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Jae M. Park
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Fine pitch microcontacts and method for forming thereof
Patent number
8,641,913
Issue date
Feb 4, 2014
Tessera, Inc.
Belgacem Haba
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making a connection component with posts and pads
Patent number
8,604,348
Issue date
Dec 10, 2013
Tessera, Inc.
Yoichi Kubota
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Microelectronic package comprising offset conductive posts on compl...
Patent number
8,207,604
Issue date
Jun 26, 2012
Tessera, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a connection component with posts and pads
Patent number
8,046,912
Issue date
Nov 1, 2011
Tessera, Inc.
Yoichi Kubota
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stackable microelectronic device carriers, stacked device carriers...
Patent number
7,763,983
Issue date
Jul 27, 2010
Tessera, Inc.
Kenneth Allen Honer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate for a flexible microelectronic assembly and a method of f...
Patent number
7,659,617
Issue date
Feb 9, 2010
Tessera, Inc.
Teck-Gyu Kang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Components with posts and pads
Patent number
7,495,179
Issue date
Feb 24, 2009
Tessera, Inc.
Yoichi Kubota
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solid state lighting device
Patent number
7,397,068
Issue date
Jul 8, 2008
Tessera, Inc.
Jae M. Park
F21 - LIGHTING
Information
Patent Grant
Image sensor package and fabrication method
Patent number
7,368,695
Issue date
May 6, 2008
Tessera, Inc.
Teck-Gyu Kang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Microelectronic assemblies with springs
Patent number
7,304,376
Issue date
Dec 4, 2007
Tessers, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic connection components having bondable wires
Patent number
7,268,304
Issue date
Sep 11, 2007
Tessera, Inc.
Masud Beroz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High frequency chip packages with connecting elements
Patent number
7,176,506
Issue date
Feb 13, 2007
Tessera, Inc.
Masud Beroz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic packages with self-aligning features
Patent number
7,053,485
Issue date
May 30, 2006
Tessera, Inc.
Kyong-Mo Bang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Connection Component with Posts and Pads
Publication number
20140262460
Publication date
Sep 18, 2014
Tessera, Inc.
YOICHI KUBOTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF
Publication number
20140145329
Publication date
May 29, 2014
Tessera, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS
Publication number
20110260320
Publication date
Oct 27, 2011
Tessera, Inc.
Yoichi Kubota
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Components with posts and pads
Publication number
20090133254
Publication date
May 28, 2009
Tessera, Inc.
Yoichi Kubota
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Stackable microelectronic device carriers, stacked device carriers...
Publication number
20090008795
Publication date
Jan 8, 2009
Tessera, Inc.
Kenneth Allen Honer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic packages and methods therefor
Publication number
20080185705
Publication date
Aug 7, 2008
Tessera, Inc.
Philip R. Osborn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate for a flexible microelectronic assembly and a method of f...
Publication number
20080128886
Publication date
Jun 5, 2008
Tessera, Inc.
Teck-Gyu Kang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Fine pitch microcontacts and method for forming thereof
Publication number
20080003402
Publication date
Jan 3, 2008
Tessera, Inc.
Belgacem Haba
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
High frequency chip packages with connecting elements
Publication number
20070096160
Publication date
May 3, 2007
Tessera, Inc.
Masud Beroz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molding method for foldover package
Publication number
20060223227
Publication date
Oct 5, 2006
Tessera, Inc.
Yoichi Kubota
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Solid state lighting device
Publication number
20060038542
Publication date
Feb 23, 2006
Tessera, Inc.
Jae M. Park
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Components with posts and pads
Publication number
20050284658
Publication date
Dec 29, 2005
Tessera, Inc.
Yoichi Kubota
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Image sensor package and fabrication method
Publication number
20050279916
Publication date
Dec 22, 2005
Tessera, Inc.
Teck-Gyu Kang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Microelectronic connection components having bondable wires
Publication number
20050243529
Publication date
Nov 3, 2005
Tessera, Inc.
Masud Beroz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Micro pin grid array with wiping action
Publication number
20050181655
Publication date
Aug 18, 2005
Tessera, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package element and packaged chip having severable electrically con...
Publication number
20050139984
Publication date
Jun 30, 2005
Tessera, Inc.
David B. Tuckerman
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
Solid state lighting device
Publication number
20050133800
Publication date
Jun 23, 2005
Tessera, Inc.
Jae M. Park
F21 - LIGHTING
Information
Patent Application
Microelectronic assemblies with springs
Publication number
20050040540
Publication date
Feb 24, 2005
Tessera, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High frequency chip packages with connecting elements
Publication number
20040238857
Publication date
Dec 2, 2004
Tessera, Inc.
Masud Beroz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic packages with self-aligning features
Publication number
20040104470
Publication date
Jun 3, 2004
Tessera, Inc.
Kyong-Mo Bang
H01 - BASIC ELECTRIC ELEMENTS