Jae M. Park

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fine pitch microcontacts and method for forming thereof
- Patent number 8,641,913
- Issue date Feb 4, 2014
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a connection component with posts and pads
- Patent number 8,604,348
- Issue date Dec 10, 2013
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package comprising offset conductive posts on compl...
- Patent number 8,207,604
- Issue date Jun 26, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a connection component with posts and pads
- Patent number 8,046,912
- Issue date Nov 1, 2011
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable microelectronic device carriers, stacked device carriers...
- Patent number 7,763,983
- Issue date Jul 27, 2010
- Tessera, Inc.
- Kenneth Allen Honer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a flexible microelectronic assembly and a method of f...
- Patent number 7,659,617
- Issue date Feb 9, 2010
- Tessera, Inc.
- Teck-Gyu Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Components with posts and pads
- Patent number 7,495,179
- Issue date Feb 24, 2009
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid state lighting device
- Patent number 7,397,068
- Issue date Jul 8, 2008
- Tessera, Inc.
- Jae M. Park
- F21 - LIGHTING
Information Patent Grant
Image sensor package and fabrication method
- Patent number 7,368,695
- Issue date May 6, 2008
- Tessera, Inc.
- Teck-Gyu Kang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectronic assemblies with springs
- Patent number 7,304,376
- Issue date Dec 4, 2007
- Tessers, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic connection components having bondable wires
- Patent number 7,268,304
- Issue date Sep 11, 2007
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency chip packages with connecting elements
- Patent number 7,176,506
- Issue date Feb 13, 2007
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with self-aligning features
- Patent number 7,053,485
- Issue date May 30, 2006
- Tessera, Inc.
- Kyong-Mo Bang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS CHAMBER VACUUM SEAL LEAKAGE REDUCTION
- Publication number 20240344608
- Publication date Oct 17, 2024
- Applied Materials, Inc.
- Shashidhara Patel H B
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Connection Component with Posts and Pads
- Publication number 20140262460
- Publication date Sep 18, 2014
- Tessera, Inc.
- YOICHI KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF
- Publication number 20140145329
- Publication date May 29, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS
- Publication number 20110260320
- Publication date Oct 27, 2011
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Components with posts and pads
- Publication number 20090133254
- Publication date May 28, 2009
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stackable microelectronic device carriers, stacked device carriers...
- Publication number 20090008795
- Publication date Jan 8, 2009
- Tessera, Inc.
- Kenneth Allen Honer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20080185705
- Publication date Aug 7, 2008
- Tessera, Inc.
- Philip R. Osborn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for a flexible microelectronic assembly and a method of f...
- Publication number 20080128886
- Publication date Jun 5, 2008
- Tessera, Inc.
- Teck-Gyu Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fine pitch microcontacts and method for forming thereof
- Publication number 20080003402
- Publication date Jan 3, 2008
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High frequency chip packages with connecting elements
- Publication number 20070096160
- Publication date May 3, 2007
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding method for foldover package
- Publication number 20060223227
- Publication date Oct 5, 2006
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solid state lighting device
- Publication number 20060038542
- Publication date Feb 23, 2006
- Tessera, Inc.
- Jae M. Park
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Components with posts and pads
- Publication number 20050284658
- Publication date Dec 29, 2005
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Image sensor package and fabrication method
- Publication number 20050279916
- Publication date Dec 22, 2005
- Tessera, Inc.
- Teck-Gyu Kang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Microelectronic connection components having bondable wires
- Publication number 20050243529
- Publication date Nov 3, 2005
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro pin grid array with wiping action
- Publication number 20050181655
- Publication date Aug 18, 2005
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package element and packaged chip having severable electrically con...
- Publication number 20050139984
- Publication date Jun 30, 2005
- Tessera, Inc.
- David B. Tuckerman
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Solid state lighting device
- Publication number 20050133800
- Publication date Jun 23, 2005
- Tessera, Inc.
- Jae M. Park
- F21 - LIGHTING
Information Patent Application
Microelectronic assemblies with springs
- Publication number 20050040540
- Publication date Feb 24, 2005
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency chip packages with connecting elements
- Publication number 20040238857
- Publication date Dec 2, 2004
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic packages with self-aligning features
- Publication number 20040104470
- Publication date Jun 3, 2004
- Tessera, Inc.
- Kyong-Mo Bang
- H01 - BASIC ELECTRIC ELEMENTS

Jae M. Park

Person

Patents Grantslast 30 patents

Fine pitch microcontacts and method for forming thereof

Method of making a connection component with posts and pads

Microelectronic package comprising offset conductive posts on compl...

Method of making a connection component with posts and pads

Stackable microelectronic device carriers, stacked device carriers...

Substrate for a flexible microelectronic assembly and a method of f...

Components with posts and pads

Solid state lighting device

Image sensor package and fabrication method

Microelectronic assemblies with springs

Microelectronic connection components having bondable wires

High frequency chip packages with connecting elements

Microelectronic packages with self-aligning features

Patents Applicationslast 30 patents

PROCESS CHAMBER VACUUM SEAL LEAKAGE REDUCTION

Connection Component with Posts and Pads

FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF

METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS

Components with posts and pads

Stackable microelectronic device carriers, stacked device carriers...

Microelectronic packages and methods therefor

Substrate for a flexible microelectronic assembly and a method of f...

Fine pitch microcontacts and method for forming thereof

High frequency chip packages with connecting elements

Molding method for foldover package

Solid state lighting device

Components with posts and pads

Image sensor package and fabrication method

Microelectronic connection components having bondable wires

Micro pin grid array with wiping action

Package element and packaged chip having severable electrically con...

Solid state lighting device

Microelectronic assemblies with springs

High frequency chip packages with connecting elements

Microelectronic packages with self-aligning features