UTAC Thai Limited

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Bangna Bangkok, TH

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Patents Grantslast 30 patents

Information Patent Grant
Plated terminals with routing interconnections semiconductor device
- Patent number 9,922,913
- Issue date Mar 20, 2018
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated terminals with routing interconnections semiconductor device
- Patent number 9,922,914
- Issue date Mar 20, 2018
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,899,208
- Issue date Feb 20, 2018
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation method for semiconductor package with plating on side o...
- Patent number 9,818,676
- Issue date Nov 14, 2017
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip cavity package
- Patent number 9,761,435
- Issue date Sep 12, 2017
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,711,343
- Issue date Jul 18, 2017
- UTAC THAI LIMITED
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated terminals with routing interconnections semiconductor device
- Patent number 9,449,905
- Issue date Sep 20, 2016
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-mold for semiconductor package having exposed traces
- Patent number 9,397,031
- Issue date Jul 19, 2016
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Auxiliary leadframe member for stabilizing the bond wire process
- Patent number 9,355,940
- Issue date May 31, 2016
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation method for semiconductor package with plating on side o...
- Patent number 9,349,679
- Issue date May 24, 2016
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,196,470
- Issue date Nov 24, 2015
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,099,294
- Issue date Aug 4, 2015
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming lead frame land grid array
- Patent number 9,099,317
- Issue date Aug 4, 2015
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,093,486
- Issue date Jul 28, 2015
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,082,607
- Issue date Jul 14, 2015
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices including terminals...
- Patent number 9,029,198
- Issue date May 12, 2015
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-mold for semiconductor package having exposed traces
- Patent number 9,006,034
- Issue date Apr 14, 2015
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protruding terminals with internal routing interconnections semicon...
- Patent number 9,000,590
- Issue date Apr 7, 2015
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and system for cooling a singulation process
- Patent number 8,875,537
- Issue date Nov 4, 2014
- UTAC Thai Limited
- Sorasak Utathin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus for and methods of attaching heat slugs to package tops
- Patent number 8,871,571
- Issue date Oct 28, 2014
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe based multi terminal IC package
- Patent number 8,722,461
- Issue date May 13, 2014
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very extremely thin semiconductor package
- Patent number 8,704,381
- Issue date Apr 22, 2014
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame land grid array with routing connector trace under unit
- Patent number 8,685,794
- Issue date Apr 1, 2014
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame ball grid array with traces under die
- Patent number 8,652,879
- Issue date Feb 18, 2014
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame land grid array
- Patent number 8,648,474
- Issue date Feb 11, 2014
- UTAC Thai Limited
- Somchai Nondhasittichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe based multi terminal IC package
- Patent number 8,575,732
- Issue date Nov 5, 2013
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very extremely thin semiconductor package
- Patent number 8,575,762
- Issue date Nov 5, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic solderability preservation coating on metal part of semico...
- Patent number 8,569,877
- Issue date Oct 29, 2013
- UTAC Thai Limited
- Woraya Benjavasukul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame ball grid array with traces under die
- Patent number 8,492,906
- Issue date Jul 23, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame land grid array with routing connector trace under unit
- Patent number 8,487,451
- Issue date Jul 16, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE
- Publication number 20160300783
- Publication date Oct 13, 2016
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE
- Publication number 20160300786
- Publication date Oct 13, 2016
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE
- Publication number 20160293533
- Publication date Oct 6, 2016
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION METHOD FOR SEMICONDUCTOR PACKAGE WITH PLATING ON SIDE O...
- Publication number 20160240460
- Publication date Aug 18, 2016
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-MOLD FOR SEMICONDUCTOR PACKAGE HAVING EXPOSED TRACES
- Publication number 20160172282
- Publication date Jun 16, 2016
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SHIELD FOR SEMICONDUCTOR PACKAGE
- Publication number 20150171022
- Publication date Jun 18, 2015
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE
- Publication number 20140015117
- Publication date Jan 16, 2014
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
- Publication number 20130337609
- Publication date Dec 19, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING TERMINALS...
- Publication number 20130302944
- Publication date Nov 14, 2013
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE
- Publication number 20130299979
- Publication date Nov 14, 2013
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTRUDING TERMINALS WITH INTERNAL ROUTING INTERCONNECTIONS SEMICON...
- Publication number 20130299980
- Publication date Nov 14, 2013
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE
- Publication number 20130243893
- Publication date Sep 19, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME LAND GRID ARRAY
- Publication number 20130234307
- Publication date Sep 12, 2013
- UTAC Thai Limited
- Somchai Nondhasittichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME BASED MULTI TERMINAL IC PACKAGE
- Publication number 20130210197
- Publication date Aug 15, 2013
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPS
- Publication number 20120094438
- Publication date Apr 19, 2012
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PROCESS FOR STRIP TEST
- Publication number 20120066899
- Publication date Mar 22, 2012
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION METHOD FOR SEMICONDUCTOR PACKAGE WITH PLATING ON SIDE O...
- Publication number 20120049335
- Publication date Mar 1, 2012
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF AND SYSTEM FOR COOLING A SINGULATION PROCESS
- Publication number 20120006528
- Publication date Jan 12, 2012
- UTAC Thai Limited
- Sorasak Utathin
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPS
- Publication number 20110241189
- Publication date Oct 6, 2011
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC SOLDERABILITY PRESERVATION COATING ON METAL PART OF SEMICO...
- Publication number 20110232693
- Publication date Sep 29, 2011
- UTAC Thai Limited
- Woraya Benjavasukul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME BASED MULTI TERMINAL IC PACKAGE
- Publication number 20110221051
- Publication date Sep 15, 2011
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME BALL GRID ARRAY WITH TRACES UNDER DIE
- Publication number 20110198752
- Publication date Aug 18, 2011
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
- Publication number 20110147931
- Publication date Jun 23, 2011
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY LEADFRAME MEMBER FOR STABILIZING THE BOND WIRE PROCESS
- Publication number 20110133319
- Publication date Jun 9, 2011
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE
- Publication number 20110076805
- Publication date Mar 31, 2011
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP CAVITY PACKAGE
- Publication number 20110039371
- Publication date Feb 17, 2011
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME FEATURE TO MINIMIZE FLIP-CHIP SEMICONDUCTOR DIE COLLAPSE...
- Publication number 20110018111
- Publication date Jan 27, 2011
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH HEAT TRANSFER
- Publication number 20100327432
- Publication date Dec 30, 2010
- UTAC THAI LIMITED
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR NO LEAD SEMICONDUCTOR PACKAGE
- Publication number 20100311208
- Publication date Dec 9, 2010
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC SOLDERABILITY PRESERVATION COATING ON METAL PART OF SEMICO...
- Publication number 20100230802
- Publication date Sep 16, 2010
- UTAC Thai Limited
- Woraya Benjavasukul
- H01 - BASIC ELECTRIC ELEMENTS

UTAC Thai Limited

Organization

Patents Grantslast 30 patents

Plated terminals with routing interconnections semiconductor device

Plated terminals with routing interconnections semiconductor device

Molded leadframe substrate semiconductor package

Singulation method for semiconductor package with plating on side o...

Flip chip cavity package

Molded leadframe substrate semiconductor package

Plated terminals with routing interconnections semiconductor device

Post-mold for semiconductor package having exposed traces

Auxiliary leadframe member for stabilizing the bond wire process

Singulation method for semiconductor package with plating on side o...

Molded leadframe substrate semiconductor package

Molded leadframe substrate semiconductor package

Method for forming lead frame land grid array

Molded leadframe substrate semiconductor package

Molded leadframe substrate semiconductor package

Methods of manufacturing semiconductor devices including terminals...

Post-mold for semiconductor package having exposed traces

Protruding terminals with internal routing interconnections semicon...

Method of and system for cooling a singulation process

Apparatus for and methods of attaching heat slugs to package tops

Leadframe based multi terminal IC package

Very extremely thin semiconductor package

Lead frame land grid array with routing connector trace under unit

Lead frame ball grid array with traces under die

Lead frame land grid array

Leadframe based multi terminal IC package

Very extremely thin semiconductor package

Metallic solderability preservation coating on metal part of semico...

Lead frame ball grid array with traces under die

Lead frame land grid array with routing connector trace under unit

Patents Applicationslast 30 patents

PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE

PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE

PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE

SINGULATION METHOD FOR SEMICONDUCTOR PACKAGE WITH PLATING ON SIDE O...

POST-MOLD FOR SEMICONDUCTOR PACKAGE HAVING EXPOSED TRACES

CONDUCTIVE SHIELD FOR SEMICONDUCTOR PACKAGE

VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE

LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING TERMINALS...

PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE

PROTRUDING TERMINALS WITH INTERNAL ROUTING INTERCONNECTIONS SEMICON...

MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE

LEAD FRAME LAND GRID ARRAY

LEADFRAME BASED MULTI TERMINAL IC PACKAGE

APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPS

QFN PROCESS FOR STRIP TEST

SINGULATION METHOD FOR SEMICONDUCTOR PACKAGE WITH PLATING ON SIDE O...

METHOD OF AND SYSTEM FOR COOLING A SINGULATION PROCESS

APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPS

METALLIC SOLDERABILITY PRESERVATION COATING ON METAL PART OF SEMICO...

LEADFRAME BASED MULTI TERMINAL IC PACKAGE

LEAD FRAME BALL GRID ARRAY WITH TRACES UNDER DIE

LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT

AUXILIARY LEADFRAME MEMBER FOR STABILIZING THE BOND WIRE PROCESS

MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE

FLIP CHIP CAVITY PACKAGE

LEADFRAME FEATURE TO MINIMIZE FLIP-CHIP SEMICONDUCTOR DIE COLLAPSE...

PACKAGE WITH HEAT TRANSFER

METHOD AND APPARATUS FOR NO LEAD SEMICONDUCTOR PACKAGE

METALLIC SOLDERABILITY PRESERVATION COATING ON METAL PART OF SEMICO...