Choon Muah Lee

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 11,367,667
- Issue date Jun 21, 2022
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 11,239,128
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-encapsulated lead frames for microelectronic device packages, a...
- Patent number 11,189,548
- Issue date Nov 30, 2021
- Micron Technology, Inc.
- Ai-Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 10,593,607
- Issue date Mar 17, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device assemblies including conductive vias having two o...
- Patent number 10,448,509
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- David J. Corisis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,431,513
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,211,114
- Issue date Feb 19, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,008,468
- Issue date Jun 26, 2018
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,768,121
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-encapsulated lead frames for microelectronic device packages, a...
- Patent number 9,721,874
- Issue date Aug 1, 2017
- Micron Technology, Inc.
- Ai Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices
- Patent number 9,640,458
- Issue date May 2, 2017
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 9,530,748
- Issue date Dec 27, 2016
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaged integrated circuit devices, and methods of making...
- Patent number 9,362,260
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,362,141
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 9,355,994
- Issue date May 31, 2016
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 9,147,623
- Issue date Sep 29, 2015
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making an interposer structure with embedded capacitor s...
- Patent number 9,142,427
- Issue date Sep 22, 2015
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device assemblies including conductive vias having two o...
- Patent number 9,084,360
- Issue date Jul 14, 2015
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic devices recessed in support member cavitie...
- Patent number 8,975,745
- Issue date Mar 10, 2015
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaged integrated circuit devices, and methods of making...
- Patent number 8,963,302
- Issue date Feb 24, 2015
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 8,940,581
- Issue date Jan 27, 2015
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor device assemblies including...
- Patent number 8,927,332
- Issue date Jan 6, 2015
- Micron Technology, Inc.
- Swee Seng Eric Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making microelectronic die systems
- Patent number 8,869,387
- Issue date Oct 28, 2014
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices
- Patent number 8,823,159
- Issue date Sep 2, 2014
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 8,803,307
- Issue date Aug 12, 2014
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array semiconductor device packages
- Patent number 8,796,836
- Issue date Aug 5, 2014
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging microelectronic devices and microelectronic d...
- Patent number 8,772,947
- Issue date Jul 8, 2014
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 8,754,537
- Issue date Jun 17, 2014
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution elements and semiconductor device packages including...
- Patent number 8,749,050
- Issue date Jun 10, 2014
- Micron Technology, Inc.
- Choon Kuan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer structure with embedded capacitor structure, and methods...
- Patent number 8,653,625
- Issue date Feb 18, 2014
- MicronTechnology, Inc.
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR FORMING AN OVERCOAT
- Publication number 20230419994
- Publication date Dec 28, 2023
- Nanyang Technological University
- Rajdeep Singh RAWAT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...
- Publication number 20230005802
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20200286801
- Publication date Sep 10, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20190371693
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20180005909
- Publication date Jan 4, 2018
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20170301598
- Publication date Oct 19, 2017
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ENCAPSULATED LEAD FRAMES FOR MICROELECTRONIC DEVICE PACKAGES, A...
- Publication number 20170288177
- Publication date Oct 5, 2017
- Micron Technology, Inc.
- Ai Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...
- Publication number 20170271228
- Publication date Sep 21, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20170103961
- Publication date Apr 13, 2017
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20160358831
- Publication date Dec 8, 2016
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20160247737
- Publication date Aug 25, 2016
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE ASSEMBLIES INCLUDING CONDUCTIVE VIAS HAVING TWO O...
- Publication number 20150319860
- Publication date Nov 5, 2015
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING...
- Publication number 20150171061
- Publication date Jun 18, 2015
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20150137364
- Publication date May 21, 2015
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20150130081
- Publication date May 14, 2015
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAMES CONF...
- Publication number 20150041204
- Publication date Feb 12, 2015
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20140346683
- Publication date Nov 27, 2014
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20140295622
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MAKING AN INTERPOSER STRUCTURE WITH EMBEDDED CAPACITOR S...
- Publication number 20140162412
- Publication date Jun 12, 2014
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION ELEMENTS AND SEMICONDUCTOR DEVICE PACKAGES INCLUDING...
- Publication number 20130292810
- Publication date Nov 7, 2013
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20130292853
- Publication date Nov 7, 2013
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20130292854
- Publication date Nov 7, 2013
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING...
- Publication number 20130256853
- Publication date Oct 3, 2013
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20130252354
- Publication date Sep 26, 2013
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES RECESSED IN SUPPORT MEMBER CAVITIE...
- Publication number 20130249092
- Publication date Sep 26, 2013
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE ASSEMBLIES INCLUDING CONDUCTIVE VIAS HAVING TWO O...
- Publication number 20130235517
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- David J. Corisis
- G01 - MEASURING TESTING
Information Patent Application
PRE-ENCAPSULATED LEAD FRAMES FOR MICROELECTRONIC DEVICE PACKAGES, A...
- Publication number 20130127027
- Publication date May 23, 2013
- Micron Technology, Inc.
- Ai Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING...
- Publication number 20130115734
- Publication date May 9, 2013
- Micron Technology, Inc.
- Swee Seng Eric Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PACKAGING MICROELECTRONIC DEVICES AND MICROELECTRONIC D...
- Publication number 20120248626
- Publication date Oct 4, 2012
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20120187567
- Publication date Jul 26, 2012
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Choon Muah Lee

Person

Patents Grantslast 30 patents

Build-up package for integrated circuit devices, and methods of mak...

Microelectronic devices, stacked microelectronic devices, and metho...

Pre-encapsulated lead frames for microelectronic device packages, a...

Build-up package for integrated circuit devices, and methods of mak...

Electronic device assemblies including conductive vias having two o...

Microelectronic devices, stacked microelectronic devices, and metho...

Microelectronic devices, stacked microelectronic devices, and metho...

Packaged microelectronic devices and methods for manufacturing pack...

Microelectronic devices, stacked microelectronic devices, and metho...

Pre-encapsulated lead frames for microelectronic device packages, a...

Stacked microelectronic devices

Packaged microelectronic devices and methods for manufacturing pack...

Stacked packaged integrated circuit devices, and methods of making...

Microelectronic devices, stacked microelectronic devices, and metho...

Build-up package for integrated circuit devices, and methods of mak...

Stacked microelectronic devices and methods for manufacturing stack...

Methods of making an interposer structure with embedded capacitor s...

Electronic device assemblies including conductive vias having two o...

Packaged microelectronic devices recessed in support member cavitie...

Stacked packaged integrated circuit devices, and methods of making...

Packaged microelectronic devices and methods for manufacturing pack...

Methods of manufacturing semiconductor device assemblies including...

Methods for making microelectronic die systems

Stacked microelectronic devices

Stacked microelectronic devices and methods for manufacturing stack...

Land grid array semiconductor device packages

Methods for packaging microelectronic devices and microelectronic d...

Build-up package for integrated circuit devices, and methods of mak...

Redistribution elements and semiconductor device packages including...

Interposer structure with embedded capacitor structure, and methods...

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR FORMING AN OVERCOAT

BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

PRE-ENCAPSULATED LEAD FRAMES FOR MICROELECTRONIC DEVICE PACKAGES, A...

CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

ELECTRONIC DEVICE ASSEMBLIES INCLUDING CONDUCTIVE VIAS HAVING TWO O...

STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

MICROELECTRONIC PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAMES CONF...

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

METHODS OF MAKING AN INTERPOSER STRUCTURE WITH EMBEDDED CAPACITOR S...

REDISTRIBUTION ELEMENTS AND SEMICONDUCTOR DEVICE PACKAGES INCLUDING...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

PACKAGED MICROELECTRONIC DEVICES RECESSED IN SUPPORT MEMBER CAVITIE...

ELECTRONIC DEVICE ASSEMBLIES INCLUDING CONDUCTIVE VIAS HAVING TWO O...

PRE-ENCAPSULATED LEAD FRAMES FOR MICROELECTRONIC DEVICE PACKAGES, A...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING...

METHODS FOR PACKAGING MICROELECTRONIC DEVICES AND MICROELECTRONIC D...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...