Ashok S. Prabhu

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package with thermal pad
- Patent number 12,021,019
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip packaged devices with thermal pad
- Patent number 11,955,456
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 11,450,638
- Issue date Sep 20, 2022
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out electronic device
- Patent number 11,410,875
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 11,367,699
- Issue date Jun 21, 2022
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper passivation
- Patent number 11,021,786
- Issue date Jun 1, 2021
- Texas Instruments Incorporated
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 10,763,230
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 10,763,231
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive deposition low temperature curable magnetic interconnectin...
- Patent number 10,650,957
- Issue date May 12, 2020
- Texas Instruments Incorporated
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 10,559,537
- Issue date Feb 11, 2020
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires
- Patent number 10,490,528
- Issue date Nov 26, 2019
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dies-on-package devices and methods therefor
- Patent number 10,354,976
- Issue date Jul 16, 2019
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires for vertical integration with separate sur...
- Patent number 10,325,877
- Issue date Jun 18, 2019
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package for wafer-level chip scale packaging with f...
- Patent number 10,181,457
- Issue date Jan 15, 2019
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 10,115,678
- Issue date Oct 30, 2018
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic device for a package-on-package device
- Patent number 10,043,779
- Issue date Aug 7, 2018
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package devices with same level WLP components and metho...
- Patent number 9,991,233
- Issue date Jun 5, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package devices with upper RDL of WLPS and methods therefor
- Patent number 9,991,235
- Issue date Jun 5, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package devices with multiple levels and methods therefor
- Patent number 9,985,007
- Issue date May 29, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires for vertical integration with separate sur...
- Patent number 9,984,992
- Issue date May 29, 2018
- Invensas Corporation
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged components and methods therefor
- Patent number 9,972,573
- Issue date May 15, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package devices with WLP components with dual RDLs for s...
- Patent number 9,972,609
- Issue date May 15, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
‘RDL-First’ packaged microelectronic device for a package-on-packag...
- Patent number 9,911,718
- Issue date Mar 6, 2018
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flipped die stack assemblies with leadframe interconnects
- Patent number 9,871,019
- Issue date Jan 16, 2018
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flipped die stack
- Patent number 9,825,002
- Issue date Nov 21, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 9,812,402
- Issue date Nov 7, 2017
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball bonding metal wire bond wires to metal pads
- Patent number 9,761,554
- Issue date Sep 12, 2017
- Invensas Corporation
- Willmar Subido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level flipped die stacks with leadframes or metal foil interc...
- Patent number 9,666,513
- Issue date May 30, 2017
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL OUTLINE TRANSISTOR WITH THERMAL FLAT LEAD
- Publication number 20240055331
- Publication date Feb 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hau Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20230136784
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20230059375
- Publication date Feb 23, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD
- Publication number 20230005880
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BACKSIDE METALLIZATION
- Publication number 20210035932
- Publication date Feb 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Hiroyuki SADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200402938
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ELECTRONIC DEVICE
- Publication number 20200203219
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BACKSIDE METALLIZATION
- Publication number 20200203295
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hiroyuki SADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASSIVATION
- Publication number 20200173013
- Publication date Jun 4, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Luu Thanh Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIE ISOLATION ON A SUBSTRATE
- Publication number 20200135632
- Publication date Apr 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE DEPOSITION LOW TEMPERATURE CURABLE MAGNETIC INTERCONNECTIN...
- Publication number 20200135381
- Publication date Apr 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Yi YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20200118939
- Publication date Apr 16, 2020
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PRINTED ELECTRONIC COMPONENTS
- Publication number 20200105453
- Publication date Apr 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Yi YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200035633
- Publication date Jan 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE FOR WAFER-LEVEL CHIP SCALE PACKAGING WITH F...
- Publication number 20190096861
- Publication date Mar 28, 2019
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20190027444
- Publication date Jan 24, 2019
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Wire Bond Wires for Vertical Integration With Separate Sur...
- Publication number 20180240773
- Publication date Aug 23, 2018
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bond Wires for Interference Shielding
- Publication number 20180061774
- Publication date Mar 1, 2018
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Multiple Levels and Methods Therefor
- Publication number 20180026018
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Packaged Components and Methods Therefor
- Publication number 20180025987
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Same Level WLP Components and Metho...
- Publication number 20180026011
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor
- Publication number 20180026016
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dies-on-Package Devices and Methods Therefor
- Publication number 20180026017
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with WLP Components with Dual RDLS for S...
- Publication number 20180026019
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded wire bond wires for vertical integration with separate sur...
- Publication number 20170194281
- Publication date Jul 6, 2017
- Invensas Corporatoin
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
'RDL-First' Packaged Microelectronic Device for a Package-on-Packag...
- Publication number 20170141042
- Publication date May 18, 2017
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Microelectronic Device for a Package-on-Package Device
- Publication number 20170141083
- Publication date May 18, 2017
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20170117231
- Publication date Apr 27, 2017
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS

Ashok S. Prabhu

Person

Patents Grantslast 30 patents

Semiconductor device package with thermal pad

Flip chip packaged devices with thermal pad

Wire bond wires for interference shielding

Wire bond wires for interference shielding

Bump bond structure for enhanced electromigration performance

Fan-out electronic device

Integrated circuit backside metallization

Copper passivation

Integrated circuit backside metallization

Bump bond structure for enhanced electromigration performance

Additive deposition low temperature curable magnetic interconnectin...

Wire bond wires for interference shielding

Embedded wire bond wires

Dies-on-package devices and methods therefor

Embedded wire bond wires for vertical integration with separate sur...

Microelectronic package for wafer-level chip scale packaging with f...

Wire bond wires for interference shielding

Packaged microelectronic device for a package-on-package device

Package-on-package devices with same level WLP components and metho...

Package on-package devices with upper RDL of WLPS and methods therefor

Package on-package devices with multiple levels and methods therefor

Embedded wire bond wires for vertical integration with separate sur...

Wafer-level packaged components and methods therefor

Package-on-package devices with WLP components with dual RDLs for s...

‘RDL-First’ packaged microelectronic device for a package-on-packag...

Flipped die stack assemblies with leadframe interconnects

Flipped die stack

Wire bond wires for interference shielding

Ball bonding metal wire bond wires to metal pads

Wafer-level flipped die stacks with leadframes or metal foil interc...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

SMALL OUTLINE TRANSISTOR WITH THERMAL FLAT LEAD

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD

INTEGRATED CIRCUIT BACKSIDE METALLIZATION

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

FAN-OUT ELECTRONIC DEVICE

INTEGRATED CIRCUIT BACKSIDE METALLIZATION

COPPER PASSIVATION

DIE ISOLATION ON A SUBSTRATE

ADDITIVE DEPOSITION LOW TEMPERATURE CURABLE MAGNETIC INTERCONNECTIN...

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

INKJET PRINTED ELECTRONIC COMPONENTS

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

MICROELECTRONIC PACKAGE FOR WAFER-LEVEL CHIP SCALE PACKAGING WITH F...

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Embedded Wire Bond Wires for Vertical Integration With Separate Sur...

Wire Bond Wires for Interference Shielding

Package-on-Package Devices with Multiple Levels and Methods Therefor

Wafer-Level Packaged Components and Methods Therefor

Package-on-Package Devices with Same Level WLP Components and Metho...

Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor

Dies-on-Package Devices and Methods Therefor

Package-on-Package Devices with WLP Components with Dual RDLS for S...

Embedded wire bond wires for vertical integration with separate sur...

'RDL-First' Packaged Microelectronic Device for a Package-on-Packag...

Packaged Microelectronic Device for a Package-on-Package Device

WIRE BOND WIRES FOR INTERFERENCE SHIELDING