Johannes Stahr

Person

St. Lorenzen, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with surface-contactable component embedded in la...
- Patent number 12,165,940
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier-based device with antenna coupling of electronic...
- Patent number 11,799,198
- Issue date Oct 24, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mario Schober
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded magnetic inlay and integrated coil...
- Patent number 11,792,932
- Issue date Oct 17, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with a stepped cavity and a stepped component ass...
- Patent number 11,749,573
- Issue date Sep 5, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic optical component package having organic portion and inorg...
- Patent number 11,682,661
- Issue date Jun 20, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas Zluc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangement, component carrier and method of forming a c...
- Patent number 11,658,142
- Issue date May 23, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making contact with a component embedded in a printed ci...
- Patent number 11,523,520
- Issue date Dec 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 11,495,513
- Issue date Nov 8, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,324,122
- Issue date May 3, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with integrated antenna structure
- Patent number 11,264,708
- Issue date Mar 1, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Kristl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board structure
- Patent number 11,172,576
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with a stepped cavity and a stepped component ass...
- Patent number 11,049,778
- Issue date Jun 29, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising at least one heat pipe and method for...
- Patent number 10,867,888
- Issue date Dec 15, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Inductor made of component carrier material comprising electrically...
- Patent number 10,861,636
- Issue date Dec 8, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layer stack of component carrier material with embedded components...
- Patent number 10,863,631
- Issue date Dec 8, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of embedding a component in a printed circuit board
- Patent number 10,779,413
- Issue date Sep 15, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising at least one heat pipe and method for...
- Patent number 10,665,526
- Issue date May 26, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Methods of manufacturing flexible printed circuit boards
- Patent number 10,617,012
- Issue date Apr 7, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas Zluc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a circuit board element
- Patent number 10,426,040
- Issue date Sep 24, 2019
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor track with enlargement-free transition between conductor...
- Patent number 10,356,904
- Issue date Jul 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellshaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Efficient heat removal from component carrier with embedded diode
- Patent number 10,332,818
- Issue date Jun 25, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mike Morianz
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for the production of an electronic module having an electro...
- Patent number 10,283,680
- Issue date May 7, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gregor Langer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 10,219,384
- Issue date Feb 26, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making contact with a component embedded in a printed ci...
- Patent number 10,187,997
- Issue date Jan 22, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 10,165,685
- Issue date Dec 25, 2018
- Markus Leitgeb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printed circuit board consisting of at least two printed circuit bo...
- Patent number 9,980,380
- Issue date May 22, 2018
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Rainer Pludra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-finished product for the production of a printed circuit board...
- Patent number 9,781,845
- Issue date Oct 3, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board comprising an electronic component integrated...
- Patent number 9,674,960
- Issue date Jun 6, 2017
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board consisting of at least...
- Patent number 9,491,862
- Issue date Nov 8, 2016
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Rainer Pludra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier With Surface-Contactable Component Embedded in La...
- Publication number 20250062171
- Publication date Feb 20, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING UNIT COMPRISING AN INTEGRATED MAGNETIC FIELD SENSOR
- Publication number 20240329163
- Publication date Oct 3, 2024
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Gernot SCHULZ
- G01 - MEASURING TESTING
Information Patent Application
Electronic Package Comprising a Decoupling Layer Structure
- Publication number 20240030095
- Publication date Jan 25, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Andreas Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Electronic Components and Thermally Conducti...
- Publication number 20240014142
- Publication date Jan 11, 2024
- Mike Morianz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Magnetic Inlay and Integrated Coil...
- Publication number 20230298804
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Ivan Salkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductor Inlay for a Component Carrier and a Method of Manufacturin...
- Publication number 20230298808
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making Contact with a Component Embedded in a Printed Ci...
- Publication number 20230189448
- Publication date Jun 15, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Embedded Semiconductor Component and Embedde...
- Publication number 20230055435
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes STAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Magnetic Element, Magnetic Inlay, and Manufa...
- Publication number 20220377917
- Publication date Nov 24, 2022
- Johannes STAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier-Based Device With Antenna Coupling of Electronic...
- Publication number 20220140475
- Publication date May 5, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mario SCHOBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With a Stepped Cavity and a Stepped Component Ass...
- Publication number 20210280479
- Publication date Sep 9, 2021
- AT&S Austria Technology & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Magnetic Inlay and Integrated Coil...
- Publication number 20210195749
- Publication date Jun 24, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210112666
- Publication date Apr 15, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection Arrangement, Component Carrier and Method of Forming a C...
- Publication number 20210074662
- Publication date Mar 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210068252
- Publication date Mar 4, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inductor Made of Component Carrier Material Comprising Electrically...
- Publication number 20210050141
- Publication date Feb 18, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Surface-Contactable Component Embedded in La...
- Publication number 20200365477
- Publication date Nov 19, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hermetic Optical Component Package Having Organic Portion and Inorg...
- Publication number 20200365573
- Publication date Nov 19, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas ZLUC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Embedding a Component in a Printed Circuit Board
- Publication number 20200323081
- Publication date Oct 8, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Semiconductor Component and Embedde...
- Publication number 20200312737
- Publication date Oct 1, 2020
- AT&S Austria Technology & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Comprising at Least One Heat Pipe and Method for...
- Publication number 20200243417
- Publication date Jul 30, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Methods of Manufacturing Flexible Electronic Devices
- Publication number 20200205296
- Publication date Jun 25, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas ZLUC
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With a Stepped Cavity and a Stepped Component Ass...
- Publication number 20190378771
- Publication date Dec 12, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor Track With Enlargement-Free Transition Between Conductor...
- Publication number 20190306983
- Publication date Oct 3, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Layer Stack of Component Carrier Material With Embedded Components...
- Publication number 20190281706
- Publication date Sep 12, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for the Production of an Electronic Module Having an Electro...
- Publication number 20190221718
- Publication date Jul 18, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gregor Langer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Structure
- Publication number 20190150288
- Publication date May 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making Contact with a Component Embedded in a Printed Ci...
- Publication number 20190082543
- Publication date Mar 14, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Integrated Antenna Structure
- Publication number 20180277943
- Publication date Sep 27, 2018
- Thomas Kristl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF NONSTICK MATERIAL FOR THE PRODUCTION OF CAVITIES IN A PRINTE...
- Publication number 20180257364
- Publication date Sep 13, 2018
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Gerald Weidinger
- B32 - LAYERED PRODUCTS

Johannes Stahr

Person

Patents Grantslast 30 patents

Printed circuit board having embedded component

Component carrier with surface-contactable component embedded in la...

Component carrier-based device with antenna coupling of electronic...

Component carrier with embedded magnetic inlay and integrated coil...

Component carrier with a stepped cavity and a stepped component ass...

Hermetic optical component package having organic portion and inorg...

Connection arrangement, component carrier and method of forming a c...

Method for making contact with a component embedded in a printed ci...

Component carrier with embedded semiconductor component and embedde...

Component carrier and method of manufacturing the same

Component carrier with integrated antenna structure

Method for producing a printed circuit board structure

Component carrier with a stepped cavity and a stepped component ass...

Component carrier comprising at least one heat pipe and method for...

Inductor made of component carrier material comprising electrically...

Layer stack of component carrier material with embedded components...

Method of embedding a component in a printed circuit board

Component carrier comprising at least one heat pipe and method for...

Methods of manufacturing flexible printed circuit boards

Method for producing a circuit board element

Conductor track with enlargement-free transition between conductor...

Efficient heat removal from component carrier with embedded diode

Method for the production of an electronic module having an electro...

Circuit board structure

Method for making contact with a component embedded in a printed ci...

Printed circuit board

Printed circuit board consisting of at least two printed circuit bo...

Semi-finished product for the production of a printed circuit board...

Printed circuit board comprising an electronic component integrated...

Method for producing a printed circuit board consisting of at least...

Patents Applicationslast 30 patents

Component Carrier With Surface-Contactable Component Embedded in La...

MONITORING UNIT COMPRISING AN INTEGRATED MAGNETIC FIELD SENSOR

Electronic Package Comprising a Decoupling Layer Structure

Component Carrier With Electronic Components and Thermally Conducti...

Component Carrier With Embedded Magnetic Inlay and Integrated Coil...

Inductor Inlay for a Component Carrier and a Method of Manufacturin...

Method for Making Contact with a Component Embedded in a Printed Ci...

Component Carrier With Embedded Semiconductor Component and Embedde...

Component Carrier With Magnetic Element, Magnetic Inlay, and Manufa...

Component Carrier-Based Device With Antenna Coupling of Electronic...

Component Carrier With a Stepped Cavity and a Stepped Component Ass...

Component Carrier With Embedded Magnetic Inlay and Integrated Coil...

Component Carrier and Method of Manufacturing the Same

Connection Arrangement, Component Carrier and Method of Forming a C...

Component Carrier and Method of Manufacturing the Same

Inductor Made of Component Carrier Material Comprising Electrically...

Component Carrier With Surface-Contactable Component Embedded in La...

Hermetic Optical Component Package Having Organic Portion and Inorg...

Method for Embedding a Component in a Printed Circuit Board

Component Carrier With Embedded Semiconductor Component and Embedde...

Component Carrier Comprising at Least One Heat Pipe and Method for...

Methods of Manufacturing Flexible Electronic Devices

Component Carrier With a Stepped Cavity and a Stepped Component Ass...

Conductor Track With Enlargement-Free Transition Between Conductor...

Layer Stack of Component Carrier Material With Embedded Components...

Method for the Production of an Electronic Module Having an Electro...

Circuit Board Structure

Method for Making Contact with a Component Embedded in a Printed Ci...

Component Carrier With Integrated Antenna Structure

USE OF NONSTICK MATERIAL FOR THE PRODUCTION OF CAVITIES IN A PRINTE...