Hidemichi Furihata

Person

Suwa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Piezoelectric element, liquid discharge head, and printer
- Patent number 11,312,137
- Issue date Apr 26, 2022
- Seiko Epson Corporation
- Kazuya Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric element, liquid discharge head, and printer
- Patent number 11,133,454
- Issue date Sep 28, 2021
- Seiko Epson Corporation
- Takayuki Yonemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric element, manufacturing method thereof, and liquid eje...
- Patent number 10,700,258
- Issue date Jun 30, 2020
- Seiko Epson Corporation
- Kazuya Kitada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Flow path component, liquid discharge head, and liquid discharge ap...
- Patent number 9,254,657
- Issue date Feb 9, 2016
- Seiko Epson Corporation
- Motoki Takabe
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid ejecting head, liquid ejecting apparatus, and piezoelectric...
- Patent number 8,636,343
- Issue date Jan 28, 2014
- Seiko Epson Corporation
- Hidemichi Furihata
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of manufacturing complex metal oxide powder and amorphous co...
- Patent number 8,012,449
- Issue date Sep 6, 2011
- Seiko Epson Corporation
- Takeshi Kijima
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of manufacturing an element substrate
- Patent number 7,966,720
- Issue date Jun 28, 2011
- Seiko Epson Corporation
- Toshihiko Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring substrate and method for manufactur...
- Patent number 7,604,835
- Issue date Oct 20, 2009
- Seiko Epson Corporation
- Hidemichi Furihata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Element substrate and method of manufacturing the same
- Patent number 7,597,813
- Issue date Oct 6, 2009
- Seiko Epson Corporation
- Toshihiko Kaneda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing wiring substrate
- Patent number 7,521,361
- Issue date Apr 21, 2009
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing interconnect substrate
- Patent number 7,488,678
- Issue date Feb 10, 2009
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing thin film transistor, method of manufacturi...
- Patent number 7,425,474
- Issue date Sep 16, 2008
- Seiko Epson Corporation
- Takeo Kawase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and electronic device
- Patent number 7,404,885
- Issue date Jul 29, 2008
- Seiko Epson Corporation
- Hidemichi Furihata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a thin film transistor, thin film transisto...
- Patent number 7,361,594
- Issue date Apr 22, 2008
- Seiko Epson Corporation
- Takeo Kawase
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing wiring substrate
- Patent number 7,305,761
- Issue date Dec 11, 2007
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing method of a master disc for optical discs and processing...
- Patent number 6,515,953
- Issue date Feb 4, 2003
- Seiko Epson Corporation
- Akira Miyamae
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
PIEZOELECTRIC ELEMENT, LIQUID DISCHARGE HEAD, AND PRINTER
- Publication number 20200324546
- Publication date Oct 15, 2020
- SEIKO EPSON CORPORATION
- Kazuya KITADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC ELEMENT, LIQUID DISCHARGE HEAD, AND PRINTER
- Publication number 20200274054
- Publication date Aug 27, 2020
- SEIKO EPSON CORPORATION
- Takayuki YONEMURA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Piezoelectric Element, Manufacturing Method Thereof, And Liquid Eje...
- Publication number 20190198747
- Publication date Jun 27, 2019
- SEIKO EPSON CORPORATION
- Kazuya KITADA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR PRODUCING PIEZOELECTRIC ELEMENT, PIEZOELECTRIC ELEMENT,...
- Publication number 20180076381
- Publication date Mar 15, 2018
- SEIKO EPSON CORPORATION
- Noboru FURUYA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
FLOW PATH COMPONENT, LIQUID DISCHARGE HEAD, AND LIQUID DISCHARGE AP...
- Publication number 20160059552
- Publication date Mar 3, 2016
- SEIKO EPSON CORPORATION
- Motoki TAKABE
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC...
- Publication number 20130155155
- Publication date Jun 20, 2013
- SEIKO EPSON CORPORATION
- Hidemichi FURIHATA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PLATED SUBSTRATE AND ITS FABRICATION METHOD
- Publication number 20080299356
- Publication date Dec 4, 2008
- SEIKO EPSON CORPORATION
- Toshihiko Kaneda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080274338
- Publication date Nov 6, 2008
- SEIKO EPSON CORPORATION
- Toshihiko KANEDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Element substrate and method of manufacturing the same
- Publication number 20080261026
- Publication date Oct 23, 2008
- Seiko Epson Corporation
- Toshihiko Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Element substrate and method of manufacturing the same
- Publication number 20080173471
- Publication date Jul 24, 2008
- Seiko Epson Corporation
- Toshihiko Kaneda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Element substrate and method of manufacturing the same
- Publication number 20080081154
- Publication date Apr 3, 2008
- Seiko Epson Corporation
- Toshihiko Kaneda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plated substrate and method of manufacturing the same
- Publication number 20080081155
- Publication date Apr 3, 2008
- Seiko Epson Corporation
- Toshihiko Kaneda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing complex metal oxide powder and amorphous co...
- Publication number 20080003161
- Publication date Jan 3, 2008
- Seiko Epson Corporation
- Takeshi Kijima
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Method of manufacturing interconnect substrate
- Publication number 20070218193
- Publication date Sep 20, 2007
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20070218191
- Publication date Sep 20, 2007
- SEIKO EPSON CORPORATION
- Hidemichi FURIHATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing interconnect substrate
- Publication number 20070218192
- Publication date Sep 20, 2007
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing interconnect substrate
- Publication number 20070212871
- Publication date Sep 13, 2007
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20070212876
- Publication date Sep 13, 2007
- SEIKO EPSON CORPORATION
- Satoshi KIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plating method and electronic device
- Publication number 20060231408
- Publication date Oct 19, 2006
- Seiko Epson Corporation
- Hidemichi Furihata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing wiring substrate and method for manufactur...
- Publication number 20050245004
- Publication date Nov 3, 2005
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing wiring substrate and method for manufactur...
- Publication number 20050218487
- Publication date Oct 6, 2005
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing wiring substrate and method for manufactur...
- Publication number 20050218110
- Publication date Oct 6, 2005
- Hidemichi Furihata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing thin film transistor, method of manufacturi...
- Publication number 20050186699
- Publication date Aug 25, 2005
- SEIKO EPSON CORPORATION
- Takeo Kawase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing wiring substrate and method for manufactur...
- Publication number 20050170622
- Publication date Aug 4, 2005
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing wiring substrate and method for manufactur...
- Publication number 20050170652
- Publication date Aug 4, 2005
- Hidemichi Furihata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing wiring substrate and method for manufactur...
- Publication number 20050170079
- Publication date Aug 4, 2005
- Hidemichi Furihata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing a thin film transistor, thin film transisto...
- Publication number 20050151195
- Publication date Jul 14, 2005
- SEIKO EPSON CORPORATION
- Takeo Kawase
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Hidemichi Furihata

Person

Patents Grantslast 30 patents

Piezoelectric element, liquid discharge head, and printer

Piezoelectric element, liquid discharge head, and printer

Piezoelectric element, manufacturing method thereof, and liquid eje...

Flow path component, liquid discharge head, and liquid discharge ap...

Liquid ejecting head, liquid ejecting apparatus, and piezoelectric...

Method of manufacturing complex metal oxide powder and amorphous co...

Method of manufacturing an element substrate

Method for manufacturing wiring substrate and method for manufactur...

Element substrate and method of manufacturing the same

Method for manufacturing wiring substrate

Method of manufacturing interconnect substrate

Method of manufacturing thin film transistor, method of manufacturi...

Plating method and electronic device

Method of manufacturing a thin film transistor, thin film transisto...

Method for manufacturing wiring substrate

Processing method of a master disc for optical discs and processing...

Patents Applicationslast 30 patents

PIEZOELECTRIC ELEMENT, LIQUID DISCHARGE HEAD, AND PRINTER

PIEZOELECTRIC ELEMENT, LIQUID DISCHARGE HEAD, AND PRINTER

Piezoelectric Element, Manufacturing Method Thereof, And Liquid Eje...

METHOD FOR PRODUCING PIEZOELECTRIC ELEMENT, PIEZOELECTRIC ELEMENT,...

FLOW PATH COMPONENT, LIQUID DISCHARGE HEAD, AND LIQUID DISCHARGE AP...

LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC...

PLATED SUBSTRATE AND ITS FABRICATION METHOD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Element substrate and method of manufacturing the same

Element substrate and method of manufacturing the same

Element substrate and method of manufacturing the same

Plated substrate and method of manufacturing the same

Method of manufacturing complex metal oxide powder and amorphous co...

Method of manufacturing interconnect substrate

METHOD FOR MANUFACTURING WIRING SUBSTRATE

Method of manufacturing interconnect substrate

Method of manufacturing interconnect substrate

METHOD FOR MANUFACTURING WIRING SUBSTRATE

Plating method and electronic device

Method for manufacturing wiring substrate and method for manufactur...

Method for manufacturing wiring substrate and method for manufactur...

Method for manufacturing wiring substrate and method for manufactur...

Method of manufacturing thin film transistor, method of manufacturi...

Method for manufacturing wiring substrate and method for manufactur...

Method for manufacturing wiring substrate and method for manufactur...

Method for manufacturing wiring substrate and method for manufactur...

Method of manufacturing a thin film transistor, thin film transisto...