Girish A. Dixit

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Atomic layer etch and ion beam etch patterning
- Patent number 12,080,562
- Issue date Sep 3, 2024
- Lam Research Corporation
- Samantha Siamhwa Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soft landing nanolaminates for advanced patterning
- Patent number 10,192,742
- Issue date Jan 29, 2019
- Novellus Systems, Inc.
- Frank L. Pasquale
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Soft landing nanolaminates for advanced patterning
- Patent number 9,905,423
- Issue date Feb 27, 2018
- Novellus Systems, Inc.
- Frank L. Pasquale
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Soft landing nanolaminates for advanced patterning
- Patent number 9,390,909
- Issue date Jul 12, 2016
- Novellus Systems, Inc.
- Frank L. Pasquale
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for deposition and/or etch selectivity
- Patent number 8,858,763
- Issue date Oct 14, 2014
- Novellus Systems, Inc.
- Erich R. Klawuhn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self aligning non contact shadow ring process kit
- Patent number 8,342,119
- Issue date Jan 1, 2013
- Applied Materials, Inc.
- Joseph Yudovsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interfacial capping layers for interconnects
- Patent number 8,268,722
- Issue date Sep 18, 2012
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing UV and dielectric diffusion barrier interaction through th...
- Patent number 8,124,522
- Issue date Feb 28, 2012
- Novellus Systems, Inc.
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ternary tungsten-containing resistive thin films
- Patent number 8,062,977
- Issue date Nov 22, 2011
- Novellus Systems, Inc.
- Kaihan Ashtiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of doped copper seed layers having improved reliability
- Patent number 8,017,523
- Issue date Sep 13, 2011
- Novellus Systems, Inc.
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method, and medium for an endpoint detection scheme for cop...
- Patent number 7,848,839
- Issue date Dec 7, 2010
- Applied Materials, Inc.
- Ajoy Zutshi
- B24 - GRINDING POLISHING
Information Patent Grant
Compositionally graded titanium nitride film for diffusion barrier...
- Patent number 7,727,882
- Issue date Jun 1, 2010
- Novellus Systems, Inc.
- Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for deposition and/or etch selectivity
- Patent number 7,510,634
- Issue date Mar 31, 2009
- Novellus Systems, Inc.
- Erich R. Klawuhn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for reducing charge density on a dielectric co...
- Patent number 7,425,716
- Issue date Sep 16, 2008
- Applied Materials, Inc.
- Alexandros T. Demos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal encapsulation schemes
- Patent number 7,205,228
- Issue date Apr 17, 2007
- Applied Materials, Inc.
- Deenesh Padhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric materials to prevent photoresist poisoning
- Patent number 7,115,534
- Issue date Oct 3, 2006
- Applied Materials, Inc.
- Son Van Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post treatment of low k dielectric films
- Patent number 7,018,941
- Issue date Mar 28, 2006
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step magnetron sputtering process
- Patent number 6,991,709
- Issue date Jan 31, 2006
- Applied Materials, Inc.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electropolishing of metallic interconnects
- Patent number 6,951,599
- Issue date Oct 4, 2005
- Applied Materials, Inc.
- Joseph Yahalom
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of application of electrical biasing to enhance metal deposi...
- Patent number 6,913,680
- Issue date Jul 5, 2005
- Applied Materials, Inc.
- Bo Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless deposition method
- Patent number 6,905,622
- Issue date Jun 14, 2005
- Applied Materials, Inc.
- Deenesh Padhi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless deposition method
- Patent number 6,899,816
- Issue date May 31, 2005
- Applied Materials, Inc.
- Deenesh Padhi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for reducing organic depletion during non-proc...
- Patent number 6,878,245
- Issue date Apr 12, 2005
- Applied Materials, Inc.
- Srinivas Gandikota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for removing electrolyte from electrical contacts and wafer...
- Patent number 6,869,516
- Issue date Mar 22, 2005
- Applied Materials, Inc.
- Dmitry Lubomirsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating system
- Patent number 6,824,612
- Issue date Nov 30, 2004
- Applied Materials, Inc.
- Joseph J. Stevens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless deposition method over sub-micron apertures
- Patent number 6,824,666
- Issue date Nov 30, 2004
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post rinse to improve selective deposition of electroless cobalt on...
- Patent number 6,821,909
- Issue date Nov 23, 2004
- Applied Materials, Inc.
- Sivakami Ramanathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods in electroanalytical techniques to analyze organic componen...
- Patent number 6,808,611
- Issue date Oct 26, 2004
- Applied Materials, Inc.
- Zhi-wen Sun
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for improved electroplating fill of an aperture
- Patent number 6,797,620
- Issue date Sep 28, 2004
- Applied Materials, Inc.
- John S. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Operating a magnetron sputter reactor in two modes
- Patent number 6,787,006
- Issue date Sep 7, 2004
- Applied Materials, Inc.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ATOMIC LAYER ETCH AND ION BEAM ETCH PATTERNING
- Publication number 20220254649
- Publication date Aug 11, 2022
- LAM RESEARCH CORPORATION
- Samantha SiamHwa TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUBBLE DEFECT REDUCTION
- Publication number 20220004103
- Publication date Jan 6, 2022
- LAM RESEARCH CORPORATION
- Akhil N. Singhal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOFT LANDING NANOLAMINATES FOR ADVANCED PATTERNING
- Publication number 20180158683
- Publication date Jun 7, 2018
- Novellus Systems, Inc.
- Frank L. Pasquale
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOFT LANDING NANOLAMINATES FOR ADVANCED PATTERNING
- Publication number 20160293418
- Publication date Oct 6, 2016
- Novellus Systems, Inc.
- Frank L. Pasquale
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOFT LANDING NANOLAMINATES FOR ADVANCED PATTERNING
- Publication number 20150126042
- Publication date May 7, 2015
- Novellus Systems, Inc.
- Frank L. Pasquale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACIAL CAPPING LAYERS FOR INTERCONNECTS
- Publication number 20100308463
- Publication date Dec 9, 2010
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatuses promoting adhesion of dielectric barrier fi...
- Publication number 20090011148
- Publication date Jan 8, 2009
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
System, method, and medium for an endpoint detection scheme for cop...
- Publication number 20080109104
- Publication date May 8, 2008
- Ajoy Zutshi
- B24 - GRINDING POLISHING
Information Patent Application
SELF ALIGNING NON CONTACT SHADOW RING PROCESS KIT
- Publication number 20080072823
- Publication date Mar 27, 2008
- Joseph Yudovsky
- C30 - CRYSTAL GROWTH
Information Patent Application
Controlled multi-step magnetron sputtering process
- Publication number 20070095654
- Publication date May 3, 2007
- Applied Materials, Inc.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Chemical mechanical polishing techniques for integrated circuit fab...
- Publication number 20070082479
- Publication date Apr 12, 2007
- APPLIED MATERIALS, INC.
- Deenesh Padhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit fabricating techniques employing sacrificial liners
- Publication number 20070082477
- Publication date Apr 12, 2007
- APPLIED MATERIALS, INC.
- Mehul Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for reducing charge density on a dielectric co...
- Publication number 20060192150
- Publication date Aug 31, 2006
- Applied Materials, Inc.
- Alexandros T. Demos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, method, and medium for an endpoint detection scheme for cop...
- Publication number 20060079007
- Publication date Apr 13, 2006
- Applied Materials, Inc.
- Ajoy Zutshi
- B24 - GRINDING POLISHING
Information Patent Application
Controlled multi-step magnetron sputtering process
- Publication number 20050255700
- Publication date Nov 17, 2005
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POST TREATMENT OF LOW K DIELECTRIC FILMS
- Publication number 20050239293
- Publication date Oct 27, 2005
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for reducing charge density on a dielectric co...
- Publication number 20050224722
- Publication date Oct 13, 2005
- Applied Materials, Inc.
- Alexandros T. Demos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatuses promoting adhesion of dielectric barrier fi...
- Publication number 20050186339
- Publication date Aug 25, 2005
- APPLIED MATERIALS, INC., A Delaware corporation
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Post rinse to improve selective deposition of electroless cobalt on...
- Publication number 20050136185
- Publication date Jun 23, 2005
- Sivakami Ramanathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-step magnetron sputtering process
- Publication number 20050056536
- Publication date Mar 17, 2005
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Dielectric materials to prevent photoresist poisoning
- Publication number 20050014361
- Publication date Jan 20, 2005
- Son Van Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective metal encapsulation schemes
- Publication number 20040248409
- Publication date Dec 9, 2004
- Applied Materials, Inc.
- Deenesh Padhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Homogeneous copper-palladium alloy plating for enhancement of elect...
- Publication number 20040118699
- Publication date Jun 24, 2004
- APPLIED MATERIALS, INC.
- Deenesh Padhi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Post rinse to improve selective deposition of electroless cobalt on...
- Publication number 20040087141
- Publication date May 6, 2004
- APPLIED MATERIALS, INC.
- Sivakami Ramanathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for removing electrolyte from electrical contacts and wafer...
- Publication number 20040074777
- Publication date Apr 22, 2004
- APPLIED MATERIALS, INC.
- Dmitry Lubomirsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ECP GAP FILL BY MODULATING THE VOLTAGE ON THE SEED LAYER TO INCREAS...
- Publication number 20040045831
- Publication date Mar 11, 2004
- APPLIED MATERIALS, INC.
- Bo Zheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Self aligning non contact shadow ring process kit
- Publication number 20040003780
- Publication date Jan 8, 2004
- APPLIED MATERIALS, INC.
- Joseph Yudovsky
- C30 - CRYSTAL GROWTH
Information Patent Application
Methods in electroanalytical techniques to analyze organic componen...
- Publication number 20040000484
- Publication date Jan 1, 2004
- APPLIED MATERIALS, INC.
- Zhi-wen Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Potential pulse-scan methods of analyzing organic additives in plat...
- Publication number 20030209440
- Publication date Nov 13, 2003
- APPLIED MATERIALS, INC.
- Zhi-Wen Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Planarization by chemical polishing for ULSI applications
- Publication number 20030209523
- Publication date Nov 13, 2003
- APPLIED MATERIALS, INC.
- Deenesh Padhi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Girish A. Dixit

Person

Patents Grantslast 30 patents

Atomic layer etch and ion beam etch patterning

Soft landing nanolaminates for advanced patterning

Soft landing nanolaminates for advanced patterning

Soft landing nanolaminates for advanced patterning

Apparatus and methods for deposition and/or etch selectivity

Self aligning non contact shadow ring process kit

Interfacial capping layers for interconnects

Reducing UV and dielectric diffusion barrier interaction through th...

Ternary tungsten-containing resistive thin films

Deposition of doped copper seed layers having improved reliability

System, method, and medium for an endpoint detection scheme for cop...

Compositionally graded titanium nitride film for diffusion barrier...

Apparatus and methods for deposition and/or etch selectivity

Method and apparatus for reducing charge density on a dielectric co...

Selective metal encapsulation schemes

Dielectric materials to prevent photoresist poisoning

Post treatment of low k dielectric films

Multi-step magnetron sputtering process

Electropolishing of metallic interconnects

Method of application of electrical biasing to enhance metal deposi...

Electroless deposition method

Electroless deposition method

Method and apparatus for reducing organic depletion during non-proc...

Method for removing electrolyte from electrical contacts and wafer...

Electroless plating system

Electroless deposition method over sub-micron apertures

Post rinse to improve selective deposition of electroless cobalt on...

Methods in electroanalytical techniques to analyze organic componen...

Method and apparatus for improved electroplating fill of an aperture

Operating a magnetron sputter reactor in two modes

Patents Applicationslast 30 patents

ATOMIC LAYER ETCH AND ION BEAM ETCH PATTERNING

BUBBLE DEFECT REDUCTION

SOFT LANDING NANOLAMINATES FOR ADVANCED PATTERNING

SOFT LANDING NANOLAMINATES FOR ADVANCED PATTERNING

SOFT LANDING NANOLAMINATES FOR ADVANCED PATTERNING

INTERFACIAL CAPPING LAYERS FOR INTERCONNECTS

Methods and apparatuses promoting adhesion of dielectric barrier fi...

System, method, and medium for an endpoint detection scheme for cop...

SELF ALIGNING NON CONTACT SHADOW RING PROCESS KIT

Controlled multi-step magnetron sputtering process

Chemical mechanical polishing techniques for integrated circuit fab...

Integrated circuit fabricating techniques employing sacrificial liners

Method and apparatus for reducing charge density on a dielectric co...

System, method, and medium for an endpoint detection scheme for cop...

Controlled multi-step magnetron sputtering process

POST TREATMENT OF LOW K DIELECTRIC FILMS

Method and apparatus for reducing charge density on a dielectric co...

Methods and apparatuses promoting adhesion of dielectric barrier fi...

Post rinse to improve selective deposition of electroless cobalt on...

Multi-step magnetron sputtering process

Dielectric materials to prevent photoresist poisoning

Selective metal encapsulation schemes

Homogeneous copper-palladium alloy plating for enhancement of elect...

Post rinse to improve selective deposition of electroless cobalt on...

Method for removing electrolyte from electrical contacts and wafer...

ECP GAP FILL BY MODULATING THE VOLTAGE ON THE SEED LAYER TO INCREAS...

Self aligning non contact shadow ring process kit

Methods in electroanalytical techniques to analyze organic componen...

Potential pulse-scan methods of analyzing organic additives in plat...

Planarization by chemical polishing for ULSI applications