David V. Caletka

Person

Apalachin, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
High speed interposer
- Patent number 7,875,811
- Issue date Jan 25, 2011
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to accommodate increase in volume expansion during solder re...
- Patent number 7,703,199
- Issue date Apr 27, 2010
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed interposer
- Patent number 7,629,541
- Issue date Dec 8, 2009
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making wirebond electronic package with enhanced chip pad...
- Patent number 7,510,912
- Issue date Mar 31, 2009
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive alignment of VCSELs to waveguides in opto-electronic cards...
- Patent number 7,499,614
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Eric A. Johnson
- G02 - OPTICS
Information Patent Grant
Wafer scale thin film package
- Patent number 7,348,261
- Issue date Mar 25, 2008
- International Business Machines Corporation
- David Vincent Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wirebond electronic package with enhanced chip pad design, method o...
- Patent number 7,253,518
- Issue date Aug 7, 2007
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of accommodating in volume expansion during solder reflow
- Patent number 7,086,147
- Issue date Aug 8, 2006
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and method of forming
- Patent number 6,933,619
- Issue date Aug 23, 2005
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially captured oriented interconnections for BGA packages and a...
- Patent number 6,913,948
- Issue date Jul 5, 2005
- International Business Machines Corporation
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array stiffener for use with flexible chip carriers
- Patent number 6,905,961
- Issue date Jun 14, 2005
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially captured oriented interconnections for BGA packages and a...
- Patent number 6,774,474
- Issue date Aug 10, 2004
- International Business Machines Corporation
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced electrical/mechanical connection for electronic devices
- Patent number 6,695,623
- Issue date Feb 24, 2004
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure to accommodate increase in volume expansion during solder...
- Patent number 6,686,664
- Issue date Feb 3, 2004
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a reliable solder joint interconnection
- Patent number 6,672,500
- Issue date Jan 6, 2004
- International Business Machines Corporation
- David V. Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Negative volume expansion lead-free electrical connection
- Patent number 6,649,833
- Issue date Nov 18, 2003
- International Business Machines Corporation
- David V. Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer scale thin film package
- Patent number 6,627,998
- Issue date Sep 30, 2003
- International Business Machines Corporation
- David Vincent Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planarized plastic package modules for integrated circuits
- Patent number 6,603,195
- Issue date Aug 5, 2003
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer member having apertures for relieving stress and increas...
- Patent number 6,595,784
- Issue date Jul 22, 2003
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming BGA interconnections having mixed solder profiles
- Patent number 6,541,857
- Issue date Apr 1, 2003
- International Business Machines Corporation
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array stiffener use with flexible chip carriers
- Patent number 6,528,892
- Issue date Mar 4, 2003
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming
- Patent number 6,507,116
- Issue date Jan 14, 2003
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual purpose ribbon cable
- Patent number 6,433,283
- Issue date Aug 13, 2002
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced and mechanically balanced flip chip package and...
- Patent number 6,410,988
- Issue date Jun 25, 2002
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface profiling in electronic packages for reducing thermally ind...
- Patent number 6,333,551
- Issue date Dec 25, 2001
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a reliable BGA solder joint interconnection
- Patent number 6,293,455
- Issue date Sep 25, 2001
- International Business Machines Corporation
- David V. Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming BGA interconnections having mixed solder profiles
- Patent number 6,274,474
- Issue date Aug 14, 2001
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual purpose ribbon cable
- Patent number 6,268,567
- Issue date Jul 31, 2001
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a reliable BGA solder joint interconnection
- Patent number 6,138,893
- Issue date Oct 31, 2000
- International Business Machines Corporation
- David V. Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced and mechanically balanced flip chip package and...
- Patent number 6,104,093
- Issue date Aug 15, 2000
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High speed interposer
- Publication number 20080142258
- Publication date Jun 19, 2008
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making high speed interposer
- Publication number 20080120835
- Publication date May 29, 2008
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER SCALE THIN FILM PACKAGE
- Publication number 20080119029
- Publication date May 22, 2008
- David Vincent Caletka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
High speed interposer
- Publication number 20070289773
- Publication date Dec 20, 2007
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making wirebond electronic package with enhanced chip pad...
- Publication number 20070254408
- Publication date Nov 1, 2007
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wirebond electronic package with enhanced chip pad design, method o...
- Publication number 20060284304
- Publication date Dec 21, 2006
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20060208030
- Publication date Sep 21, 2006
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Passive alignment of VCSELs to waveguides in opto-electronic cards...
- Publication number 20050089264
- Publication date Apr 28, 2005
- International Business Machines Corporation
- Eric A. Johnson
- G02 - OPTICS
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20040183094
- Publication date Sep 23, 2004
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Partially captured oriented interconnections for BGA packages and a...
- Publication number 20040099936
- Publication date May 27, 2004
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer scale thin film package
- Publication number 20030199121
- Publication date Oct 23, 2003
- David Vincent Caletka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Land grid array stiffener for use with flexible chip carriers
- Publication number 20030090000
- Publication date May 15, 2003
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package and method of forming
- Publication number 20030034569
- Publication date Feb 20, 2003
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array stiffener use with flexible chip carriers
- Publication number 20020180061
- Publication date Dec 5, 2002
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced electrical/mechanical connection for electronic devices
- Publication number 20020182900
- Publication date Dec 5, 2002
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer member having apertures for relieving stress and increas...
- Publication number 20020173175
- Publication date Nov 21, 2002
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20020158110
- Publication date Oct 31, 2002
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a reliable solder joint interconnection
- Publication number 20010045445
- Publication date Nov 29, 2001
- International Business Machines Corporation
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual purpose ribbon cable
- Publication number 20010020541
- Publication date Sep 13, 2001
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming BGA interconnections having mixed solder profiles
- Publication number 20010000925
- Publication date May 10, 2001
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS

David V. Caletka

Person

Patents Grantslast 30 patents

High speed interposer

Method to accommodate increase in volume expansion during solder re...

High speed interposer

Method of making wirebond electronic package with enhanced chip pad...

Passive alignment of VCSELs to waveguides in opto-electronic cards...

Wafer scale thin film package

Wirebond electronic package with enhanced chip pad design, method o...

Method of accommodating in volume expansion during solder reflow

Electronic package and method of forming

Partially captured oriented interconnections for BGA packages and a...

Land grid array stiffener for use with flexible chip carriers

Partially captured oriented interconnections for BGA packages and a...

Enhanced electrical/mechanical connection for electronic devices

Structure to accommodate increase in volume expansion during solder...

Method for producing a reliable solder joint interconnection

Negative volume expansion lead-free electrical connection

Wafer scale thin film package

Planarized plastic package modules for integrated circuits

Interposer member having apertures for relieving stress and increas...

Method of forming BGA interconnections having mixed solder profiles

Land grid array stiffener use with flexible chip carriers

Electronic package and method of forming

Dual purpose ribbon cable

Thermally enhanced and mechanically balanced flip chip package and...

Surface profiling in electronic packages for reducing thermally ind...

Method for producing a reliable BGA solder joint interconnection

Method of forming BGA interconnections having mixed solder profiles

Dual purpose ribbon cable

Method for producing a reliable BGA solder joint interconnection

Thermally enhanced and mechanically balanced flip chip package and...

Patents Applicationslast 30 patents

High speed interposer

Method of making high speed interposer

WAFER SCALE THIN FILM PACKAGE

High speed interposer

Method of making wirebond electronic package with enhanced chip pad...

Wirebond electronic package with enhanced chip pad design, method o...

Structure to accommodate increase in volume expansion during solder...

Passive alignment of VCSELs to waveguides in opto-electronic cards...

Structure to accommodate increase in volume expansion during solder...

Partially captured oriented interconnections for BGA packages and a...

Wafer scale thin film package

Land grid array stiffener for use with flexible chip carriers

Electronic package and method of forming

Land grid array stiffener use with flexible chip carriers

Enhanced electrical/mechanical connection for electronic devices

Interposer member having apertures for relieving stress and increas...

Structure to accommodate increase in volume expansion during solder...

Method for producing a reliable solder joint interconnection

Dual purpose ribbon cable

Method of forming BGA interconnections having mixed solder profiles