Staktek Corporation

Organization

Austin, TX, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Ultra high density integrated circuit packages
- Patent number 6,049,123
- Issue date Apr 11, 2000
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra high density integrated circuit packages
- Patent number 6,025,642
- Issue date Feb 15, 2000
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having an externally mounted lead frame...
- Patent number 5,978,227
- Issue date Nov 2, 1999
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making high density integrated circuit module
- Patent number 5,960,539
- Issue date Oct 5, 1999
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of manufacturing a warp resistant thermally co...
- Patent number 5,945,732
- Issue date Aug 31, 1999
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simulcast standard multichip memory addressing system
- Patent number RE36229
- Issue date Jun 15, 1999
- Staktek Corporation
- James W. Cady
- 711 - Electrical computers and digital processing systems: memory
Information Patent Grant
Three-dimensional warp-resistant integrated circuit module method a...
- Patent number 5,895,232
- Issue date Apr 20, 1999
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-resistant ultra-thin integrated circuit package fabrication me...
- Patent number 5,864,175
- Issue date Jan 26, 1999
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an ultra-high density warp-resistant memory...
- Patent number 5,843,807
- Issue date Dec 1, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-high density warp-resistant memory module
- Patent number 5,828,125
- Issue date Oct 27, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed integrated circuit lead-on package configuration
- Patent number 5,804,870
- Issue date Sep 8, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional warp-resistant integrated circuit module method a...
- Patent number 5,801,437
- Issue date Sep 1, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a hermetically sealed circuit lead-on package
- Patent number 5,783,464
- Issue date Jul 21, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a high density integrated circuit module wi...
- Patent number 5,778,522
- Issue date Jul 14, 1998
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed ceramic integrated circuit heat dissipating pac...
- Patent number 5,702,985
- Issue date Dec 30, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-on-chip integrated circuit apparatus
- Patent number 5,654,877
- Issue date Aug 5, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-high density warp-resistant memory module
- Patent number 5,644,161
- Issue date Jul 1, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density lead-on-package fabrication method
- Patent number 5,631,193
- Issue date May 20, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated package having a pair of die...
- Patent number 5,615,475
- Issue date Apr 1, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a bus communication system for stacked high...
- Patent number 5,605,592
- Issue date Feb 25, 1997
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit module with complex electrical inte...
- Patent number 5,592,364
- Issue date Jan 7, 1997
- Staktek Corporation
- Jerry M. Roane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a high density integrated circuit module ha...
- Patent number 5,588,205
- Issue date Dec 31, 1996
- Staktek Corporation
- Jerry M. Roane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with overlapped die on a common lead frame
- Patent number 5,585,668
- Issue date Dec 17, 1996
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bus communication system for stacked high density integrated circui...
- Patent number 5,586,009
- Issue date Dec 17, 1996
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warp-resistant ultra-thin integrated circuit package
- Patent number 5,581,121
- Issue date Dec 3, 1996
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed ceramic integrated circuit heat dissipating pac...
- Patent number 5,572,065
- Issue date Nov 5, 1996
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra high density integrated circuit packages method and apparatus
- Patent number 5,566,051
- Issue date Oct 15, 1996
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-signal rail assembly with impedance control for a three-dimen...
- Patent number 5,561,591
- Issue date Oct 1, 1996
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bus communication system for stacked high density integrated circui...
- Patent number 5,552,963
- Issue date Sep 3, 1996
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra high density integrated circuit packages
- Patent number 5,550,711
- Issue date Aug 27, 1996
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

Information Trademark
74655645 - VSM
- Serial number 74655645
- Filing date Apr 3, 1995
- Staktek Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
74515813 - VSM
- Serial number 74515813
- Filing date Apr 19, 1994
- Staktek Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
74515812 - STAKTEK
- Serial number 74515812
- Registration number 1987882
- Filing date Apr 19, 1994
- Staktek Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
74482635 - STAKPAK
- Serial number 74482635
- Registration number 1877493
- Filing date Jan 21, 1994
- Staktek Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
74276326 - STAKPAK
- Serial number 74276326
- Filing date May 15, 1992
- Staktek Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
74276327 - S
- Serial number 74276327
- Registration number 1790187
- Filing date May 15, 1992
- Staktek Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Staktek Corporation

Organization

Patents Grantslast 30 patents

Ultra high density integrated circuit packages

Ultra high density integrated circuit packages

Integrated circuit packages having an externally mounted lead frame...

Method of making high density integrated circuit module

Apparatus and method of manufacturing a warp resistant thermally co...

Simulcast standard multichip memory addressing system

Three-dimensional warp-resistant integrated circuit module method a...

Wrap-resistant ultra-thin integrated circuit package fabrication me...

Method of manufacturing an ultra-high density warp-resistant memory...

Ultra-high density warp-resistant memory module

Hermetically sealed integrated circuit lead-on package configuration

Three-dimensional warp-resistant integrated circuit module method a...

Method of forming a hermetically sealed circuit lead-on package

Method of manufacturing a high density integrated circuit module wi...

Hermetically sealed ceramic integrated circuit heat dissipating pac...

Lead-on-chip integrated circuit apparatus

Ultra-high density warp-resistant memory module

High density lead-on-package fabrication method

Method of manufacturing an integrated package having a pair of die...

Method of manufacturing a bus communication system for stacked high...

High density integrated circuit module with complex electrical inte...

Method of manufacturing a high density integrated circuit module ha...

Integrated circuit package with overlapped die on a common lead frame

Bus communication system for stacked high density integrated circui...

Warp-resistant ultra-thin integrated circuit package

Hermetically sealed ceramic integrated circuit heat dissipating pac...

Ultra high density integrated circuit packages method and apparatus

Multi-signal rail assembly with impedance control for a three-dimen...

Bus communication system for stacked high density integrated circui...

Ultra high density integrated circuit packages

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

74655645 - VSM

74515813 - VSM

74515812 - STAKTEK

74482635 - STAKPAK

74276326 - STAKPAK

74276327 - S