Brent A. Anderson

Person

Jericho, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside electrical contacts to buried power rails
- Patent number 12,136,655
- Issue date Nov 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation region fabrication for replacement gate processing
- Patent number RE50181
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Brent A. Anderson
Information Patent Grant
Semiconductor device with early buried power rail (BPR) and backsid...
- Patent number 12,057,371
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe for vertically stacked field effect transistors
- Patent number 12,040,250
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Terence Hook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned metal gate with poly silicide for vertical transport f...
- Patent number 12,034,005
- Issue date Jul 9, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried power rail contact
- Patent number 12,002,874
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-short-height standard cell architecture
- Patent number 12,001,772
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Albert Chu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,990,410
- Issue date May 21, 2024
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail integration
- Patent number 11,915,966
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial fin for self-aligned contact rail formation
- Patent number 11,901,440
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical FET with contact to gate above active fin
- Patent number 11,855,191
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnects with a replacement metal
- Patent number 11,842,961
- Issue date Dec 12, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried contact through fin-to-fin space for vertical transport fiel...
- Patent number 11,830,774
- Issue date Nov 28, 2023
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via cut fill process for line extension reduction
- Patent number 11,804,406
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines with subtractive cuts
- Patent number 11,791,258
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
VTFET with buried power rails
- Patent number 11,764,298
- Issue date Sep 19, 2023
- International Business Machines Corporation
- Chen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy fin template to form a self-aligned metal contact for output...
- Patent number 11,710,666
- Issue date Jul 25, 2023
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming first and second contacts self-aligned top source...
- Patent number 11,688,775
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Juntao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped top via for via resistance reduction
- Patent number 11,670,542
- Issue date Jun 6, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects on multiple sides of a semiconductor structure
- Patent number 11,658,116
- Issue date May 23, 2023
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via stack
- Patent number 11,600,565
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin top hard mask formation after wafer flipping process
- Patent number 11,563,003
- Issue date Jan 24, 2023
- International Business Machines Corporation
- Chen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled bottom junctions
- Patent number 11,538,939
- Issue date Dec 27, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 11,437,317
- Issue date Sep 6, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier removal for conductor in top via integration scheme
- Patent number 11,430,735
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE LOCAL INTERCONNECT
- Publication number 20250022795
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- Publication number 20250006664
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR
- Publication number 20250006629
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- Publication number 20250006590
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET WITH LOW PARASITIC-CAPACITANCE GATE
- Publication number 20250006786
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Crackstop Interweave Architectural Design Using S...
- Publication number 20250006658
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH CHANGE BETWEEN METAL LINES
- Publication number 20250006638
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- Publication number 20250006663
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
- Publication number 20240429178
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED SELF-ALIGNED BACKSIDE CONTACT
- Publication number 20240429098
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Albert M. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR BACKSIDE SIGNAL AND POWER
- Publication number 20240421087
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT LAYOUTS WITH STAGGERED GATE AND SOURCE/DRAIN REGIONS
- Publication number 20240421145
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Carl Radens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR STRUCTURES WITH HYBRID GATE PITCH
- Publication number 20240421156
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED GATE CUT REGION
- Publication number 20240420959
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES WITH BACKSIDE CONTACTS
- Publication number 20240421038
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE
- Publication number 20240421078
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES
- Publication number 20240421079
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED GATE CUT REGION
- Publication number 20240420960
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID ORIENTATION CHANNELS AND MIXED ORIENTATION BOTTOM EPITAXY
- Publication number 20240395816
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT BACKSIDE POWER RAIL FOR ISOLATED SUPPLY
- Publication number 20240395711
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLACEHOLDER PROFILE FORMATION FOR BACKSIDE CONTACT
- Publication number 20240379769
- Publication date Nov 14, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SELF ALIGNED SKIP VIA
- Publication number 20240371729
- Publication date Nov 7, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACTS FOR SOURCE/DRAIN REGIONS
- Publication number 20240371728
- Publication date Nov 7, 2024
- International Business Machines Corporation
- Albert M. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOUGED INTERCONNECT LINE
- Publication number 20240363524
- Publication date Oct 31, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE USING BACKSIDE POWER DISTRIBUTION NETWORK
- Publication number 20240363617
- Publication date Oct 31, 2024
- International Business Machines Corporation
- Terence Hook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC GATE EXTENSION IN STACKED FET
- Publication number 20240355679
- Publication date Oct 24, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR POCKET BETWEEN TOP AND BOTTOM SOURCE/DRAIN REGIONS
- Publication number 20240339452
- Publication date Oct 10, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACTS FOR SEMICONDUCTOR DEVICES
- Publication number 20240332293
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IRREGULAR-SHAPED POWER RAIL IN CELL POWER DISTRIBUTION
- Publication number 20240321748
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LINEAR DOUBLE-LENGTH VTFETS
- Publication number 20240321879
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Brent A. Anderson

Person

Patents Grantslast 30 patents

Self-aligning spacer tight pitch via

Backside electrical contacts to buried power rails

Isolation region fabrication for replacement gate processing

Semiconductor device with early buried power rail (BPR) and backsid...

Heat pipe for vertically stacked field effect transistors

Self-aligned metal gate with poly silicide for vertical transport f...

Buried power rail contact

Ultra-short-height standard cell architecture

Top via interconnect having a line with a reduced bottom dimension

Interconnects having spacers for improved top via critical dimensio...

Backside power rail integration

Sacrificial fin for self-aligned contact rail formation

Top via with damascene line and via

Top via process with damascene metal

Vertical FET with contact to gate above active fin

Advanced metal interconnects with a replacement metal

Buried contact through fin-to-fin space for vertical transport fiel...

Top via with next level line selective growth

Top via cut fill process for line extension reduction

Conductive lines with subtractive cuts

VTFET with buried power rails

Dummy fin template to form a self-aligned metal contact for output...

Method of forming first and second contacts self-aligned top source...

Stepped top via for via resistance reduction

Interconnects on multiple sides of a semiconductor structure

Top via stack

Fin top hard mask formation after wafer flipping process

Controlled bottom junctions

Single-mask alternating line deposition

Barrier removal for conductor in top via integration scheme

Patents Applicationslast 30 patents

BACKSIDE LOCAL INTERCONNECT

THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL

DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR

DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE

STACKED FET WITH LOW PARASITIC-CAPACITANCE GATE

Three Dimensional Crackstop Interweave Architectural Design Using S...

PITCH CHANGE BETWEEN METAL LINES

DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING

MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES

MERGED SELF-ALIGNED BACKSIDE CONTACT

STRUCTURE FOR BACKSIDE SIGNAL AND POWER

CIRCUIT LAYOUTS WITH STAGGERED GATE AND SOURCE/DRAIN REGIONS

STACKED TRANSISTOR STRUCTURES WITH HYBRID GATE PITCH

INVERTED GATE CUT REGION

STACKED DEVICES WITH BACKSIDE CONTACTS

REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE

INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES

INVERTED GATE CUT REGION

HYBRID ORIENTATION CHANNELS AND MIXED ORIENTATION BOTTOM EPITAXY

SPLIT BACKSIDE POWER RAIL FOR ISOLATED SUPPLY

PLACEHOLDER PROFILE FORMATION FOR BACKSIDE CONTACT

BACKSIDE SELF ALIGNED SKIP VIA

BACKSIDE CONTACTS FOR SOURCE/DRAIN REGIONS

GOUGED INTERCONNECT LINE

ELECTROSTATIC DISCHARGE USING BACKSIDE POWER DISTRIBUTION NETWORK

ASYMMETRIC GATE EXTENSION IN STACKED FET

AIR POCKET BETWEEN TOP AND BOTTOM SOURCE/DRAIN REGIONS

GATE CONTACTS FOR SEMICONDUCTOR DEVICES

IRREGULAR-SHAPED POWER RAIL IN CELL POWER DISTRIBUTION

STACKED LINEAR DOUBLE-LENGTH VTFETS