Brent A. Anderson

Person

Jericho, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio contact structure with multiple metal stacks
- Patent number 12,268,026
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Junli Wang
Information Patent Grant
Backside power rails and power distribution network for density sca...
- Patent number 12,268,031
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried power rail formation for vertical field effect transistors
- Patent number 12,268,016
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside electrical contacts to buried power rails
- Patent number 12,136,655
- Issue date Nov 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation region fabrication for replacement gate processing
- Patent number RE50181
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Brent A. Anderson
Information Patent Grant
Semiconductor device with early buried power rail (BPR) and backsid...
- Patent number 12,057,371
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe for vertically stacked field effect transistors
- Patent number 12,040,250
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Terence Hook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned metal gate with poly silicide for vertical transport f...
- Patent number 12,034,005
- Issue date Jul 9, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried power rail contact
- Patent number 12,002,874
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-short-height standard cell architecture
- Patent number 12,001,772
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Albert Chu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,990,410
- Issue date May 21, 2024
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail integration
- Patent number 11,915,966
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial fin for self-aligned contact rail formation
- Patent number 11,901,440
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical FET with contact to gate above active fin
- Patent number 11,855,191
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnects with a replacement metal
- Patent number 11,842,961
- Issue date Dec 12, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried contact through fin-to-fin space for vertical transport fiel...
- Patent number 11,830,774
- Issue date Nov 28, 2023
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via cut fill process for line extension reduction
- Patent number 11,804,406
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines with subtractive cuts
- Patent number 11,791,258
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
VTFET with buried power rails
- Patent number 11,764,298
- Issue date Sep 19, 2023
- International Business Machines Corporation
- Chen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy fin template to form a self-aligned metal contact for output...
- Patent number 11,710,666
- Issue date Jul 25, 2023
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming first and second contacts self-aligned top source...
- Patent number 11,688,775
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Juntao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped top via for via resistance reduction
- Patent number 11,670,542
- Issue date Jun 6, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects on multiple sides of a semiconductor structure
- Patent number 11,658,116
- Issue date May 23, 2023
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via stack
- Patent number 11,600,565
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CUT SHAPES FOR BACKSIDE METALS
- Publication number 20250118661
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTOR CRESCENT-SHAPED DIELECTRIC ISOLATION
- Publication number 20250113560
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS
- Publication number 20250112121
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OFFSET GATE CONTACT
- Publication number 20250107205
- Publication date Mar 27, 2025
- International Business Machines Corporation
- Albert M. Chu
Information Patent Application
BACKSIDE RESISTOR CONNECTED TO BACKSIDE BACK END OF LINE NETWORK
- Publication number 20250098288
- Publication date Mar 20, 2025
- International Business Machines Corporation
- JENS HAETTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TIP-TO-TIP SCALING
- Publication number 20250096132
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE OFFSET GATE CONTACT FOR BACKSIDE SPACING
- Publication number 20250096074
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK
- Publication number 20250096126
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Dan Moy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED CIRCUIT CONNECTIONS
- Publication number 20250089336
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH SELF-ALIGNED OFFSET GATE CONTACT AND DIRECT BACKSIDE...
- Publication number 20250081581
- Publication date Mar 6, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET WITH BOTTOM EPI SIZE CONTROL AND WRAPAROUND BACKSIDE CO...
- Publication number 20250062190
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL TRAPPED METAL CONTACT FOR STACKED FET
- Publication number 20250063795
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE TRACKPLAN FOR POWER DELIVERY
- Publication number 20250054863
- Publication date Feb 13, 2025
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Formation With Staggered Gate Patterning
- Publication number 20250040184
- Publication date Jan 30, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHARED SOURCE/DRAIN CONTACT FOR STACKED TRANSISTORS
- Publication number 20250040199
- Publication date Jan 30, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE LOCAL INTERCONNECT
- Publication number 20250022795
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- Publication number 20250006664
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- Publication number 20250006590
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR
- Publication number 20250006629
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET WITH LOW PARASITIC-CAPACITANCE GATE
- Publication number 20250006786
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Crackstop Interweave Architectural Design Using S...
- Publication number 20250006658
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH CHANGE BETWEEN METAL LINES
- Publication number 20250006638
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- Publication number 20250006663
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
- Publication number 20240429178
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED SELF-ALIGNED BACKSIDE CONTACT
- Publication number 20240429098
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Albert M. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR BACKSIDE SIGNAL AND POWER
- Publication number 20240421087
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT LAYOUTS WITH STAGGERED GATE AND SOURCE/DRAIN REGIONS
- Publication number 20240421145
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Carl Radens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR STRUCTURES WITH HYBRID GATE PITCH
- Publication number 20240421156
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED GATE CUT REGION
- Publication number 20240420959
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES WITH BACKSIDE CONTACTS
- Publication number 20240421038
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS

Brent A. Anderson

Person

Patents Grantslast 30 patents

High aspect ratio contact structure with multiple metal stacks

Backside power rails and power distribution network for density sca...

Buried power rail formation for vertical field effect transistors

Single-mask alternating line deposition

Self-aligning spacer tight pitch via

Backside electrical contacts to buried power rails

Isolation region fabrication for replacement gate processing

Semiconductor device with early buried power rail (BPR) and backsid...

Heat pipe for vertically stacked field effect transistors

Self-aligned metal gate with poly silicide for vertical transport f...

Buried power rail contact

Ultra-short-height standard cell architecture

Top via interconnect having a line with a reduced bottom dimension

Interconnects having spacers for improved top via critical dimensio...

Backside power rail integration

Sacrificial fin for self-aligned contact rail formation

Top via with damascene line and via

Top via process with damascene metal

Vertical FET with contact to gate above active fin

Advanced metal interconnects with a replacement metal

Buried contact through fin-to-fin space for vertical transport fiel...

Top via with next level line selective growth

Top via cut fill process for line extension reduction

Conductive lines with subtractive cuts

VTFET with buried power rails

Dummy fin template to form a self-aligned metal contact for output...

Method of forming first and second contacts self-aligned top source...

Stepped top via for via resistance reduction

Interconnects on multiple sides of a semiconductor structure

Top via stack

Patents Applicationslast 30 patents

CUT SHAPES FOR BACKSIDE METALS

FIELD-EFFECT TRANSISTOR CRESCENT-SHAPED DIELECTRIC ISOLATION

ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS

SEMICONDUCTOR DEVICE WITH OFFSET GATE CONTACT

BACKSIDE RESISTOR CONNECTED TO BACKSIDE BACK END OF LINE NETWORK

METAL TIP-TO-TIP SCALING

BACKSIDE OFFSET GATE CONTACT FOR BACKSIDE SPACING

BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK

DUAL SIDED CIRCUIT CONNECTIONS

STRUCTURE WITH SELF-ALIGNED OFFSET GATE CONTACT AND DIRECT BACKSIDE...

STACKED FET WITH BOTTOM EPI SIZE CONTROL AND WRAPAROUND BACKSIDE CO...

LOCAL TRAPPED METAL CONTACT FOR STACKED FET

FLEXIBLE TRACKPLAN FOR POWER DELIVERY

Contact Formation With Staggered Gate Patterning

SHARED SOURCE/DRAIN CONTACT FOR STACKED TRANSISTORS

BACKSIDE LOCAL INTERCONNECT

THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL

DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE

DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR

STACKED FET WITH LOW PARASITIC-CAPACITANCE GATE

Three Dimensional Crackstop Interweave Architectural Design Using S...

PITCH CHANGE BETWEEN METAL LINES

DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING

MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES

MERGED SELF-ALIGNED BACKSIDE CONTACT

STRUCTURE FOR BACKSIDE SIGNAL AND POWER

CIRCUIT LAYOUTS WITH STAGGERED GATE AND SOURCE/DRAIN REGIONS

STACKED TRANSISTOR STRUCTURES WITH HYBRID GATE PITCH

INVERTED GATE CUT REGION

STACKED DEVICES WITH BACKSIDE CONTACTS