Erick G. Walton

Person

So. Burlington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Void-free damascene copper deposition process and means of monitori...
- Patent number 7,678,258
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Panayotis Andricacos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplated copper interconnection structure, process for making...
- Patent number 7,227,265
- Issue date Jun 5, 2007
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing high performance copper inductors with bond...
- Patent number 7,207,096
- Issue date Apr 24, 2007
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing self-compensating resistors within an inte...
- Patent number 7,052,925
- Issue date May 30, 2006
- International Business Machines Corporation
- William J. Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roughened bonding pad and bonding wire surfaces for low pressure wi...
- Patent number 7,015,580
- Issue date Mar 21, 2006
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of a conductive material
- Patent number 6,605,534
- Issue date Aug 12, 2003
- International Business Machines Corporation
- Dean S. Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling chemical bath composition in a manufacturing...
- Patent number 6,471,845
- Issue date Oct 29, 2002
- International Business Machines Corporation
- John O. Dukovic
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multi-step potentiostatic/galvanostatic plating control
- Patent number 6,409,903
- Issue date Jun 25, 2002
- International Business Machines Corporation
- Dean S. Chung
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and method using a compressible contact
- Patent number 6,270,646
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Erick Gregory Walton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for slurry polishing
- Patent number 6,110,832
- Issue date Aug 29, 2000
- International Business Machines Corporation
- Clifford O. Morgan
- B24 - GRINDING POLISHING
Information Patent Grant
Fusible links formed on interconnects which are at least twice as l...
- Patent number 6,054,339
- Issue date Apr 25, 2000
- International Business Machines Corporation
- Richard A. Gilmour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry injection technique for chemical-mechanical polishing
- Patent number 5,997,392
- Issue date Dec 7, 1999
- International Business Machines Corporation
- Timothy S. Chamberlin
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with controlled release of desired micro-encapsulated...
- Patent number 5,876,266
- Issue date Mar 2, 1999
- International Business Machines Corporation
- Matthew Kilpatrick Miller
- B24 - GRINDING POLISHING
Information Patent Grant
Gas discharge devices including matrix materials with ionizable gas...
- Patent number 5,877,589
- Issue date Mar 2, 1999
- International Business Machines Corporation
- Clifford O. Morgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide strip that improves planarity
- Patent number 5,766,971
- Issue date Jun 16, 1998
- International Business Machines Corporation
- David C. Ahlgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fusible links with improved interconnect structure
- Patent number 5,760,674
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Richard A. Gilmour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array protection devices and method
- Patent number 5,723,898
- Issue date Mar 3, 1998
- International Business Machines Corp.
- Richard Alfred Gilmour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array protection devices and fabrication method
- Patent number 5,523,253
- Issue date Jun 4, 1996
- International Business Machines Corp.
- Richard A. Gilmour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array fuse damage protection devices and fabrication method
- Patent number 5,420,455
- Issue date May 30, 1995
- International Business Machines Corp.
- Richard A. Gilmour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarizing ladder-type silsequioxane polymer insulation layer
- Patent number 5,286,572
- Issue date Feb 15, 1994
- International Business Machines Corporation
- Donna J. Clodgo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming dual height solder interconnections
- Patent number 5,251,806
- Issue date Oct 12, 1993
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum bump, reworkable bump, and titanium nitride structure for...
- Patent number 5,134,460
- Issue date Jul 28, 1992
- International Business Machines Corporation
- Michael J. Brady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mass having conductive encapsulating arrangement
- Patent number 5,130,779
- Issue date Jul 14, 1992
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarizing ladder-type silsesquioxane polymer insulation layer
- Patent number 4,981,530
- Issue date Jan 1, 1991
- International Business Machines Corporation
- Donna J. Clodgo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chromium-titanium alloy
- Patent number 4,840,302
- Issue date Jun 20, 1989
- International Business Machines Corporation
- David A. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for a plasma-treated polysiloxane coating
- Patent number 4,723,978
- Issue date Feb 9, 1988
- International Business Machines Corporation
- Donna J. Clodgo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrierless high-temperature lift-off process
- Patent number 4,606,998
- Issue date Aug 19, 1986
- International Business Machines Corporation
- Donna J. Clodgo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND COMPOSITION FOR ELECTRO-CHEMICAL-MECHANICAL POLISHING
- Publication number 20100051474
- Publication date Mar 4, 2010
- Panayotis C. Andricacos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and composition for electro-chemical-mechanical polishing
- Publication number 20060163083
- Publication date Jul 27, 2006
- International Business Machines Corporation
- Panayotis C. Andricacos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SELF-COMPENSATING RESISTORS WITHIN AN INTE...
- Publication number 20050227449
- Publication date Oct 13, 2005
- International Business Machines Corporation
- William Joseph Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF HIGH PERFORMANCE COPPER INDUCTORS WITH BOND PADS
- Publication number 20050160575
- Publication date Jul 28, 2005
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Roughened bonding pad and bonding wire surfaces for low pressure wi...
- Publication number 20050112861
- Publication date May 26, 2005
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void-free damascene copper deposition process and means of monitori...
- Publication number 20050006242
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178078
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178077
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Erick G. Walton

Person

Patents Grantslast 30 patents

Void-free damascene copper deposition process and means of monitori...

Electroplated copper interconnection structure, process for making...

Method of manufacturing high performance copper inductors with bond...

Method for manufacturing self-compensating resistors within an inte...

Roughened bonding pad and bonding wire surfaces for low pressure wi...

Selective deposition of a conductive material

Method of controlling chemical bath composition in a manufacturing...

Multi-step potentiostatic/galvanostatic plating control

Electroplating apparatus and method using a compressible contact

Method and apparatus for slurry polishing

Fusible links formed on interconnects which are at least twice as l...

Slurry injection technique for chemical-mechanical polishing

Polishing pad with controlled release of desired micro-encapsulated...

Gas discharge devices including matrix materials with ionizable gas...

Oxide strip that improves planarity

Fusible links with improved interconnect structure

Array protection devices and method

Array protection devices and fabrication method

Array fuse damage protection devices and fabrication method

Planarizing ladder-type silsequioxane polymer insulation layer

Method of forming dual height solder interconnections

Aluminum bump, reworkable bump, and titanium nitride structure for...

Solder mass having conductive encapsulating arrangement

Planarizing ladder-type silsesquioxane polymer insulation layer

Chromium-titanium alloy

Method for a plasma-treated polysiloxane coating

Barrierless high-temperature lift-off process

Patents Applicationslast 30 patents

METHOD AND COMPOSITION FOR ELECTRO-CHEMICAL-MECHANICAL POLISHING

Method and composition for electro-chemical-mechanical polishing

METHOD FOR MANUFACTURING SELF-COMPENSATING RESISTORS WITHIN AN INTE...

INTEGRATION OF HIGH PERFORMANCE COPPER INDUCTORS WITH BOND PADS

Roughened bonding pad and bonding wire surfaces for low pressure wi...

Void-free damascene copper deposition process and means of monitori...

Electroplated copper interconnection structure, process for making...

Electroplated copper interconnection structure, process for making...