Brent A. Anderson

Person

Jericho, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dummy fin contact in vertically stacked transistors
- Patent number 12,364,004
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Joshua M. Rubin
Information Patent Grant
Vertical field-effect transistor with isolation pillars
- Patent number 12,356,709
- Issue date Jul 8, 2025
- International Business Machines Corporation
- Brent A. Anderson
Information Patent Grant
Late gate extension
- Patent number 12,356,711
- Issue date Jul 8, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Grant
Looped long channel field-effect transistor
- Patent number 12,356,685
- Issue date Jul 8, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered stacked circuits with increased effective width
- Patent number 12,349,458
- Issue date Jul 1, 2025
- International Business Machines Corporation
- Brent A Anderson
Information Patent Grant
Stacked layer memory suitable for SRAM and having a long cell
- Patent number 12,342,578
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Brent A. Anderson
Information Patent Grant
Stacked FET SRAM
- Patent number 12,328,859
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Grant
Local interconnect for cross coupling
- Patent number 12,322,652
- Issue date Jun 3, 2025
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio contact structure with multiple metal stacks
- Patent number 12,268,026
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Junli Wang
Information Patent Grant
Backside power rails and power distribution network for density sca...
- Patent number 12,268,031
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried power rail formation for vertical field effect transistors
- Patent number 12,268,016
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside electrical contacts to buried power rails
- Patent number 12,136,655
- Issue date Nov 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation region fabrication for replacement gate processing
- Patent number RE50181
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Brent A. Anderson
Information Patent Grant
Semiconductor device with early buried power rail (BPR) and backsid...
- Patent number 12,057,371
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe for vertically stacked field effect transistors
- Patent number 12,040,250
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Terence Hook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned metal gate with poly silicide for vertical transport f...
- Patent number 12,034,005
- Issue date Jul 9, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried power rail contact
- Patent number 12,002,874
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-short-height standard cell architecture
- Patent number 12,001,772
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Albert Chu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,990,410
- Issue date May 21, 2024
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail integration
- Patent number 11,915,966
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial fin for self-aligned contact rail formation
- Patent number 11,901,440
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical FET with contact to gate above active fin
- Patent number 11,855,191
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnects with a replacement metal
- Patent number 11,842,961
- Issue date Dec 12, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried contact through fin-to-fin space for vertical transport fiel...
- Patent number 11,830,774
- Issue date Nov 28, 2023
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CROSS-COUPLE CONSTRUCT WITH SHIFTED GATE CONTACT
- Publication number 20250218930
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Albert M. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL
- Publication number 20250218863
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED DEVICE TYPES
- Publication number 20250203946
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Shay Reboh
Information Patent Application
REPLACEMENT FULLY ALIGNED VIA AND METAL LINE
- Publication number 20250201699
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS
- Publication number 20250194210
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING
- Publication number 20250194199
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL TRANSFER VIAS AND SEMICONDUCTOR VIA STRUCTURE FOR ENHANCED...
- Publication number 20250191995
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Brent A. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLY-OVER METAL JUMPER CONNECTION
- Publication number 20250192023
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC VIA BAR UNDER POWER RAIL
- Publication number 20250192046
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET WITH SHIFTED CHANNEL STRUCTURE
- Publication number 20250194163
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Shay Reboh
Information Patent Application
GATE TIE-DOWN TO BACKSIDE POWER RAIL
- Publication number 20250194197
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FORKSHEET FET WITH SHARED AND/OR INDEPENDENT GATES
- Publication number 20250194238
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Shay Reboh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED METAL JUMPER STRUCTURE FOR BEOL
- Publication number 20250192037
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED FRONTSIDE/BACKSIDE POWER SUPPLY FOR CHARGE SHARING
- Publication number 20250183145
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
U-SHAPED SPACER TO PROTECT THE INTRA-DEVICE SPACE REGION FOR STACKE...
- Publication number 20250185298
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Lijuan Zou
Information Patent Application
STACKED FIELD-EFFECT TRANSISTOR DEVICE WITH BACKSIDE CUT FOR TOP SO...
- Publication number 20250167118
- Publication date May 22, 2025
- International Business Machines Corporation
- Debarghya Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES HAVING ANGLED DIELECTRIC BARS ATTACHED TO...
- Publication number 20250169131
- Publication date May 22, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Application
ENLARGED BOTTOM CONTACT AREA IN STACKED TRANSISTORS
- Publication number 20250159997
- Publication date May 15, 2025
- International Business Machines Corporation
- Brent A. Anderson
Information Patent Application
BACKSIDE DIFFUSION BREAK
- Publication number 20250157886
- Publication date May 15, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTION IN MIDDLE BEOL WIRING
- Publication number 20250140650
- Publication date May 1, 2025
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET WITH ASYMMETRIC CELL BOUNDARY
- Publication number 20250133816
- Publication date Apr 24, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE-VIA-LINE STRUCTURE FOR BSPDN
- Publication number 20250125250
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORKSHEET TRANSISTOR STRUCTURE
- Publication number 20250126884
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT SHAPES FOR BACKSIDE METALS
- Publication number 20250118661
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH MOAT DECOUPLING CAPACITOR
- Publication number 20250120101
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Herbert Lei Ho
Information Patent Application
DUAL SIDE STACKED TRANSISTOR
- Publication number 20250118630
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTOR CRESCENT-SHAPED DIELECTRIC ISOLATION
- Publication number 20250113560
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS
- Publication number 20250112121
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OFFSET GATE CONTACT
- Publication number 20250107205
- Publication date Mar 27, 2025
- International Business Machines Corporation
- Albert M. Chu
Information Patent Application
METAL TIP-TO-TIP SCALING
- Publication number 20250096132
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS

Brent A. Anderson

Person

Patents Grantslast 30 patents

Dummy fin contact in vertically stacked transistors

Vertical field-effect transistor with isolation pillars

Late gate extension

Looped long channel field-effect transistor

Staggered stacked circuits with increased effective width

Stacked layer memory suitable for SRAM and having a long cell

Stacked FET SRAM

Local interconnect for cross coupling

High aspect ratio contact structure with multiple metal stacks

Backside power rails and power distribution network for density sca...

Buried power rail formation for vertical field effect transistors

Single-mask alternating line deposition

Self-aligning spacer tight pitch via

Backside electrical contacts to buried power rails

Isolation region fabrication for replacement gate processing

Semiconductor device with early buried power rail (BPR) and backsid...

Heat pipe for vertically stacked field effect transistors

Self-aligned metal gate with poly silicide for vertical transport f...

Buried power rail contact

Ultra-short-height standard cell architecture

Top via interconnect having a line with a reduced bottom dimension

Interconnects having spacers for improved top via critical dimensio...

Backside power rail integration

Sacrificial fin for self-aligned contact rail formation

Top via with damascene line and via

Top via process with damascene metal

Vertical FET with contact to gate above active fin

Advanced metal interconnects with a replacement metal

Buried contact through fin-to-fin space for vertical transport fiel...

Top via with next level line selective growth

Patents Applicationslast 30 patents

CROSS-COUPLE CONSTRUCT WITH SHIFTED GATE CONTACT

ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL

SEMICONDUCTOR DEVICE WITH STACKED DEVICE TYPES

REPLACEMENT FULLY ALIGNED VIA AND METAL LINE

SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS

PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING

THERMAL TRANSFER VIAS AND SEMICONDUCTOR VIA STRUCTURE FOR ENHANCED...

FLY-OVER METAL JUMPER CONNECTION

ASYMMETRIC VIA BAR UNDER POWER RAIL

STACKED FET WITH SHIFTED CHANNEL STRUCTURE

GATE TIE-DOWN TO BACKSIDE POWER RAIL

STACKED FORKSHEET FET WITH SHARED AND/OR INDEPENDENT GATES

BURIED METAL JUMPER STRUCTURE FOR BEOL

COMBINED FRONTSIDE/BACKSIDE POWER SUPPLY FOR CHARGE SHARING

U-SHAPED SPACER TO PROTECT THE INTRA-DEVICE SPACE REGION FOR STACKE...

STACKED FIELD-EFFECT TRANSISTOR DEVICE WITH BACKSIDE CUT FOR TOP SO...

SEMICONDUCTOR STRUCTURES HAVING ANGLED DIELECTRIC BARS ATTACHED TO...

ENLARGED BOTTOM CONTACT AREA IN STACKED TRANSISTORS

BACKSIDE DIFFUSION BREAK

VIA CONNECTION IN MIDDLE BEOL WIRING

STACKED FET WITH ASYMMETRIC CELL BOUNDARY

LINE-VIA-LINE STRUCTURE FOR BSPDN

FORKSHEET TRANSISTOR STRUCTURE

CUT SHAPES FOR BACKSIDE METALS

TRENCH MOAT DECOUPLING CAPACITOR

DUAL SIDE STACKED TRANSISTOR

FIELD-EFFECT TRANSISTOR CRESCENT-SHAPED DIELECTRIC ISOLATION

ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS

SEMICONDUCTOR DEVICE WITH OFFSET GATE CONTACT

METAL TIP-TO-TIP SCALING