Anthony P. Ingraham

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for in-situ testing of integrated circuit chips
- Patent number 6,414,509
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- G01 - MEASURING TESTING
Information Patent Grant
Free standing, three dimensional, multi-chip, carrier package with...
- Patent number 6,256,203
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing a curved substrate and resulting structure
- Patent number 6,150,255
- Issue date Nov 21, 2000
- International Business Machines Corporation
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for joining a chip to a circuit card
- Patent number 6,121,069
- Issue date Sep 19, 2000
- International Business Machines Corporation
- Christina M. Boyko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test head for applying signals in a burn-in test of an integrated c...
- Patent number 6,094,060
- Issue date Jul 25, 2000
- International Business Machines Corporation
- Jerome A. Frankeny
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for burn-in/testing of integrated circuit devices
- Patent number 6,094,059
- Issue date Jul 25, 2000
- International Business Machines Corporation
- Jerome A. Frankeny
- G01 - MEASURING TESTING
Information Patent Grant
Integrated, multi-chip, thermally conductive packaging device and m...
- Patent number 6,075,287
- Issue date Jun 13, 2000
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Free standing, three dimensional, multi-chip, carrier package with...
- Patent number 6,061,245
- Issue date May 9, 2000
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, and corresponding method, for stress testing wire bond-t...
- Patent number 5,994,910
- Issue date Nov 30, 1999
- International Business Machines Corporation
- Francis Joseph Downes
- G01 - MEASURING TESTING
Information Patent Grant
Ball limiting metal mask and tin enrichment of high melting point s...
- Patent number 5,953,623
- Issue date Sep 14, 1999
- International Business Machines Corporation
- Christina M. Boyko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test head for applying signals in a burn-in test of an integrated c...
- Patent number 5,949,246
- Issue date Sep 7, 1999
- International Business Machines
- Jerome A. Frankeny
- G01 - MEASURING TESTING
Information Patent Grant
Method of planarizing a curved substrate and resulting structure
- Patent number 5,940,729
- Issue date Aug 17, 1999
- International Business Machines Corp.
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated multi-chip circuit package with heat-sink sup...
- Patent number 5,926,369
- Issue date Jul 20, 1999
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dendritic interconnection system
- Patent number 5,759,046
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Anthony Paul Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solderless electrical connection with a wirebon...
- Patent number 5,709,336
- Issue date Jan 20, 1998
- International Business Machines Corporation
- Anthony Paul Ingraham
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,672,980
- Issue date Sep 30, 1997
- International Business Machines Corporation
- Richard Gordon Charlton
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,659,256
- Issue date Aug 19, 1997
- International Business Machines Corporation
- Richard Gordon Charlton
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,528,159
- Issue date Jun 18, 1996
- International Business Machine Corp.
- Richard G. Charlton
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,523,696
- Issue date Jun 4, 1996
- International Business Machines Corp.
- Richard G. Charlton
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing of integrated circuit chips
- Patent number 5,420,520
- Issue date May 30, 1995
- International Business Machines Corporation
- Morris Anschel
- G01 - MEASURING TESTING
Information Patent Grant
Low temperature ternary C4 flip chip bonding method
- Patent number 5,391,514
- Issue date Feb 21, 1995
- International Business Machines Corporation
- Thomas P. Gall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating nendritic materials
- Patent number 5,185,073
- Issue date Feb 9, 1993
- International Business Machines Corporation
- Perminder S. Bindra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separable electrical connection technology
- Patent number 5,137,461
- Issue date Aug 11, 1992
- International Business Machines Corporation
- Perminder S. Bindra
- H01 - BASIC ELECTRIC ELEMENTS

Anthony P. Ingraham

Person

Patents Grantslast 30 patents

Method and apparatus for in-situ testing of integrated circuit chips

Free standing, three dimensional, multi-chip, carrier package with...

Method of planarizing a curved substrate and resulting structure

Interconnect structure for joining a chip to a circuit card

Test head for applying signals in a burn-in test of an integrated c...

Apparatus and method for burn-in/testing of integrated circuit devices

Integrated, multi-chip, thermally conductive packaging device and m...

Free standing, three dimensional, multi-chip, carrier package with...

Apparatus, and corresponding method, for stress testing wire bond-t...

Ball limiting metal mask and tin enrichment of high melting point s...

Test head for applying signals in a burn-in test of an integrated c...

Method of planarizing a curved substrate and resulting structure

Vertically integrated multi-chip circuit package with heat-sink sup...

Dendritic interconnection system

Method of forming a solderless electrical connection with a wirebon...

Method and apparatus for testing integrated circuit chips

Method and apparatus for testing integrated circuit chips

Method and apparatus for testing integrated circuit chips

Method and apparatus for testing integrated circuit chips

Method and apparatus for testing of integrated circuit chips

Low temperature ternary C4 flip chip bonding method

Method of fabricating nendritic materials

Separable electrical connection technology