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Hyeog Chan Kwon
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Seoul, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Adhesive/spacer island structure for multiple die package
Patent number
8,623,704
Issue date
Jan 7, 2014
ChipPAC, Inc.
Sang Ho Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive/spacer island structure for stacking over wire bonded die
Patent number
8,552,551
Issue date
Oct 8, 2013
ChipPAC, Inc.
Sang Ho Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing wafer scale heat slug system
Patent number
8,375,576
Issue date
Feb 19, 2013
Stats Chippac Ltd.
Hyeog Chan Kwon
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Integrated circuit package system including honeycomb molding
Patent number
8,217,501
Issue date
Jul 10, 2012
Stats Chippac Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuit and package system and method for manufa...
Patent number
8,102,043
Issue date
Jan 24, 2012
Stats Chippac Ltd.
Tae Sung Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with planar interconnects
Patent number
8,067,831
Issue date
Nov 29, 2011
Stats Chippac Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package-in-package system and method for making...
Patent number
8,049,322
Issue date
Nov 1, 2011
Stats Chippac Ltd.
Choong Bin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor package having adhesive/spacer structure and...
Patent number
8,030,134
Issue date
Oct 4, 2011
ChipPAC, Inc.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer scale heat slug system
Patent number
7,975,377
Issue date
Jul 12, 2011
Stats Chippac Ltd.
Hyeog Chan Kwon
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Multipackage module having stacked packages with asymmetrically arr...
Patent number
7,932,593
Issue date
Apr 26, 2011
Stats Chippac Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with carrier and method of manu...
Patent number
7,884,460
Issue date
Feb 8, 2011
Stats Chippac Ltd.
Choong Bin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuit and package system
Patent number
7,875,966
Issue date
Jan 25, 2011
Stats Chippac Ltd.
Tae Sung Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package-in-package system
Patent number
7,755,180
Issue date
Jul 13, 2010
Stats Chippac Ltd.
Choong Bin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system including honeycomb molding
Patent number
7,737,539
Issue date
Jun 15, 2010
Stats Chippac Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system including stacked die
Patent number
7,652,376
Issue date
Jan 26, 2010
Stats Chippac Ltd.
Soo-San Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multipackage module having stacked packages with asymmetrically arr...
Patent number
7,545,031
Issue date
Jun 9, 2009
Stats Chippac Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system
Patent number
7,501,697
Issue date
Mar 10, 2009
Stats Chippac Ltd.
Choong Bin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system including stacked die
Patent number
7,456,088
Issue date
Nov 25, 2008
Stats Chippac Ltd.
Soo-San Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip packaging method with individually placed film a...
Patent number
7,306,971
Issue date
Dec 11, 2007
Chippac Inc.
Jin-Wook Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package-in-package system
Patent number
7,288,835
Issue date
Oct 30, 2007
Stats Chippac Ltd.
Choong Bin Yim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR MANUFACTURING WAFER SCALE HEAT SLUG SYSTEM
Publication number
20110239459
Publication date
Oct 6, 2011
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUIT AND PACKAGE SYSTEM AND METHOD FOR MANUFA...
Publication number
20110108976
Publication date
May 12, 2011
Tae Sung Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING
Publication number
20100237488
Publication date
Sep 23, 2010
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM AND METHOD FOR MAKING...
Publication number
20100230796
Publication date
Sep 16, 2010
Choong Bin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPACKAGE MODULE HAVING STACKED PACKAGES WITH ASYMMETRICALLY ARR...
Publication number
20090218675
Publication date
Sep 3, 2009
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CARRIER AND METHOD OF MANU...
Publication number
20090134509
Publication date
May 28, 2009
Choong Bin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING STACKED DIE
Publication number
20090014899
Publication date
Jan 15, 2009
Soo-San Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
Publication number
20080006925
Publication date
Jan 10, 2008
Choong Bin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
Publication number
20070216010
Publication date
Sep 20, 2007
STATS ChipPAC Ltd.
Choong Bin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
Publication number
20070216005
Publication date
Sep 20, 2007
STATS ChipPAC Ltd.
Choong Bin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIE PACKAGING SYSTEM
Publication number
20070085184
Publication date
Apr 19, 2007
STATS ChipPAC Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Package having Adhesive/Spacer Structure and...
Publication number
20070018296
Publication date
Jan 25, 2007
ChipPAC, Inc.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adhesive/Spacer Island Structure for Multiple Die Package
Publication number
20070015314
Publication date
Jan 18, 2007
ChipPAC, Inc.
Sang Ho Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Package having Adhesive/Spacer Structure and...
Publication number
20070013060
Publication date
Jan 18, 2007
ChipPAC, Inc.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multipackage module having stacked packages with asymmetrically arr...
Publication number
20060226528
Publication date
Oct 12, 2006
STATS ChipPAC Ltd.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked integrated circuit and package system
Publication number
20060180911
Publication date
Aug 17, 2006
STATS ChipPAC Ltd.
Tae Sung Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked semiconductor package having adhesive/spacer structure and...
Publication number
20050269692
Publication date
Dec 8, 2005
ChipPAC, Inc.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adhesive/spacer island structure for stacking over wire bonded die
Publication number
20050269676
Publication date
Dec 8, 2005
ChipPAC, Inc.
Sang Ho Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multiple die package with adhesive/spacer structure and insulated d...
Publication number
20050258545
Publication date
Nov 24, 2005
ChipPAC, Inc.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adhesive/spacer island structure for multiple die package
Publication number
20050258527
Publication date
Nov 24, 2005
ChipPAC, Inc.
Sang Ho Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die with discrete spacers and die spacing method
Publication number
20050224959
Publication date
Oct 13, 2005
ChipPAC, Inc.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die to substrate attach using printed adhesive
Publication number
20050208700
Publication date
Sep 22, 2005
ChipPAC, Inc.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor chip packaging method with individually placed film a...
Publication number
20050208701
Publication date
Sep 22, 2005
ChipPAC, Inc.
Jin-Wook Jeong
H01 - BASIC ELECTRIC ELEMENTS