Ellis Chau

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,833,044
- Issue date Nov 10, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,593,643
- Issue date Mar 17, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BVA interposer
- Patent number 10,297,582
- Issue date May 21, 2019
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,062,661
- Issue date Aug 28, 2018
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a microelectronic assembly having conductive elem...
- Patent number 9,984,901
- Issue date May 29, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,761,558
- Issue date Sep 12, 2017
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,691,731
- Issue date Jun 27, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly for microelectronic packaging with bond el...
- Patent number 9,615,456
- Issue date Apr 4, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BVA interposer
- Patent number 9,502,390
- Issue date Nov 22, 2016
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package
- Patent number 9,349,672
- Issue date May 24, 2016
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,252,122
- Issue date Feb 2, 2016
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,224,717
- Issue date Dec 29, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 9,218,988
- Issue date Dec 22, 2015
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Grant
Flow underfill for microelectronic packages
- Patent number 9,196,581
- Issue date Nov 24, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedence controlled packages with metal sheet or 2-layer RDL
- Patent number 9,136,197
- Issue date Sep 15, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,105,483
- Issue date Aug 11, 2015
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,093,435
- Issue date Jul 28, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for microelectronic packaging with bond elements to encap...
- Patent number 9,095,074
- Issue date Jul 28, 2015
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,041,227
- Issue date May 26, 2015
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact camera modules with features for reducing Z-height and faci...
- Patent number 9,029,759
- Issue date May 12, 2015
- Nan Chang O-Film Optoelectronics Technology Ltd
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Impedance controlled packages with metal sheet or 2-layer rdl
- Patent number 8,981,579
- Issue date Mar 17, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 8,969,133
- Issue date Mar 3, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making wire bond vias and microelectronic package having...
- Patent number 8,940,630
- Issue date Jan 27, 2015
- Invensas Corporation
- Philip Damberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for microelectronic packaging with bond elements to encap...
- Patent number 8,878,353
- Issue date Nov 4, 2014
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 8,836,136
- Issue date Sep 16, 2014
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20240055393
- Publication date Feb 15, 2024
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20220375891
- Publication date Nov 24, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20220165703
- Publication date May 26, 2022
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package Assembly With Wire Bonds To Encapsulation Surface
- Publication number 20210050322
- Publication date Feb 18, 2021
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-package Assembly With Wire Bond Vias
- Publication number 20210035948
- Publication date Feb 4, 2021
- Invensas Corporation
- Ellis Chau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20200168579
- Publication date May 28, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20180350766
- Publication date Dec 6, 2018
- Tessera, Inc.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20170287733
- Publication date Oct 5, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20160211237
- Publication date Jul 21, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BVA INTERPOSER
- Publication number 20160079214
- Publication date Mar 17, 2016
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20160056058
- Publication date Feb 25, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...
- Publication number 20150334831
- Publication date Nov 19, 2015
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20150255424
- Publication date Sep 10, 2015
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20150091118
- Publication date Apr 2, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...
- Publication number 20150034371
- Publication date Feb 5, 2015
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPEDANCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL
- Publication number 20140291871
- Publication date Oct 2, 2014
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING WIRE BOND VIAS AND MICROELECTRONIC PACKAGE HAVING...
- Publication number 20140220744
- Publication date Aug 7, 2014
- Invensas Corporation
- Philip Damberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW UNDERFILL FOR MICROELECTRONIC PACKAGES
- Publication number 20140217584
- Publication date Aug 7, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20140213021
- Publication date Jul 31, 2014
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Application
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...
- Publication number 20140175671
- Publication date Jun 26, 2014
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BVA INTERPOSER
- Publication number 20140036454
- Publication date Feb 6, 2014
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130328219
- Publication date Dec 12, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compact Camera Module
- Publication number 20130270419
- Publication date Oct 17, 2013
- DigitalOptics Corporation
- Harpuneet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE
- Publication number 20130249116
- Publication date Sep 26, 2013
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20130203216
- Publication date Aug 8, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130200533
- Publication date Aug 8, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130095610
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130093087
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bonds to encapsulation surface

BVA interposer

Package-on-package assembly with wire bonds to encapsulation surface

Method for making a microelectronic assembly having conductive elem...

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bonds to encapsulation surface

Microelectronic assembly for microelectronic packaging with bond el...

BVA interposer

Microelectronic package

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bonds to encapsulation surface

Microelectronic packages and methods therefor

Flow underfill for microelectronic packages

Impedence controlled packages with metal sheet or 2-layer RDL

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bonds to encapsulation surface

Structure for microelectronic packaging with bond elements to encap...

Package-on-package assembly with wire bond vias

Compact camera modules with features for reducing Z-height and faci...

Impedance controlled packages with metal sheet or 2-layer rdl

Package-on-package assembly with wire bonds to encapsulation surface

Method of making wire bond vias and microelectronic package having...

Structure for microelectronic packaging with bond elements to encap...

Package-on-package assembly with wire bond vias

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Package-On-Package Assembly With Wire Bonds To Encapsulation Surface

Package-on-package Assembly With Wire Bond Vias

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

BVA INTERPOSER

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...

IMPEDANCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL

METHOD OF MAKING WIRE BOND VIAS AND MICROELECTRONIC PACKAGE HAVING...

FLOW UNDERFILL FOR MICROELECTRONIC PACKAGES

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...

BVA INTERPOSER

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Compact Camera Module

MICROELECTRONIC PACKAGE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS