Anilkumar C. Bhatt

Person

Johnson City, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for recovering an organic solvent from a waste stream contai...
- Patent number 6,946,055
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Anilkumar C. Bhatt
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method of fabricating printed circuit board with mixed metallurgy pads
- Patent number 6,931,722
- Issue date Aug 23, 2005
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards for electronic device packages having glass...
- Patent number 6,781,064
- Issue date Aug 24, 2004
- International Business Machines Corporation
- Bernd K. Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 6,740,819
- Issue date May 25, 2004
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric structure and method of formation
- Patent number 6,699,350
- Issue date Mar 2, 2004
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Full additive process with filled plated through holes
- Patent number 6,664,485
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a printed wiring board
- Patent number 6,608,757
- Issue date Aug 19, 2003
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with mixed metallurgy pads and method of fabr...
- Patent number 6,586,683
- Issue date Jul 1, 2003
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Blind via formation in a photoimageable dielectric material
- Patent number 6,569,604
- Issue date May 27, 2003
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric structure and method of formation
- Patent number 6,495,239
- Issue date Dec 17, 2002
- International Business Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of filling plated through holes
- Patent number 6,453,549
- Issue date Sep 24, 2002
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preparing a printed circuit board
- Patent number RE37840
- Issue date Sep 17, 2002
- International Business Machines Corporation
- Anilkumar C. Bhatt
- 029 - Metal working
Information Patent Grant
Manufacturing computer systems with fine line circuitized substrates
- Patent number 6,436,803
- Issue date Aug 20, 2002
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for recovering an organic solvent from an acidic waste strea...
- Patent number 6,423,290
- Issue date Jul 23, 2002
- International Business Machines Corporation
- Anilkumar C. Bhatt
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Full additive process with filled plated through holes
- Patent number 6,418,616
- Issue date Jul 16, 2002
- International Business Machines Corporation
- Anilkumar C. Bhatt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for in-situ testing of integrated circuit chips
- Patent number 6,414,509
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board to module mounting and interconnecting struct...
- Patent number 6,386,890
- Issue date May 14, 2002
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing computer systems with fine line circuitized substrates
- Patent number 6,268,016
- Issue date Jul 31, 2001
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective wafer-level testing and burn-in
- Patent number 6,255,208
- Issue date Jul 3, 2001
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an enhanced organic chip carrier package
- Patent number 6,225,028
- Issue date May 1, 2001
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a circuitized substrate with an aperture
- Patent number 6,221,694
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an organic chip carrier package
- Patent number 6,207,354
- Issue date Mar 27, 2001
- International Business Machines Coporation
- Anilkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full additive process with filled plated through holes
- Patent number 6,195,883
- Issue date Mar 6, 2001
- International Business Machines Corporation
- Anilkumar C. Bhatt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for recovering high boiling solvents from a photolithograph...
- Patent number 6,187,965
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Anilkumar C. Bhatt
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Information handling system with circuit assembly having holes fill...
- Patent number 6,178,093
- Issue date Jan 23, 2001
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a circuit board with filled holes
- Patent number 6,138,350
- Issue date Oct 31, 2000
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with wiring sealing filled holes
- Patent number 6,127,025
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist develop and strip solvent compositions and method for t...
- Patent number 6,127,097
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Nageshwer Rao Bantu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Circuit board assemblies having filled vias free from bleed-out
- Patent number 6,114,019
- Issue date Sep 5, 2000
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a circuitized substrate
- Patent number 6,110,650
- Issue date Aug 29, 2000
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Printed wiring board
- Publication number 20030188890
- Publication date Oct 9, 2003
- IBM Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20030177635
- Publication date Sep 25, 2003
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for recovering an organic solvent from a waste stream contai...
- Publication number 20030044340
- Publication date Mar 6, 2003
- International Business Machines Corporation
- Anilkumar C. Bhatt
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Dielectric structure and method of formation
- Publication number 20030010440
- Publication date Jan 16, 2003
- Anilkumar C. Bhatt
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20020157861
- Publication date Oct 31, 2002
- International Business Machines Corporation
- Edward L. Arrington
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Manufacturing computer systems with fine line circuitized substrates
- Publication number 20010033889
- Publication date Oct 25, 2001
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Full additive process with filled plated through holes
- Publication number 20010009066
- Publication date Jul 26, 2001
- International Business Machines Corporation
- Anilkumar C. Bhatt
- B32 - LAYERED PRODUCTS
Information Patent Application
Full additive process with filled plated through holes
- Publication number 20010007289
- Publication date Jul 12, 2001
- International Business Machines Corporation
- Anilkumar C. Bhatt
- B32 - LAYERED PRODUCTS

Anilkumar C. Bhatt

Person

Patents Grantslast 30 patents

Method for recovering an organic solvent from a waste stream contai...

Method of fabricating printed circuit board with mixed metallurgy pads

Printed circuit boards for electronic device packages having glass...

Printed wiring board

Dielectric structure and method of formation

Full additive process with filled plated through holes

Method for making a printed wiring board

Printed circuit board with mixed metallurgy pads and method of fabr...

Blind via formation in a photoimageable dielectric material

Dielectric structure and method of formation

Method of filling plated through holes

Method of preparing a printed circuit board

Manufacturing computer systems with fine line circuitized substrates

Method for recovering an organic solvent from an acidic waste strea...

Full additive process with filled plated through holes

Method and apparatus for in-situ testing of integrated circuit chips

Printed circuit board to module mounting and interconnecting struct...

Manufacturing computer systems with fine line circuitized substrates

Selective wafer-level testing and burn-in

Method of making an enhanced organic chip carrier package

Method of making a circuitized substrate with an aperture

Method of making an organic chip carrier package

Full additive process with filled plated through holes

Process for recovering high boiling solvents from a photolithograph...

Information handling system with circuit assembly having holes fill...

Process for manufacturing a circuit board with filled holes

Circuit board with wiring sealing filled holes

Photoresist develop and strip solvent compositions and method for t...

Circuit board assemblies having filled vias free from bleed-out

Method of making a circuitized substrate

Patents Applicationslast 30 patents

Printed wiring board

Printed circuit board with mixed metallurgy pads and method of fabr...

Method for recovering an organic solvent from a waste stream contai...

Dielectric structure and method of formation

Printed circuit board with mixed metallurgy pads and method of fabr...

Manufacturing computer systems with fine line circuitized substrates

Full additive process with filled plated through holes

Full additive process with filled plated through holes