chemical deposition process comprises RF sputtering using an RF sputtering system comprising a zinc metal target, a substrate surface, and a plasma comprising oxygen and an inert sputtering gas, wherein the RF sputtering system is operated at conditions which produce the thin layer of single crystal zinc oxide on the substrate surface.

14. A single crystal zinc oxide substrate according to claim 13, wherein the inert sputtering gas is selected from argon, krypton, xenon, neon, and helium.

15. A single crystal zinc oxide substrate according to claim 13, wherein the sputtering system was operated at a power in the range from about 20 watts to 150 watts.

16. A single crystal zinc oxide substrate according to claim 13, wherein the sputtering system was operated at a power in the range from 90 watts to 100 watts.

17. A single crystal zinc oxide substrate according to claim 13, wherein the sputtering system was operated at a RF frequency ranging of about 13.56 MHz.

18. A single crystal zinc oxide substrate according to claim 13, wherein the sputtering system was operated at a temperature in the range from about 300° C. to about 550° C.

19. A single crystal zinc oxide substrate according to claim 13, wherein the sputtering system was operated at a temperature in the range from about 350° C. to about 450° C.

20. A single crystal zinc oxide substrate according to claim 13, wherein the sputtering system was operated for a period from about 1 to about 40 minutes.

21. A single crystal zinc oxide substrate according to claim 13, wherein the sputtering system was operated for a period from about 1 to about 10 minutes.

22. A single crystal zinc oxide substrate according to claim 1, wherein the thin layer of single crystal zinc oxide comprises p-type zinc oxide.

23. A single crystal zinc oxide substrate according to claim 22, further comprising a thin layer of single crystal n-type zinc oxide deposited on the p-type zinc oxide.

24. A single crystal zinc oxide substrate according to claim 23, wherein the n-type zinc oxide contains an n-type dopant selected from ions of Al, Ga, B, H, Yb and other rare earth elements, Y, Sc, and mixtures thereof.

25. A single crystal zinc oxide substrate according to claim 1, wherein the thin layer of single crystal zinc oxide comprises n-type zinc oxide.

26. A single crystal zinc oxide substrate according to claim 25, further comprising a thin layer of single crystal p-type zinc oxide deposited on the n-type zinc oxide.

27. A single crystal zinc oxide substrate according to claim 26, wherein the n-type zinc oxide contains an n-type dopant selected from ions of Al, Ga, B, H, Yb and other rare earth elements, Y, Sc, and mixtures thereof.

28. A single crystal zinc oxide substrate comprising: A polycrystalline self supporting alumina substrate surface; and a thin layer of single crystal zinc oxide deposited on the substrate surface by a chemical deposition process, wherein the thin layer of zinc oxide has a crystal lattice which permits the crystal growth of a crystal compatible with zinc oxide.

29. A single crystal zinc oxide substrate according to claim 28, wherein the single crystal zinc oxide is oriented in the (002) plane.

30. A single crystal zinc oxide substrate according to claim 28, wherein the compatible crystal has a lattice parameter within about 5% of a corresponding lattice parameter of the zinc oxide.

31. A single crystal zinc oxide substrate according to claim 28, wherein the compatible crystal comprises GaN.

32. A single crystal zinc oxide substrate according to claim 28, wherein the compatible crystal comprises epitaxial GaN.

33. A single crystal zinc oxide substrate according to claim 28, wherein the compatible crystal is selected from AlN, SiC, and GaN.

34. A single crystal zinc oxide substrate according to claim 28, wherein the compatible crystal comprises p-type or n-type ZnO.

35. A single crystal zinc oxide substrate according to claim 28, wherein the chemical deposition process is selected from RF sputtering, CVD (chemical vapor deposition), MOCVD (metal organic chemical vapor deposition), spin coating, electrophoresis, and hydrothermal growth processes.

36. A single crystal zinc oxide substrate according to claim 28, wherein the thin layer of zinc oxide has a thickness less than about 5 μm.

37. A single crystal zinc oxide substrate according to claim 28, wherein the thin layer of zinc oxide has a thickness greater than about 5 μm.

38. A single crystal zinc oxide substrate comprising: A self supporting silicon wafer substrate surface; and a thin layer of single crystal zinc oxide deposited on the substrate surface by a chemical deposition process, wherein the thin layer of zinc oxide has a crystal lattice which permits the crystal growth of a crystal compatible with zinc oxide.

39. A single crystal zinc oxide substrate according to claim 38, wherein the single crystal zinc oxide is oriented in the (002) plane.

40. A single crystal zinc oxide substrate according to claim 38, wherein the compatible crystal has a lattice parameter within about 5% of a corresponding lattice parameter of the zinc oxide.

41. A single crystal zinc oxide substrate according to claim 38, wherein the compatible crystal comprises GaN.

42. A single crystal zinc oxide substrate according to claim 38, wherein the compatible crystal comprises epitaxial GaN.

43. A single crystal zinc oxide substrate according to claim 38, wherein the compatible crystal is selected from AlN, SiC, and GaN.

44. A single crystal zinc oxide substrate according to claim 38, wherein the compatible crystal comprises p-type or n-type ZnO.

45. A single crystal zinc oxide substrate according to claim 38, wherein the chemical deposition process is selected from RF sputtering, CVD (chemical vapor deposition), MOCVD (metal organic chemical vapor deposition), spin coating, electrophoresis, and hydrothermal growth processes.

46. A single crystal zinc oxide substrate according to claim 38, wherein the thin layer of zinc oxide has a thickness less than about 5 μm.

47. A single crystal zinc oxide substrate according to claim 38, wherein the thin layer of zinc oxide has a thickness greater than about 5 μm.