Chiu Ting

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Spatially-arranged chemical processing station
- Patent number 6,939,403
- Issue date Sep 6, 2005
- Blue29, LLC
- Igor Ivanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution composition and method for electroless deposition of coati...
- Patent number 6,911,067
- Issue date Jun 28, 2005
- Blue29, LLC
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Activation-free electroless solution for deposition of cobalt and m...
- Patent number 6,902,605
- Issue date Jun 7, 2005
- Blue29, LLC
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for electroless deposition of phosphorus-containing metal fi...
- Patent number 6,794,288
- Issue date Sep 21, 2004
- Blue29 Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallized interconnection structure
- Patent number 6,492,722
- Issue date Dec 10, 2002
- Advanced Micro Devices, Inc.
- Robin W. Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical methods for polishing copper films on semiconductor...
- Patent number 6,402,592
- Issue date Jun 11, 2002
- Steag Cutek Systems, Inc.
- Mei Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for depositing and/or removing material on a substrate
- Patent number 6,365,025
- Issue date Apr 2, 2002
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper-aluminum metallization
- Patent number 6,271,591
- Issue date Aug 7, 2001
- Advanced Micro Devices, Inc.
- Valery Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple station processing chamber and method for depositing and/o...
- Patent number 6,187,152
- Issue date Feb 13, 2001
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for the disposal of processing fluid used to d...
- Patent number 6,183,611
- Issue date Feb 6, 2001
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Introducing and reclaiming liquid in a wafer processing chamber
- Patent number 6,179,982
- Issue date Jan 30, 2001
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metallized interconnection structure and method of making the same
- Patent number 6,153,521
- Issue date Nov 28, 2000
- Advanced Micro Devices, Inc.
- Robin W. Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotating anode for a wafer processing chamber
- Patent number 6,077,412
- Issue date Jun 20, 2000
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method utilizing an electrode adapter for customized...
- Patent number 6,022,465
- Issue date Feb 8, 2000
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated vacuum and plating cluster system
- Patent number 6,017,820
- Issue date Jan 25, 2000
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process chamber and method for depositing and/or removing material...
- Patent number 6,017,437
- Issue date Jan 25, 2000
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper replenishment technique for precision copper plating system
- Patent number 5,997,712
- Issue date Dec 7, 1999
- Cutek Research, Inc.
- Chiu H. Ting
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Pulse electroplating copper or copper alloys
- Patent number 5,972,192
- Issue date Oct 26, 1999
- Advanced Micro Devices, Inc.
- Valery Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plated copper interconnect structure
- Patent number 5,969,422
- Issue date Oct 19, 1999
- Advanced Micro Devices, Inc.
- Chiu Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating copper-aluminum metallization
- Patent number 5,913,147
- Issue date Jun 15, 1999
- Advanced Micro Devices, Inc.
- Valery Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless CU deposition on a barrier layer by CU contact displace...
- Patent number 5,891,513
- Issue date Apr 6, 1999
- Cornell Research Foundation
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sealed semiconductor chip and process for fabricating sealed semico...
- Patent number 5,856,705
- Issue date Jan 5, 1999
- Intel Corporation
- Chiu H. Ting
- G11 - INFORMATION STORAGE
Information Patent Grant
Electroless deposition equipment or apparatus and method of perform...
- Patent number 5,830,805
- Issue date Nov 3, 1998
- Cornell Research Foundation
- Yosi Shacham-Diamand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Protected encapsulation of catalytic layer for electroless copper i...
- Patent number 5,824,599
- Issue date Oct 20, 1998
- Cornell Research Foundation, Inc.
- Yosef Schacham-Diamand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed semiconductor chip
- Patent number 5,742,094
- Issue date Apr 21, 1998
- Intel Corporation
- Chiu H. Ting
- G11 - INFORMATION STORAGE
Information Patent Grant
Use of cobalt tungsten phosphide as a barrier material for copper m...
- Patent number 5,695,810
- Issue date Dec 9, 1997
- Cornell Research Foundation, Inc.
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective electroless copper deposited interconnect plugs for ULSI...
- Patent number 5,674,787
- Issue date Oct 7, 1997
- Sematech, Inc.
- Bin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating sealed semiconductor chip using silicon nit...
- Patent number 5,300,461
- Issue date Apr 5, 1994
- Intel Corporation
- Chiu H. Ting
- G11 - INFORMATION STORAGE
Information Patent Grant
Fully planar metalization process
- Patent number 5,183,795
- Issue date Feb 2, 1993
- Intel Corporation
- Chiu H. Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless deposition for IC fabrication
- Patent number 5,169,680
- Issue date Dec 8, 1992
- Intel Corporation
- Chiu H. Ting
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Spatially-arranged chemical processing station
- Publication number 20070051306
- Publication date Mar 8, 2007
- Igor C. Ivanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier enhancement process for copper interconnects
- Publication number 20060076244
- Publication date Apr 13, 2006
- Mattson Technology, Inc.
- Chiu H. Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Activation-free electroless solution for deposition of cobalt and m...
- Publication number 20040175509
- Publication date Sep 9, 2004
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Solution composition and method for electroless deposition of coati...
- Publication number 20040134375
- Publication date Jul 15, 2004
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Spatially-arranged chemical processing station
- Publication number 20040094087
- Publication date May 20, 2004
- Igor Ivanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier enhancement process for copper interconnects
- Publication number 20030010645
- Publication date Jan 16, 2003
- Mattson Technology, Inc.
- Chiu H. Ting
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Spatially-arranged chemical processing station

Solution composition and method for electroless deposition of coati...

Activation-free electroless solution for deposition of cobalt and m...

Method for electroless deposition of phosphorus-containing metal fi...

Metallized interconnection structure

Electrochemical methods for polishing copper films on semiconductor...

Method for depositing and/or removing material on a substrate

Copper-aluminum metallization

Multiple station processing chamber and method for depositing and/o...

Method and apparatus for the disposal of processing fluid used to d...

Introducing and reclaiming liquid in a wafer processing chamber

Metallized interconnection structure and method of making the same

Rotating anode for a wafer processing chamber

Apparatus and method utilizing an electrode adapter for customized...

Integrated vacuum and plating cluster system

Process chamber and method for depositing and/or removing material...

Copper replenishment technique for precision copper plating system

Pulse electroplating copper or copper alloys

Plated copper interconnect structure

Method for fabricating copper-aluminum metallization

Electroless CU deposition on a barrier layer by CU contact displace...

Sealed semiconductor chip and process for fabricating sealed semico...

Electroless deposition equipment or apparatus and method of perform...

Protected encapsulation of catalytic layer for electroless copper i...

Sealed semiconductor chip

Use of cobalt tungsten phosphide as a barrier material for copper m...

Selective electroless copper deposited interconnect plugs for ULSI...

Process for fabricating sealed semiconductor chip using silicon nit...

Fully planar metalization process

Electroless deposition for IC fabrication

Patents Applicationslast 30 patents

Spatially-arranged chemical processing station

Barrier enhancement process for copper interconnects

Activation-free electroless solution for deposition of cobalt and m...

Solution composition and method for electroless deposition of coati...

Spatially-arranged chemical processing station

Barrier enhancement process for copper interconnects